Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US10620534B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10620534-B2 |
| Application number | US-201816104182-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 17, 2018 |
| Priority date | Mar 31, 2006 |
| Publication date | Apr 14, 2020 |
| Grant date | Apr 14, 2020 |
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An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).
Opening claim text (preview).
The invention claimed is: 1. A radiation-sensitive resin composition comprising: a fluorine-containing polymer consisting of: at least one first repeating unit represented by formula (1); and at least one second repeating unit represented by formula (2); an acid-unstable resin having an acid-unstable group, comprising a third repeating unit represented by formula (2); a radiation-sensitive acid generator; a nitrogen-containing compound; and a solvent, wherein: R 1 represents a hydrogen atom, a methyl group or a trifluoromethyl group; A represents a single bond, an oxygen atom, a sulfur atom, a carbonyloxy group, an oxycarbonyl group, an amide group, a sulfonylamide group, or a urethane group; and R 2 represents a linear or branched, partially or fully fluorinated alkyl group having 1 to 6 carbon atoms or a monovalent partially or fully fluorinated alicyclic hydrocarbon group having 4 to 20 carbon atoms, wherein: R 3 represents a hydrogen atom, a methyl group or a trifluoromethyl group; and each R 4 individually represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a derivative thereof, or a linear or branched alkyl group having 1 to 4 carbon atoms, and optionally two of R 4 s taken together represent a divalent alicyclic hydrocarbon group or a derivative thereof together with the carbon atom to which the two of R 4 s bond, wherein an amount of the third repeating unit in the acid-unstable resin is from 53.8 to 69.6 mol % with respect to an amount of all repeating units in the acid-unstable resin. 2. The radiation-sensitive resin composition according to claim 1 , wherein the acid-unstable resin further comprises a repeating unit comprising a lactone structure. 3. The radiation-sensitive resin composition according to claim 1 , wherein the radiation-sensitive acid generator comprises an onium ion, the onium ion comprising: a cation; and an anion represented by R 17 C n F 2n SO 3 − , an anion represented by R 17 SO 3 − , or both thereof, wherein R 17 represents a fluorine atom, a cycloalkyl group, or a bridge alicyclic hydrocarbon group, the cycloalkyl group and the bridge alicyclic hydrocarbon group having no more than 12 carbon atoms and optionally being substituted, and n is an integer of 1 to 10. 4. The radiation-sensitive resin composition according to claim 3 , wherein the anion is represented by R 17 C n F 2n SO 3 − . 5. The radiation-sensitive resin composition according to claim 3 , wherein R 17 is the bridge alicyclic hydrocarbon group. 6. The radiation-sensitive resin composition according to claim 3 , wherein the anion is represented by R 17 C n F 2n SO 3 − , and R 17 is the bridge alicyclic hydrocarbon group. 7. The radiation-sensitive resin composition according to claim 3 , wherein the cation is represented by formula (7-1), wherein R 14 represents a hydrogen atom, a fluorine atom, a hydroxyl group, a linear or branched alkyl group having 1 to 10 carbon atoms, a linear or branched alkoxyl group having 1 to 10 carbon atoms, or a linear or branched alkoxycarbonyl group having 2 to 11 carbon atoms; R 15 represents a linear or branched alkyl group having 1 to 10 carbon atoms, or an alkoxyl group; R 16 individually represents a linear or branched alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted phenyl group, or a substituted or unsubstituted naphthyl group, or two R 16 s taken together represent a substituted or unsubstituted divalent group which comprises 2 to 10 carbon atoms; k is an integer of 0 to 2; and r is an integer of 0 to 10. 8. The radiation-sensitive resin composition according to claim 7 , wherein R 16 individually represents a substituted or unsubstituted phenyl group or a substituted or unsubstituted naphthyl group. 9. The radiation-sensitive resin composition according to claim 1 , wherein an amount of the radiation-sensitive acid generator is from 0.5 to 10 parts by weight based on 100 parts by weight of a total of the fluorine-containing polymer and the acid-unstable resin. 10. The radiation-sensitive resin composition according to claim 1 , wherein a content of the fluorine-containing polymer in the radiation-sensitive resin composition is 0.1% or more by weight based on 100% by weight of the radiation-sensitive resin composition. 11. The radiation-sensitive resin composition according to claim 1 , wherein a content of the fluorine-containing polymer in the radiation-sensitive resin composition is from 0.5% to 35% by weight based on 100% by weight of the radiation-sensitive resin composition. 12. The radiation-sensitive resin composition according to claim 1 , wherein the fluorine-containing polymer has a weight average molecular weight determined by gel permeation chromatography in a range from 1,000 to 50,000. 13. The radiation-sensitive resin composition according to claim 1 , wherein the nitrogen-containing compound comprises at least one of an amine compound, an amide group-containing compound, a urea compound, or a nitrogen-containing heterocyclic compound. 14. The radiation-sensitive resin composition according to claim 1 , wherein an amount of the radiation-sensitive acid generator is from 7 to 9.5 parts by weight based on 100 parts by weight of the acid-unstable resin.
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
containing perhaloalkyl radicals · CPC title
the macromolecular compound having an alicyclic moiety in a side chain · CPC title
Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title
Treatment after imagewise removal, e.g. baking · CPC title
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