Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-10622232-B2
Application number	US-201816010426-A
Country	US
Kind code	B2
Filing date	Jun 16, 2018
Priority date	Aug 23, 2017
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

A semiconductor manufacturing apparatus and a method of manufacturing semiconductor device are provided. The semiconductor manufacturing apparatus includes a loading unit configured to load a wafer having a first surface to which a die attach film is attached through an ultraviolet sensitive layer, an ultraviolet light source configured to irradiate ultraviolet light onto the first surface of the wafer attached to the die attach film to weaken adhesive strength of the ultraviolet sensitive layer, and a camera configured to generate a wafer image by capturing ultraviolet light transmitted through a second surface of the wafer opposite to the first surface of the wafer.

First claim

What is claimed is:

1. A semiconductor manufacturing apparatus, comprising:
a loading unit configured to load a wafer having a first surface to which a die attach film is attached through an ultraviolet sensitive layer;
an ultraviolet light source configured to irradiate ultraviolet light onto the first surface of the wafer attached to the die attach film; and
a camera configured to generate a wafer image by capturing ultraviolet light transmitted through a second surface of the wafer opposite to the first surface of the wafer,
wherein the camera is configured to generate a first wafer image with a first exposure time, and generate a second wafer image with a second exposure time longer than the first exposure time.

2. The semiconductor manufacturing apparatus of claim 1 , further comprising an image processing unit configured to process the wafer image generated by the camera.

3. The semiconductor manufacturing apparatus of claim 2 , wherein the wafer includes a plurality of semiconductor devices and a scribe region for separating the plurality of semiconductor devices, and
the image processing unit is configured to determine whether a defect exists in the plurality of semiconductor devices from the wafer image.

4. The semiconductor manufacturing apparatus of claim 3 , wherein the image processing unit is configured to receive map data regarding whether a defect exists in the plurality of semiconductor devices, and
update the map data according to whether a defect is formed in the plurality of semiconductor devices.

5. The semiconductor manufacturing apparatus of claim 2 , wherein the image processing unit is configured to synthesize the first wafer image and the second wafer image to generate a third wafer image, and
determine whether a defect exists in a plurality of semiconductor devices based on the third wafer image.

6. The semiconductor manufacturing apparatus of claim 2 , wherein the image processing unit is configured to select one of the first wafer image and the second wafer image, and
determine whether a defect exists in a plurality of semiconductor devices based on the selected wafer image.

7. The semiconductor manufacturing apparatus of claim 2 , wherein the ultraviolet light source has a rectangular shape including a relatively long side extending along a first direction and a relatively short side extending along a second direction perpendicular to the first direction.

8. The semiconductor manufacturing apparatus of claim 7 , wherein the camera is configured to generate a first wafer image when the ultraviolet light source is disposed to irradiate the ultraviolet light at a first position, and
generate a second wafer image when the ultraviolet light source is disposed at a second position to which the ultraviolet light source has moved in the second direction.

9. The semiconductor manufacturing apparatus of claim 8 , wherein the image processing unit is configured to synthesize the first wafer image and the second wafer image to generate a third wafer image.

10. A semiconductor manufacturing apparatus, comprising:
an ultraviolet light source configured to irradiate ultraviolet light onto a first surface of a wafer on which a plurality of semiconductor devices separated by a scribe region are formed and to which a die attach film is attached through an ultraviolet sensitive layer;
a camera configured to generate a wafer image by capturing an image formed by ultraviolet light transmitted through a second surface of the wafer opposite to the first surface of the wafer; and
an image processing unit configured to receive the wafer image and determine whether a defect exists in the plurality of semiconductor devices from the wafer image,
wherein the wafer includes a plurality of regions arranged side by side in one direction to divide the second surface of the wafer, the plurality of regions include a first region and a second region adjacent to each other,
the ultraviolet light source is configured to irradiate the ultraviolet light onto the first region, and then move and irradiate the ultraviolet light onto the second region, and
the image processing unit is configured to generate a wafer image synthesized from a wafer image for the first region and a wafer image for the second region.

11. The semiconductor manufacturing apparatus of claim 10 , wherein the image processing unit is configured to store map data regarding whether a defect exists in the plurality of semiconductor devices, and
update the map data according to whether a defect is formed in the plurality of semiconductor devices.

12. The semiconductor manufacturing apparatus of claim 10 , wherein the camera is configured to generate a first wafer image with a first exposure time, and
generate a second wafer image with a second exposure time longer than the first exposure time.

13. A method of manufacturing a semiconductor device, comprising:
providing a wafer on which a plurality of semiconductor devices are separated by a scribe region;
attaching a die attach film having an ultraviolet sensitive layer to a first surface of the wafer and loading the wafer on a loading unit;
irradiating ultraviolet light onto the first surface of the wafer to cure the ultraviolet sensitive layer;
obtaining an image of the wafer by capturing ultraviolet light transmitted through a second surface of the wafer opposite to the first surface of the wafer;
wherein the obtaining the image of the wafer includes generating a first wafer image with a first exposure time, and generating a second wafer image with a second exposure time longer than the first exposure time.

14. The semiconductor manufacturing method of claim 13 , wherein providing the wafer comprises:
irradiating a laser beam onto the wafer along the scribe region; and
grinding the second surface of the wafer.

15. The semiconductor manufacturing method of claim 13 , further comprising determining whether a defect exists in the plurality of semiconductor devices from the wafer image.

16. The semiconductor manufacturing method of claim 15 , further comprising receiving map data indicating whether a defect exists in the plurality of semiconductor devices, and
updating the map data according to whether a defect is formed in the plurality of semiconductor devices.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ha Kyung Ho

Classifications

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K2101/40

  Semiconductor devices · CPC title

• G06T2207/10144

  Varying exposure · CPC title

• B24B37/0053

  detecting loss or breakage of a workpiece during lapping · CPC title