Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
US10610928B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10610928-B2 |
| Application number | US-201615761528-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 27, 2016 |
| Priority date | Sep 30, 2015 |
| Publication date | Apr 7, 2020 |
| Grant date | Apr 7, 2020 |
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- Title
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Abstract
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A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
First claim
Opening claim text (preview).
The invention claimed is: 1. A powder for a conductive material, the powder comprising a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less, wherein the particles contain titanium on surfaces or inside thereof, a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less, the particles contain chlorine on surfaces or inside thereof, and a content of the chlorine is 0.05 atomic percent or more and 5 atomic percent or less. 2. The powder for a conductive material according to claim 1 , wherein the titanium is contained inside the particles. 3. An ink for a conductive material, the ink comprising: an aqueous dispersion medium; and the powder for a conductive material according to claim 1 , the powder being dispersed in the aqueous dispersion medium. 4. A conductive paste comprising: a polymer composition; and the powder for a conductive material according to claim 1 , the powder being contained in the polymer composition.
Assignees
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Classifications
Homopolymers or copolymers of methacrylic acid esters · CPC title
the conductive material comprising metals or alloys · CPC title
Cellulose acetate · CPC title
Copper · CPC title
Titanium, zirconium or hafnium · CPC title
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Frequently asked questions
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- What does patent US10610928B2 cover?
- A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or…
- Who is the assignee on this patent?
- Sumitomo Electric Industries, Sumitomo Electric Printed Circuits Inc
- What technology area does this patent fall under?
- Primary CPC classification B22F9/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).