Method for producing a hydrophobic heat-insulating molded body

US10618849B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10618849-B2
Application numberUS-201515501370-A
CountryUS
Kind codeB2
Filing dateJul 27, 2015
Priority dateAug 8, 2014
Publication dateApr 14, 2020
Grant dateApr 14, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the hydrophobizing agent with formation of the hydrophobic thermal-insulation moulding, where a) the density of the hydrophobic thermal-insulation moulding after the press process and after the reaction with the hydrophobizing agent is from 100 to 250 kg/m 3 , and b) the density of the hydrophilic thermal-insulation moulding on contact with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation moulding.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for producing a hydrophobic thermal-insulation molding, comprising: contacting a hydrophilic thermal-insulation molding with a hydrophobizing agent in the form of vapor, thereby forming a thermal-insulation molding coated with the hydrophobizing agent; pressing the thermal-insulation molding coated with the hydrophobizing agent; and during and/or after the pressing, heating the thermal-insulation molding coated with the hydrophobizing agent, thereby forming the hydrophobic thermal-insulation moulding molding, wherein the hydrophilic thermal-insulation molding comprises a thermal-insulation mixture comprising a fine-particle silica, IR opacifier and fiber material, the contacting, the pressing, and the heating take place between two gas-permeable moving belts of a press, a density of the hydrophobic thermal-insulation molding the heating is from 100 to 250 kg/m 3 , and a density of the hydrophilic thermal-insulation molding contacted with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation molding. 2. The process according to claim 1 , wherein in the contacting, a contact temperature T contact is from −30° C. to 150° C. 3. The process according to claim 1 , wherein in the heating, a reaction temperature T reaction is from 50° C. to 500° C. 4. The process according to claim 1 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 5. The process according to claim 1 , wherein the contacting and the heating take place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, and p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 6. The process according to claim 1 , wherein the fine-particle silica is a fumed silica. 7. The process according to claim 1 , wherein a proportion of the fine-particle silica, based on the thermal-insulation mixture, is from 70 to 95% by weight. 8. The process according to claim 1 , wherein a proportion of the IR opacifier, based on the thermal-insulation mixture, is from 2 to 20% by weight. 9. The process according to claim 1 , wherein a proportion of the fiber material, based on the thermal-insulation mixture, is from 3 to 10% by weight. 10. The process according to claim 1 , wherein the hydrophobizing agent is at least one organosilicon compound selected from the group consisting of R n —Si—X 4-n and R 3 Si—Y—SiR 3 , wherein n=from 1 to 3; R═—CH 3 or —C 2 H 5 ; X═—Cl, —Br, —OCH 3 , —OC 2 H 5 , or —OC 3 H 8 ; and Y═NH or O. 11. The process according to claim 1 , wherein a proportion of the hydrophobizing agent, based on the hydrophilic thermal-insulation molding, is from 0.5 to 10% by weight. 12. The process according to claim 1 , which is carried out continuously. 13. The process according to claim 2 , wherein in the heating, a reaction temperature T reaction is from 50° C. to 500° C. 14. The process according to claim 2 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 15. The process according to claim 3 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 16. The process according to claim 2 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 17. The process according to claim 3 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 18. The process according to claim 13 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 19. The process according to claim 2 , wherein the fine-particle silica is a fumed silica. 20. The process according to claim 3 , wherein the fine-particle silica is a fumed silica.

Assignees

Inventors

Classifications

  • Fire resistance, i.e. materials resistant to accidental fires or high temperatures · CPC title

  • Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title

  • on material in moulds or on moulding surfaces moving continuously underneath or between the rollers, e.g. on an endless belt · CPC title

  • Artificial stone not provided for in other groups of this subclass · CPC title

  • C04B35/82Primary

    Asbestos; Glass; Fused silica · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10618849B2 cover?
Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the h…
Who is the assignee on this patent?
Evonik Operations Gmbh
What technology area does this patent fall under?
Primary CPC classification C04B35/82. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).