High temperature fiber and method of making
US-2024368041-A1 · Nov 7, 2024 · US
US10618849B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10618849-B2 |
| Application number | US-201515501370-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2015 |
| Priority date | Aug 8, 2014 |
| Publication date | Apr 14, 2020 |
| Grant date | Apr 14, 2020 |
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Process for the production of a hydrophobic thermal-insulation moulding, where a hydrophilic thermal-insulation moulding is brought into contact with a hydrophobizing agent in vapour form with formation of a thermal-insulation moulding coated with hydrophobizing agent, and this is then subjected to a press process and during the press process and/or after the press process is reacted with the hydrophobizing agent with formation of the hydrophobic thermal-insulation moulding, where a) the density of the hydrophobic thermal-insulation moulding after the press process and after the reaction with the hydrophobizing agent is from 100 to 250 kg/m 3 , and b) the density of the hydrophilic thermal-insulation moulding on contact with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation moulding.
Opening claim text (preview).
The invention claimed is: 1. A process for producing a hydrophobic thermal-insulation molding, comprising: contacting a hydrophilic thermal-insulation molding with a hydrophobizing agent in the form of vapor, thereby forming a thermal-insulation molding coated with the hydrophobizing agent; pressing the thermal-insulation molding coated with the hydrophobizing agent; and during and/or after the pressing, heating the thermal-insulation molding coated with the hydrophobizing agent, thereby forming the hydrophobic thermal-insulation moulding molding, wherein the hydrophilic thermal-insulation molding comprises a thermal-insulation mixture comprising a fine-particle silica, IR opacifier and fiber material, the contacting, the pressing, and the heating take place between two gas-permeable moving belts of a press, a density of the hydrophobic thermal-insulation molding the heating is from 100 to 250 kg/m 3 , and a density of the hydrophilic thermal-insulation molding contacted with the hydrophobizing agent is from 50% to less than 100% of the density of the hydrophobic thermal-insulation molding. 2. The process according to claim 1 , wherein in the contacting, a contact temperature T contact is from −30° C. to 150° C. 3. The process according to claim 1 , wherein in the heating, a reaction temperature T reaction is from 50° C. to 500° C. 4. The process according to claim 1 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 5. The process according to claim 1 , wherein the contacting and the heating take place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, and p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 6. The process according to claim 1 , wherein the fine-particle silica is a fumed silica. 7. The process according to claim 1 , wherein a proportion of the fine-particle silica, based on the thermal-insulation mixture, is from 70 to 95% by weight. 8. The process according to claim 1 , wherein a proportion of the IR opacifier, based on the thermal-insulation mixture, is from 2 to 20% by weight. 9. The process according to claim 1 , wherein a proportion of the fiber material, based on the thermal-insulation mixture, is from 3 to 10% by weight. 10. The process according to claim 1 , wherein the hydrophobizing agent is at least one organosilicon compound selected from the group consisting of R n —Si—X 4-n and R 3 Si—Y—SiR 3 , wherein n=from 1 to 3; R═—CH 3 or —C 2 H 5 ; X═—Cl, —Br, —OCH 3 , —OC 2 H 5 , or —OC 3 H 8 ; and Y═NH or O. 11. The process according to claim 1 , wherein a proportion of the hydrophobizing agent, based on the hydrophilic thermal-insulation molding, is from 0.5 to 10% by weight. 12. The process according to claim 1 , which is carried out continuously. 13. The process according to claim 2 , wherein in the heating, a reaction temperature T reaction is from 50° C. to 500° C. 14. The process according to claim 2 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 15. The process according to claim 3 , wherein a contact time during the contacting and a heating time during the heating are in each case from 1 minute to 1 hour. 16. The process according to claim 2 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 17. The process according to claim 3 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 18. The process according to claim 13 , wherein the contacting and the heating takes place in a chamber, and wherein the hydrophobizing agent is introduced into the chamber until a pressure difference Δp is ≥20 mbar, wherein Δp=p 2 −p 1 , and p 1 =pressure in the chamber before the introduction of the hydrophobizing agent, p 2 =pressure in the chamber at which the introduction of the hydrophobizing agent is stopped. 19. The process according to claim 2 , wherein the fine-particle silica is a fumed silica. 20. The process according to claim 3 , wherein the fine-particle silica is a fumed silica.
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