Manufacturing method for structure and manufacturing method for liquid ejecting head

US10618286B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10618286-B2
Application numberUS-201615218263-A
CountryUS
Kind codeB2
Filing dateJul 25, 2016
Priority dateAug 5, 2015
Publication dateApr 14, 2020
Grant dateApr 14, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a structure such as a liquid ejecting head configured to cover an opening of a base with a covering member, the present invention alleviates the generation of a warp on the structure or the base even if the covering member is hardened and shrunk. The structure includes the base and the covering member attached onto the base. A manufacturing method for the structure includes: a first step of attaching the covering member having flexibility onto the base in such a manner as to cover an opening of the hole formed at the base and a second step of hardening the covering member attached onto the base. In the first step, the covering member is attached onto the base in a state in which a non-stuck portion of the covering member, covering the opening of the base, is slack.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method for a structure including: a base having a hole in the base; and a dry film attached onto the base, the manufacturing method comprising: a first step of attaching the dry film having flexibility onto the base in such a manner as to cover an opening of the hole; and a second step of hardening the dry film attached onto the base, wherein in the first step, the dry film is attached onto the base so that a closed space is formed inward of the hole, and an entire non-attached portion of the dry film covering the opening is slacked inward of the hole from the opening, and wherein the first step is performed in an environment of a lower pressure than in the second step. 2. The manufacturing method according to claim 1 , wherein: W ≤(1−α)× Li, wherein W represents a width of the opening; Li, a width of the entire non-attached portion of the dry film covering the opening in the first step; and α, a rate of shrinkage of the dry film hardened in the second step. 3. The manufacturing method according to claim 1 , wherein in the first step, the dry film is stacked on the base, before the non-attached portion covering the opening is pressed by a pressing member, so that the non-attached portion is pushed inward of the hole. 4. A manufacturing method for a liquid ejecting head including: a substrate provided with an ejection energy generating element for generating energy for ejecting liquid; a liquid supply port; a liquid chamber; a channel communicating with the liquid supply port; and an ejection port forming member having an ejection port communicating with the channel formed on the ejection port forming member, the manufacturing method comprising: a first step of attaching a dry film having flexibility onto the substrate in such a manner as to cover an opening of the liquid chamber; and a second step of hardening the dry film attached onto the substrate, wherein in the first step, the dry film is attached onto the substrate so that a closed space is formed inward of the liquid chamber, and an entire non-attached portion of the dry film covering the opening is slacked inward of the liquid chamber from the opening, and wherein the first step is performed in an environment of a lower pressure than in the second step. 5. The manufacturing method according to claim 4 , wherein: W ≤(1−α)× Li, wherein W represents a width of the opening; Li, a width of the entire non-attached portion of the dry film covering the opening in the first step; and α, rate of the shrinkage of the dry film hardened in the second step. 6. The manufacturing method according to claim 4 , further comprising exposing and developing the dry film attached onto the substrate in the second step so as to form, at a part of the dry film, a liquid inlet communicating with the liquid chamber. 7. The manufacturing method according to claim 6 , wherein a base film is attached onto the dry film for use in the first step, the base film being peeled off before the exposing and developing in the second step. 8. The manufacturing method according to claim 4 , wherein in the first step, the dry film is stacked on the substrate, before the non-attached portion covering the opening is pushed inward of the liquid chamber by a pressing member.

Assignees

Inventors

Classifications

  • Structure of the manifold · CPC title

  • Fluid pattern dispersing device making, e.g., ink jet · CPC title

  • with sealing means or the like (seals on envelopes used in tyre retreading B29D30/542; for injection moulding footwear B29D35/0045) · CPC title

  • dry etching · CPC title

  • Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement · CPC title

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What does patent US10618286B2 cover?
In a structure such as a liquid ejecting head configured to cover an opening of a base with a covering member, the present invention alleviates the generation of a warp on the structure or the base even if the covering member is hardened and shrunk. The structure includes the base and the covering member attached onto the base. A manufacturing method for the structure includes: a first step of …
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B41J2/1631. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).