Heat storage molded body, heat storage laminate, and heat storage molded body production method

US10619942B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10619942-B2
Application numberUS-201715831627-A
CountryUS
Kind codeB2
Filing dateDec 5, 2017
Priority dateJun 23, 2015
Publication dateApr 14, 2020
Grant dateApr 14, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein an absorbed amount of the non-phthalate plasticizer per 100 parts by mass of the heat storage medium when the non-phthalate plasticizer is mixed with the heat storage medium as measured in accordance with JIS K5101-13-1 is 150 parts by mass or less.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat storage molded body, comprising: a resin matrix: and a heat storage medium dispersed in the resin matrix, wherein the resin matrix comprises a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, wherein the non-phthalate plasticizer has absorbability defined as an absorbed amount, wherein the absorbed amount is an amount of the non-phthalate plasticizer absorbed in the heat storage medium when the non-phthalate plasticizer is added dropwise and kneaded with the heat storage medium until the non-phthalate plasticizer and the heat storage medium are completely kneaded to form a smooth paste, and wherein the absorbed amount is 150 parts by weight per 100 parts by mass of the heat storage medium. 2. The heat storage molded body according to claim 1 , wherein the heat storage medium is heat storage particles containing a latent heat storage material encapsulated therein, and wherein the latent heat storage material shows a solid/liquid phase transition in a temperature range of −20° C. to 120° C. 3. The heat storage molded body according to claim 1 , wherein the non-phthalate plasticizer has a gelation end point temperature of 150° C. or less. 4. The heat storage molded body according to claim 1 , wherein the heat storage molded body is molded at a molded body temperature of 150° C. or less. 5. The heat storage molded body according to claim 1 , wherein the content of the heat storage medium in the heat storage molded body is from 10 to 80 mass %. 6. The heat storage molded body according to claim 1 , wherein the heat storage molded body has a sheet shape. 7. A heat storage laminate comprising at least one of a heat diffusion layer and a heat insulation layer laminated on the heat storage molded body according to claim 1 . 8. A heat storage laminate comprising a layer laminated on the heat storage molded body according to claim 1 , wherein the layer comprises a flame retardant. 9. The heat storage molded body according to claim 1 , wherein the non-phthalate plasticizer is selected from the group consisting of an epoxy plasticizer, a polyester plasticizer, a trimellitate plasticizer, and a benzoate plasticizer. 10. The heat storage molded body according to claim 2 , wherein the heat storage particles each comprises an acrylic outer shell or a melamine outer shell. 11. The heat storage laminate according to claim 8 , wherein the flame retardant is selected from the group consisting of a metal hydroxide, a base compound, and a glass fiber.

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What does patent US10619942B2 cover?
A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein an absorbed amount of the non-phthalate plasticizer per 100 parts by mass of the heat storage medium when the non-phthalate plasticizer is mixed with the heat storage medium as m…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification C09K5/063. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).