Brillouin gain spectral position control of claddings for tuning acousto-optic waveguides

Patent metadata

Field	Value
Publication number	US-10615563-B2
Application number	US-201916403205-A
Country	US
Kind code	B2
Filing date	May 3, 2019
Priority date	Jun 22, 2017
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A method of fabricating an acousto-optic waveguide that includes a waveguide cladding surrounding an optical core is disclosed. The method comprises providing a wafer substrate; depositing an initial amount of a first material over an upper surface of the wafer substrate to form a partial cladding layer; depositing a second material over the partial cladding layer to form an optical layer; removing portions of the second material of the optical layer to expose portions of the partial cladding layer and form an optical core comprising the remaining second material; and depositing an additional amount of the first material over the optical core and the exposed portions of the partial cladding layer to form a full cladding layer that surrounds the optical core. A relative concentration of components of the first material is adjusted to provide Brillouin gain spectral position control of the waveguide cladding to tune the acousto-optic waveguide.

First claim

What is claimed is:

1. A method of fabricating an acousto-optic waveguide that includes a waveguide cladding surrounding an optical core, the method comprising:
providing a wafer substrate having an upper surface;
depositing an initial amount of a first material over the upper surface of the wafer substrate to form a partial cladding layer;
depositing a second material over the partial cladding layer to form an optical layer;
removing portions of the second material of the optical layer to expose portions of the partial cladding layer and form an optical core structure comprising the remaining second material; and
depositing an additional amount of the first material over the optical core structure and the exposed portions of the partial cladding layer to form a full cladding layer that surrounds the optical core structure;
wherein a relative concentration of components of the first material is adjusted to provide Brillouin gain spectral position control of the waveguide cladding to tune the acousto-optic waveguide;
wherein the relative concentration of components of the first material is adjusted by selectively changing precursor gas flow rates during the deposition of the initial and additional amounts of the first material.

2. The method of claim 1 , wherein the first material comprises silicon oxynitride, silicon dioxide, silicon nitride, germanium oxide, zinc oxide, aluminum oxide, titanium dioxide, magnesium oxide, or combinations thereof.

3. The method of claim 1 , wherein the second material comprises silicon, silicon nitride, silicon oxynitride, silicon carbide, diamond, silicon germanium, germanium, gallium arsenide, gallium nitride, gallium phosphide, lithium niobate, or combinations thereof.

4. The method of claim 1 , wherein the first material and the second material are deposited using a process comprising plasma enhanced chemical vapor deposition (PECVD), high-density-plasma chemical vapor deposition (HDPCVD), low-pressure chemical vapor deposition (LPCVD), sputtering, or atomic layer deposition.

5. The method of claim 1 , wherein the portion of the second material is removed by a process comprising electron-beam lithography or a photolithography-based procedure.

6. The method of claim 1 , wherein the partial cladding layer is formed by depositing about 3 microns to about 20 microns of the first material.

7. The method of claim 1 , wherein the optical layer is formed by depositing about 40 nm to about 200 nm of the second material.

8. The method of claim 1 , wherein the full cladding layer is formed by depositing about 3 microns to about 20 microns of the additional amount of the first material.

9. The method of claim 1 , wherein the acousto-optic waveguide is fabricated as part of an integrated photonics chip.

10. The method of claim 9 , wherein the integrated photonics chip is implemented as part of a fiber optic gyroscope.

11. The method of claim 9 , wherein the integrated photonics chip is implemented as part of a Brillouin waveguide laser.

12. A method of fabricating an acousto-optic waveguide that includes a waveguide cladding surrounding an optical core, the method comprising:
providing a wafer substrate having an upper surface;
depositing an initial amount of a first material over the upper surface of the wafer substrate to form a partial cladding layer;
depositing a second material over the partial cladding layer to form an optical layer;
removing portions of the second material of the optical layer to expose portions of the partial cladding layer and form an optical core structure comprising the remaining second material; and
depositing an additional amount of the first material over the optical core structure and the exposed portions of the partial cladding layer to form a full cladding layer that surrounds the optical core structure;
wherein a relative concentration of components of the first material is adjusted to provide Brillouin gain spectral position control of the waveguide cladding to tune the acousto-optic waveguide;
wherein the relative concentration of components of the first material is adjusted by doping the initial and additional amounts of the first material using ion bombardment.

13. The method of claim 12 , wherein the first material comprises silicon oxynitride, silicon dioxide, silicon nitride, germanium oxide, zinc oxide, aluminum oxide, titanium dioxide, magnesium oxide, or combinations thereof.

14. The method of claim 12 , wherein the second material comprises silicon, silicon nitride, silicon oxynitride, silicon carbide, diamond, silicon germanium, germanium, gallium arsenide, gallium nitride, gallium phosphide, lithium niobate, or combinations thereof.

15. The method of claim 12 , wherein the first material and the second material are deposited using a process comprising plasma enhanced chemical vapor deposition (PECVD), high-density-plasma chemical vapor deposition (HDPCVD), low-pressure chemical vapor deposition (LPCVD), sputtering, or atomic layer deposition.

16. The method of claim 12 , wherein the partial cladding layer is formed by depositing about 3 microns to about 20 microns of the first material.

17. The method of claim 12 , wherein the optical layer is formed by depositing about 40 nm to about 200 nm of the second material.

18. The method of claim 12 , wherein the full cladding layer is formed by depositing about 3 microns to about 20 microns of the additional amount of the first material.

19. The method of claim 12 , wherein the acousto-optic waveguide is fabricated as part of an integrated photonics chip.

20. The method of claim 19 , wherein the integrated photonics chip is implemented as part of a Brillouin waveguide laser.

Assignees

• Honeywell Int Inc

Inventors

• Puckett Matthew Wade

Classifications

• G02F1/125 Primary

  in an optical waveguide structure · CPC title

• H01S3/083

  Ring lasers {(fibre ring lasers H01S3/06791)} · CPC title

• H01S3/1068 Primary

  using an acousto-optical device · CPC title

• G02F1/365

  in an optical waveguide structure (G02F1/377, {G02F1/395} take precedence) · CPC title

• H01S3/094026

  for synchronously pumping, e.g. for mode locking · CPC title