Laser sintering system and method for forming high purity, low roughness silica glass
US-9422187-B1 · Aug 23, 2016 · US
US10619926B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10619926-B2 |
| Application number | US-201715725909-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 5, 2017 |
| Priority date | Oct 7, 2016 |
| Publication date | Apr 14, 2020 |
| Grant date | Apr 14, 2020 |
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A method for processing material includes sintering a portion of a sheet of material at a location on the sheet, moving the sintering location along the sheet of material at a first rate, and pulling the sintered material away from the sintering location at a second rate that is greater than the first rate.
Opening claim text (preview).
What is claimed is: 1. A method for processing material, comprising: sintering a portion of a sheet of material at a location on the sheet; moving the sintering location along the sheet of material at a first rate; and pulling the sintered material away from the sintering location at a second rate that is greater than the first rate. 2. The process of claim 1 , wherein the sintering, moving, and pulling steps occur concurrently along a manufacturing line. 3. The process of claim 1 , wherein the sintering location extends in a first direction across the sheet of material and the pulling is in a second direction generally orthogonal to the first direction. 4. The process of claim 1 , wherein the sheet of material comprises silica soot, wherein in the sheet of material prior to the sintering has a thickness that is at least 100 μm, and wherein the sintered material, after the pulling, has a thickness less than 50 μm. 5. The process of claim 1 , wherein the sheet of material prior to the sintering is at least 20% porous by volume, while the sintered material is at least 95% fully densified. 6. The process of claim 1 , wherein porosity of the sheet of material is decreased in terms of volume percentage by at least 20% as the material is sintered at the sintering location. 7. A line for manufacturing sintered material, comprising: a sheet of material advancing along the line; a sintering location on the line where a portion of the sheet of material is sintered, wherein the sheet of material, prior to passing through the sintering location, is advancing along the line at a first rate; and a sintered portion extending along the line from the sintering location, wherein the sintered portion is advancing along the line at a second rate that is greater than the first rate. 8. The line of claim 7 , wherein the sintering location extends across the sheet of material, orthogonal to the direction that the sheet of material is advancing. 9. The line of claim 7 , wherein the sheet of material is partially sintered prior to passing through the sintering location. 10. The line of claim 9 , wherein the sheet of material is at least 20% porous by volume prior to passing through the sintering location. 11. The line of claim 10 , wherein, after passing through the sintering location, the sintered portion is at least 95% fully densified. 12. The line of claim 10 , wherein porosity of the sheet of material is decreased in terms of volume percentage at least 20% after passing through the sintering location. 13. The line of claim 7 , wherein the sheet of material comprises silica soot. 14. The line of claim 13 , wherein the sintered portion comprises 99.99 wt % pure fused silica. 15. The line of claim 7 , further comprising a laser that heats the sintering location. 16. The line of claim 7 , wherein prior to passing through the sintering location the sheet of material has a thickness that is at least 100 μm, and wherein the sintered material has a thickness less than 50 μm after passing through the sintering location.
Heating or cooling · CPC title
Open or uncovered sintering apparatus; Other heat-treatment apparatus of like construction · CPC title
Improving the yield, e-g- reduction of reject rates · CPC title
by sintering, {e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction} · CPC title
Laser treatment (working by laser beam B23K26/00) · CPC title
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