Catalyst ink for three-dimensional conductive constructs

US10619059B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10619059-B1
Application numberUS-201916447277-A
CountryUS
Kind codeB1
Filing dateJun 20, 2019
Priority dateJun 20, 2019
Publication dateApr 14, 2020
Grant dateApr 14, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.

First claim

Opening claim text (preview).

We claim: 1. A method of forming a three-dimensional construct comprising i. preparing a catalyst ink comprising a colloidal solution comprising a solvent and palladium nanoparticles; and ii. depositing the catalyst ink from step (i) onto a surface of a substrate using aerosol jet printing; iii. subjecting the substrate to electro-less plating to plate the palladium nanoparticles with copper; and iv. repeating steps ii and iii until the three-dimensional construct is formed. 2. The method of claim 1 further comprising sonicating solvent in step i to disperse the palladium nanoparticles and to reduce aggregation of the palladium nanoparticles. 3. The method of claim 1 wherein the solvent is selected from toluene, dimethylformamide, tetrahydrofuran, xylenes, and combinations thereof. 4. The method of claim 1 wherein the catalyst ink further comprises a binder selected from poly-vinyl alcohol and carboxy-methyl cellulose or combinations thereof. 5. The method of claim 1 wherein the palladium nanoparticles have an average particle size of from about 15 to about 400 nm. 6. The method of claim 1 wherein the palladium nanoparticles are present in the solution in an amount of from 0.1 to 2.2 wt. % based on total weight of the solution. 7. The method of claim 1 wherein the substrate is selected from glass, plastic, ceramic, or metal. 8. The method of claim 1 further comprising v. applying a non-conductive layer prior to or after repeating steps ii and iii. 9. The method of claim 1 wherein the palladium nanoparticles have an average particle size of from about 15 to about 100 nm. 10. The method of claim 1 wherein the palladium nanoparticles have an average particle size of from about 200 to about 400 nm. 11. A method of forming a three-dimensional construct comprising i. preparing a catalyst ink comprising a colloidal solution comprising palladium nanoparticles and a solvent selected from toluene, dimethylformamide, tetrahydrofuran, xylenes, and combinations thereof; ii. sonicating the catalyst ink to disperse the palladium nanoparticles and to reduce aggregation of the palladium nanoparticles; iii. depositing the catalyst ink from step (ii) onto a surface of a substrate using aerosol jet printing; iv. subjecting the substrate to electro-less copper plating to plate the palladium nanoparticles with copper; and v. repeating steps iii and iv until the three-dimensional construct is formed. 12. The method of claim 11 wherein the palladium nanoparticles have an average particle size of from about 15 to about 400 nm. 13. The method of claim 11 wherein the palladium nanoparticles are present in the solution in an amount of from 0.1 to 2.2 wt. % based on total weight of the solution. 14. The method of claim 11 wherein the catalyst ink further comprises a binder selected from poly-vinyl alcohol and carboxy-methyl cellulose or combinations thereof. 15. The method of claim 11 wherein the substrate is selected from glass, plastic, ceramic, or metal. 16. The method of claim 11 further comprising vi. applying a non-conductive layer prior to or after repeating steps iii and iv. 17. The method of claim 11 wherein the palladium nanoparticles have an average particle size of from about 15 to about 100 nm. 18. The method of claim 11 wherein the palladium nanoparticles have an average particle size of from about 200 to about 400 nm.

Assignees

Inventors

Classifications

  • C23C18/38Primary

    Coating with copper · CPC title

  • only one step pretreatment · CPC title

  • Use of metal, e.g. activation, sensitisation with noble metals · CPC title

  • Use of metal, e.g. activation, sensitisation with noble metals · CPC title

  • from pretreatment step, i.e. selective pre-treatment · CPC title

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What does patent US10619059B1 cover?
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The …
Who is the assignee on this patent?
Science Appl Int Corp
What technology area does this patent fall under?
Primary CPC classification C23C18/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).