Ion implant plasma flood gun performance by using trace in situ cleaning gas in sputtering gas mixture
US-2018337020-A1 · Nov 22, 2018 · US
US10622192B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10622192-B2 |
| Application number | US-201816192416-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 15, 2018 |
| Priority date | Dec 15, 2017 |
| Publication date | Apr 14, 2020 |
| Grant date | Apr 14, 2020 |
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A gas supply assembly is described for delivery of gas to a plasma flood gun which includes an inert gas and a fluorine-containing gas, wherein the assembly is configured to deliver a volume of the fluorine-containing gas to the flood gun that is not greater than 10% of a total volume of the fluorine-containing and inert gasses. The fluorine-containing gas can generate volatile reaction product gases from material deposits in the plasma flood gun, and to effect re-metallization of a plasma generation filament in the plasma flood gun. In combination with the gas amounts, the assembly and methods can use gas flow rates to optimize the cleaning effect and reduce filament material loss from the plasma flood gun during use.
Opening claim text (preview).
What is claimed is: 1. A gas supply assembly for delivery of gas to a plasma flood gun (PFG), comprising: a fluid supply package configured to deliver inert gas to a PFG for generating inert gas plasma including electrons for modulating surface charge of a substrate in ion implantation operation; and a fluorine-containing gas in mixture with the inert gas, or in a separate gas supply package configured to deliver the fluorine-containing gas concurrently or sequentially with respect to delivery of inert gas to the PFG, wherein the assembly is configured to deliver a volume of the fluorine-containing gas that is not greater than 10% of a total volume of the fluorine-containing and inert gasses. 2. The gas supply assembly of claim 1 configured to deliver a volume of the fluorine-containing gas in the range of 0.5 to 5% of the total volume of the fluorine-containing and inert gasses. 3. The gas supply assembly of claim 2 configured to deliver a volume of the fluorine-containing gas in the range of 0.75 to 4% of the total volume of the fluorine-containing and inert gasses. 4. The gas supply assembly of claim 3 configured to deliver a volume of the fluorine-containing gas in the range of 1 to 3% of the total volume of the fluorine-containing and inert gasses. 5. The gas supply assembly of claim 4 configured to deliver a volume of the fluorine-containing gas in the range of 1.5 to 2.5% of the total volume of the fluorine-containing and inert gasses. 6. The gas supply assembly of claim 1 , wherein the fluorine-containing gas is selected from the group consisting of F 2 , HF, SiF 4 , GeF 4 , PF 3 , PF 5 , BF 3 , B2F 4 , NF 3 , N 2 F 4 , N 2 F 2 , SF 6 , MoF 6 , WF 6 , CF 4 ; COF 2 , C 2 F 4 H 2 , and C x O z H y F w , wherein w, x, y, and z are each independently of zero or non-zero stoichiometrically appropriate value. 7. The gas supply assembly of any of the previous claims wherein the fluorine-containing gas is a nitrogen- or tungsten-containing gas. 8. The gas supply assembly of claim 1 , wherein the fluorine-containing gas is in a separate fluorine-containing gas supply package, and the assembly further comprises flow circuitry configured to receive fluorine-containing gas from the fluorine-containing gas supply package and inert gas from the inert gas fluid supply package, for mixing thereof to form a mixture of inert gas and fluorine-containing gas for dispensing to the plasma flood gun. 9. The gas supply assembly of claim 8 , wherein the flow circuitry comprises (i) a mixing chamber arranged to receive the fluorine-containing gas and the inert gas from their respective fluid supply packages, for mixing thereof to form the mixture of fluorine-containing gas and inert gas for dispensing to the PFG, or (ii) valving configured to selectively enable mixing of the fluorine-containing gas and the inert gas in the mixing chamber, and alternatively to selectively enable the fluorine-containing gas and the inert gas to be flowed separately to the PFG. 10. The gas supply assembly of claim 8 , further comprising a processor configured to control dispensing of fluorine-containing gas from the fluorine-containing gas supply package and dispensing of inert gas from the inert gas supply package. 11. The gas supply assembly of claim 1 , wherein the fluorine-containing gas is effective to generate volatile reaction product gases from material deposits in the plasma flood gun, to effect re-metallization of a plasma generation filament in the plasma flood gun, or both. 12. A method of improving plasma flood gun (PFG) performance comprising introducing a fluorine-containing gas into a PFG, the PFG comprising a filament, and introducing an inert gas into the PFG, wherein the fluorine-containing gas introduced is not greater than 10% of a total volume of the fluorine-containing and inert gasses that are introduced. 13. The method of claim 12 , wherein the inert gas is introduced into the PFG at a flow rate of 3 standard cubic centimeters per minute (SSCM) or less. 14. The method of claim 12 , wherein the fluorine-containing and inert gasses are introduced so there is (i) a volume of the fluorine-containing gas in the range of 0.1% to 10% of the total volume of the fluorine-containing and inert gasses; or (ii) a molar ratio (a:b) of (a) fluorine of the fluorine gas to (b) inert gas, in the range of 1:9 to 1:999. 15. The method of claim 12 , wherein the PFG is operated under one or more of the following conditions: an arc voltage in the range of 0 to 90volts; an arc current in the range of 0 to 10 amperes, an extraction voltage in the range of 0 to 30 kilovolts, a suppression voltage in the range of 0 to 5 kilovolts. 16. The method of claim 12 , wherein during a period of operating the PFG a current is run through the filament while introducing the fluorine-containing gas and introducing the inert gas, and the filament has a weight loss that is less than weight loss of a filament over the same period and operating conditions, but without introducing the fluorine-containing gas. 17. The method of claim 12 , wherein any weight loss is reduced by more than 25% compared to weight loss of a filament over the same period and operating conditions. 18. The gas supply assembly of claim 1 , wherein the fluid supply package is an internally pressure-regulated gas supply vessel or adsorbent-based gas supply vessel.
Gas control, e.g. control of the gas flow · CPC title
Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube · CPC title
for ion implantation · CPC title
Means for avoiding or neutralising unwanted electrical charges on tube components · CPC title
Ion implantation · CPC title
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