Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture

US10613283B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10613283-B2
Application numberUS-201816052184-A
CountryUS
Kind codeB2
Filing dateAug 1, 2018
Priority dateNov 9, 2016
Publication dateApr 7, 2020
Grant dateApr 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A coaxial wire structure comprising: a rigid dielectric base material; and a metal based interconnect structure extending through said rigid dielectric base material from a first side of the dielectric base material to an opposing second side of the rigid dielectric base material, wherein at least one metal line of the metal based interconnect structure that extends from the first side of the rigid dielectric base material to the second side of said rigid dielectric base material has at least one non-linear portion, the metal based interconnect structure being an assembly of a first metal interconnect layer and a second metal interconnect layer separated from each other by an electrically insulating layer. 2. The coaxial wire structure of claim 1 , wherein said at least one non-linear portion is a single arc extending continuously from a first side to a second side of the dielectric base material. 3. The coaxial wire structure of claim 1 , wherein said at least one non-linear portion comprises multiple arcs. 4. The coaxial wire structure of claim 1 , wherein said at least one non-linear portion comprises two linear portions intersecting at an angle. 5. The coaxial wire structure of claim 1 , wherein said electrically insulating layer comprises a dielectric comprised of an oxide, nitride or oxynitride material, or said electrically insulating layer comprises a polymer selected from the group consisting of parylene, organosiloxanes, epoxies, acrylates, urethanes, silicones, polyimide, poly(phenylene oxide), polyamide, polyester, PEEK, polyethelyene naphthalate, polyetherimide, fluoropolymers, and combinations thereof. 6. The coaxial wire structure of claim 1 , wherein the first metal interconnect layer is comprised of a metal selected from the group consisting of nickel, aluminum, copper, tantalum, titanium, platinum and combinations thereof. 7. The coaxial wire structure of claim 1 , wherein the second metal interconnect layer is comprised of a metal selected from the group consisting of nickel, aluminum, copper, tantalum, titanium, platinum and combinations thereof. 8. A structure including an optical fiber comprising: a rigid dielectric base material; and a polymeric optical fiber extending through said rigid dielectric base material from a first side of the rigid dielectric base material to an opposing second side of the rigid dielectric base material, wherein at least one polymeric optical fiber has at least one non-linear portion, the polymeric optical fiber and the rigid dielectric base material separated from each other by at least one metal cladding layer. 9. The structure of claim 8 , wherein said at least one non-linear portion comprises at least one curvature. 10. The structure of claim 8 , wherein said at least one non-linear portion comprises at least one angled portion. 11. The structure of claim 10 , wherein the optical fiber carries an optical signal, and the cladding layer carries an electrical signal. 12. The structure of claim 10 , wherein said polymer for said optical fiber comprises optical fiber comprises PMMA, polystyrene, silicone resin and combinations thereof. 13. The structure of claim 8 , wherein the at least one metal cladding layer is comprised of a metal selected from the group consisting of nickel, aluminum, copper, tantalum, titanium, platinum and combinations thereof. 14. The structure of claim 8 , wherein the polymeric optical fiber is formed using an additive forming method that is selected from the group consisting of stereolithography, self-propagating waveguide formation, fused deposition modeling (FDM), selective laser sintering (SLS), continuous liquid interface production (CLIP), digital light processing (DLP), material jetting and combinations thereof. 15. A coaxial wire structure comprising: a rigid dielectric base material; and a metal based interconnect structure extending through said rigid dielectric base material from a first side of the rigid dielectric base material to an opposing second side of the dielectric base material, wherein at least one metal line of the metal based interconnect structure that extends from the first side of the rigid dielectric base material to the second side of said dielectric base material has at least one non-linear portion that is a single arc extending continuously from a first side to a second side of the rigid dielectric base material, the metal based interconnect structure being an assembly of a first metal interconnect layer and a second metal interconnect layer separated from each other by an electrically insulating layer. 16. The coaxial wire structure of claim 15 , wherein said electrically insulating coating comprises a dielectric comprised of an oxide, nitride or oxynitride material, or said electrically insulating coating comprises a polymer selected from the group consisting of parylene, organosiloxanes, epoxies, acrylates, urethanes, silicones, polyimide, poly(phenylene oxide), polyamide, polyester, PEEK, polyethelyene naphthalate, polyetherimide, fluoropolymers, and combinations thereof. 17. The coaxial wire structure of claim 15 , wherein the first metal interconnect layer is comprised of a metal selected from the group consisting of nickel, aluminum, copper, tantalum, titanium, platinum and combinations thereof. 18. The coaxial wire structure of claim 15 , wherein the second metal interconnect layer is comprised of a metal selected from the group consisting of nickel, aluminum, copper, tantalum, titanium, platinum and combinations thereof. 19. The coaxial wire structure of claim 15 , wherein the metal based interconnect structure carries an electrical signal.

Assignees

Inventors

Classifications

  • Products made by additive manufacturing · CPC title

  • Processes of additive manufacturing · CPC title

  • Electrical aspects (G02B6/4263 and G02B6/4265 take precedence) · CPC title

  • Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

  • Co-axial cable · CPC title

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Frequently asked questions

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What does patent US10613283B2 cover?
The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encaps…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G02B6/4416. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).