Method for fabricating bulk acoustic wave resonator with mass adjustment structure

Patent metadata

Field	Value
Publication number	US-10608608-B2
Application number	US-201715684347-A
Country	US
Kind code	B2
Filing date	Aug 23, 2017
Priority date	Jan 3, 2017
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.

First claim

What is claimed is:

1. A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of:
Step D1: forming a sacrificial structure mesa on a substrate, wherein said sacrificial structure mesa is divided into a plurality of parts;
Step D2: etching said sacrificial structure mesa such that any two adjacent parts of said sacrificial structure mesa have different heights, wherein a highest part of said sacrificial structure mesa has a highest mesa top surface, wherein a mesa top extending plane is coincident with said highest mesa top surface;
Step D3: forming an insulating layer on said sacrificial structure mesa and said substrate;
Step D4: polishing said insulating layer by a chemical-mechanical planarization process to form a polished surface;
Step D5: forming a bulk acoustic wave resonance structure on said polished surface, wherein said bulk acoustic wave resonance structure is located above said sacrificial structure mesa, wherein said Step D5 comprises following steps of:
Step D51: forming a bottom electrode layer on said polished surface;
Step D52: forming a piezoelectric layer on said bottom electrode layer; and
Step D53: forming a top electrode layer on said piezoelectric layer; and
Step D6: etching said sacrificial structure mesa to form a cavity, wherein said cavity is located under said bulk acoustic wave resonance structure;
wherein, in said Step D4, (1) said insulating layer is polished such that said sacrificial structure mesa is not exposed, wherein said insulating layer under said bulk acoustic wave resonance structure, above said cavity, and between said polished surface and said mesa top extending plane forms a frequency tuning structure, wherein said insulating layer under said bulk acoustic wave resonance structure and between said mesa top extending plane and said cavity forms a mass adjustment structure; or (2) said insulating layer is polished such that said sacrificial structure mesa is exposed, wherein said insulating layer under said bulk acoustic wave resonance structure and between said polished surface and said cavity forms a mass adjustment structure.

2. The method for fabricating bulk acoustic wave resonator with mass adjustment structure according to claim 1 , wherein, after said Step D4, said plurality of parts of said sacrificial structure mesa has a geometric configuration; wherein said geometric configuration of said sacrificial structure mesa is correlated to a geometric configuration of said mass adjustment structure; thereby by adjusting said geometric configuration of said sacrificial structure mesa, said geometric configuration of said mass adjustment structure is adjusted such that a Q factor of said bulk acoustic wave resonator is enhanced.

3. The method for fabricating bulk acoustic wave resonator with mass adjustment structure according to claim 1 , wherein said substrate is a semiconductor substrate; wherein said sacrificial structure mesa is made of at least one material selected from the group consisting of: metal, alloy and epitaxial structure.

4. The method for fabricating bulk acoustic wave resonator with mass adjustment structure according to claim 3 , wherein said substrate is a compound semiconductor substrate; wherein said Step D1 comprises following steps of:
Step D11: forming a sacrificial structure on said substrate; and
Step D12: etching said sacrificial structure to form said sacrificial structure mesa.

5. The method for fabricating bulk acoustic wave resonator with mass adjustment structure according to claim 4 , wherein (1) said substrate is made of GaAs; said sacrificial structure comprises a GaAs layer; or (2) said substrate is made of InP; said sacrificial structure comprises an InGaAs layer.

6. The method for fabricating bulk acoustic wave resonator with mass adjustment structure according to claim 5 , further comprises a following step of: forming a bottom etching stop layer on said substrate, wherein said sacrificial structure is formed on said bottom etching stop layer; wherein (1) said bottom etching stop layer is made of InGaP; or (2) said bottom etching stop layer is made of InP.

Assignees

• Win Semiconductors Corp

Inventors

• Chang Chia-Ta
• Wei chun-ju
• Weng Kuo-Lung

Classifications

• H03H3/02 Primary

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H03H2003/021

  the resonators or networks being of the air-gap type · CPC title

• H03H9/02007

  of bulk acoustic wave devices · CPC title

• H03H9/02118

  of lateral leakage between adjacent resonators · CPC title

• H03H9/56

  Monolithic crystal filters · CPC title