Multi-part electronic device housing having contiguous filled surface

Patent metadata

Field	Value
Publication number	US-10617016-B2
Application number	US-201916297439-A
Country	US
Kind code	B2
Filing date	Mar 8, 2019
Priority date	Sep 30, 2015
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (μm) or less below an exposed surface of the first portion and an exposed surface of the second portion.

First claim

What is claimed is:

1. An electronic device comprising:
a display module;
a cover positioned over the display module; and
a housing comprising:
a first housing portion formed from a first metal material and coupled to the cover, the first housing portion defining a first portion of an exterior surface of the electronic device and an opening;
a second housing portion formed from a second metal material and positioned within the opening, the second housing portion defining a second portion of the exterior surface of the electronic device; and
a non-conductive component formed from a non-metal material and positioned within a gap defined between the first housing portion and the second housing portion, the electronic device configured to transmit electromagnetic signals at least partially through the gap.

2. The electronic device of claim 1 , wherein:
the first housing portion defines at least a portion of a first sidewall of the housing;
the first housing portion defines at least a portion of a second sidewall of the housing; and
the second housing portion defines at least a portion of a third sidewall of the housing that extends between the first and second sidewalls.

3. The electronic device of claim 1 , wherein:
the non-conductive component includes a polymer material that is positioned at least partially within the gap;
the non-conductive component defines a third portion of the exterior surface of the electronic device; and
the first metal material and the second metal material are aluminum or stainless steel.

4. The electronic device of claim 1 , wherein:
the non-conductive component includes a polymer material that is adhered to the first metal material and the second metal material;
the non-conductive component defines a third portion of the exterior surface of the electronic device; and
the first metal material and the second metal material are aluminum or stainless steel.

5. The electronic device of claim 1 , wherein:
the non-conductive component comprises a first material that is positioned at least partially within the gap between the first and second housing portions;
the non-conductive component further comprises a second material that is different from the first material; and
the second material defines a third portion of the exterior surface of the electronic device.

6. The electronic device of claim 5 , wherein:
the first material is a polymer material; and
the second material is an ink that is positioned over the polymer material.

7. The electronic device of claim 6 , wherein:
the ink is a second ink;
the non-conductive component further comprises a first ink that is positioned over the polymer material; and
the second ink is positioned over the first ink.

8. The electronic device of claim 1 , wherein the non-conductive component includes a protrusion that is configured to maintain a uniform spacing between the first and second housing portions.

9. The electronic device of claim 1 , wherein:
the non-conductive component defines a third portion of the exterior surface of the electronic device; and
the third portion of the exterior surface is flush with respect to the first and second portions.

10. A housing for an electronic device comprising:
a first housing portion formed from a first metal material and defining an opening configured to receive a display module, the first housing portion defining a first portion of an exterior surface of the electronic device;
a second housing portion formed from a second metal material and defining a second portion of the exterior surface of the electronic device, the second housing portion offset from the first housing portion by a gap; and
a non-conductive component formed from a non-metal material and positioned at least partially within the gap defined between the first housing portion and the second housing portion, wherein:
the housing is configured to pass electromagnetic signals through the gap.

11. The housing of claim 10 , wherein:
the first housing portion further defines a second opening; and
the second housing portion is positioned within the second opening.

12. The housing of claim 11 , wherein:
the first housing portion defines at least a portion of a rear surface of the electronic device that is opposite to a front surface of the electronic device;
the first housing portion defines at least a first portion of a sidewall that extends between the front surface and the rear surface;
the second housing portion defines at least a second portion of the sidewall; and
the non-conductive component defines at least a third portion of the sidewall.

13. The housing of claim 12 , wherein:
the first housing portion defines a first portion of the rear surface;
the second housing portion defines a second portion of the rear surface; and
the non-conductive component defines a third portion of the rear surface.

14. The housing of claim 10 , wherein:
the non-conductive component includes a polymer that is positioned at least partially within the gap between the first and second housing portions; and
the polymer forms a seal between the first and second housing portions.

15. The housing of claim 14 , wherein:
the non-conductive component further comprises at least one ink layer disposed over the polymer; and
the at least one ink layer defines a third portion of the exterior surface of the electronic device.

16. An electronic device comprising:
a cover defining at least a portion of a front external surface of the electronic device;
a display module positioned below the cover;
a first housing portion formed from a first conductive material and defining at least a portion of a rear external surface that is opposite to the front external surface and defining a first portion of an external sidewall that extends between the front and rear external surfaces;
a second housing portion formed from a second conductive material and defining a second portion of the external sidewall; and
a non-conductive component positioned at least partially within a gap between the first housing portion and the second housing portion and defining a third portion of the external sidewall, the non-conductive component configured to allow electromagnetic signals to be transmitted and received through the gap.

17. The electronic device of claim 16 , wherein:
the non-conductive component comprises a polymer material that is positioned at least partially within the gap between the first and second housing portions; and
the non-conductive component is bonded to the first and second housing portion.

18. The electronic device of claim 17 , wherein:
the non-conductive component further comprises at least one ink layer that defines the third portion of the external sidewall.

19. The electronic device of claim 16 , wherein the gap defines at least a portion of the rear external surface of the electronic device.

20. The electronic device of claim 17 , wherein the second housing portion defines at least a portion of the rear external surface of the electronic device.

Assignees

• Apple Inc

Inventors

• Shi Ming Kun
• Corbet Lindsay D
• Bruni Christopher
• Chan Collin D

Classifications

• H01Q1/22

  by structural association with other equipment or articles · CPC title

• H05K5/0217

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

• H05K5/062

  sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ · CPC title

• H01Q1/42 Primary

  Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title

• H05K5/0004 Primary

  Electricity · mapped topic