Light-emitting diodes in displays with direct-lit backlight units

Patent metadata

Field	Value
Publication number	US-10613389-B2
Application number	US-201916294727-A
Country	US
Kind code	B2
Filing date	Mar 6, 2019
Priority date	Mar 13, 2018
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

First claim

What is claimed is:

1. A display, comprising:
a plurality of pixels; and
a backlight configured to produce backlight illumination for the plurality of pixels, wherein the backlight comprises:
a printed circuit board;
a plurality of light-emitting diodes mounted on the printed circuit board, wherein each light-emitting diode has an associated rectangular-grid position and wherein each light-emitting diode is offset from its rectangular-grid position by a non-zero distance; and
at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes.

2. The display defined in claim 1 , wherein the plurality of light-emitting diodes are arranged in a plurality of groups that include more than one light-emitting diode and wherein each group of light-emitting diodes is rotated relative to its rectangular-grid position.

3. The display defined in claim 1 , wherein each light-emitting diode is offset from its rectangular-grid position at an angle that is ninety degrees different than an angle of offset of each neighboring light-emitting diode in the same row.

4. The display defined in claim 1 , wherein each light-emitting diode is offset from its rectangular-grid position at an angle that is ninety degrees different than an angle of offset of each neighboring light-emitting diode in the same column.

5. The display defined in claim 1 , wherein the backlight further comprises a thermally conductive layer that is attached to a lower surface of the printed circuit board with adhesive.

6. The display defined in claim 5 , wherein the adhesive includes a thermally conductive additive.

7. The display defined in claim 1 , wherein the backlight further comprises a radiative cooling coating on a lower surface of the printed circuit board.

8. A display, comprising:
a plurality of pixels; and
a backlight configured to produce backlight illumination for the plurality of pixels, wherein the backlight comprises:
a printed circuit board;
a radiative cooling coating on a lower surface of the printed circuit board;
light sources that are mounted on an upper surface of the printed circuit board, that are configured to emit light, and that are arranged in a plurality of respective cells;
at least one light spreading layer formed over the printed circuit board that spreads light received from the light sources; and
a color conversion layer formed over the at least one light spreading layer.

9. The display defined in claim 8 , wherein each respective cell includes four light-emitting diodes that each have a non-square rectangular shape.

10. The display defined in claim 9 , wherein the four light-emitting diodes in each respective cell include a first light-emitting diode in a first row and a first column, a second light-emitting diode in the first row and a second column, a third light-emitting diode in a second row and the first column, and a fourth light-emitting diode in the second row and the second column.

11. The display defined in claim 10 , wherein the first light-emitting diode is oriented at a ninety degree angle relative to the second and third light-emitting diodes, and wherein the second light-emitting diode is oriented at a ninety degree angle relative to the first and fourth light-emitting diodes.

12. The display defined in claim 8 , wherein each respective cell includes a first light-emitting diode having a first size and a second light-emitting diode having a second size that is different than the first size.

13. The display defined in claim 8 , wherein each respective cell includes a red light-emitting diode, a blue light-emitting diode, and a green light-emitting diode.

14. The display defined in claim 8 , wherein the radiative cooling coating includes metal particles that are embedded in a polymer sheet.

15. The display defined in claim 14 , wherein the metal particles emit infrared light.

16. The display defined in claim 8 , wherein the radiative cooling coating is attached to the lower surface of the printed circuit board with adhesive.

17. The display defined in claim 16 , wherein the adhesive includes a thermally conductive additive.

18. A method of forming a display with light-emitting diodes on a printed circuit board, the method comprising:
forming a layer of adhesive on a surface of the printed circuit board;
attaching light-emitting diodes that include solder to the printed circuit board using the layer of adhesive, wherein attaching the light-emitting diodes to the printed circuit board using the layer of adhesive comprises biasing the solder of the light-emitting diodes into contact with the layer of adhesive on the printed circuit board; and
reflowing the solder, wherein after reflowing the solder the solder mechanically and electrically connects the light-emitting diodes to the printed circuit board.

19. The method defined in claim 18 , wherein reflowing the solder causes the layer of adhesive on the surface of the printed circuit board to evaporate.

20. The method defined in claim 18 , wherein reflowing the solder removes the layer of adhesive from the surface of the printed circuit board.

Assignees

• Apple Inc

Inventors

• Liu Rong
• Kang Edward H
• Qi Jun
• Son Mookyung
• So Pee Khaim
• Yin Victor H
• Lv Wei
• Zhu Wenyong
• Luo Zhenyue
• Zhu Xinyu
• Han Ling
• Lin Hung Sheng

Classifications

• G02F1/133605 Primary

  including specially adapted reflectors · CPC title

• G02F1/133611 Primary

  including means for improving the brightness uniformity · CPC title

• G02F1/133606

  including a specially adapted diffusing, scattering or light controlling members · CPC title

• G02F1/133603 Primary

  with LEDs · CPC title

• G02F1/133609

  including means for improving the color mixing, e.g. white · CPC title