Bonded laser with solder-free laser active stripe in facing relationship with submount

Patent metadata

Field	Value
Publication number	US-10608404-B2
Application number	US-201715431840-A
Country	US
Kind code	B2
Filing date	Feb 14, 2017
Priority date	Feb 14, 2017
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A laser light source, a submount for a semiconductor laser, and a method of providing a laser light source are provided. The laser light source includes a submount with first and second electrical contacts thereon and a trench there-between. A semiconductor laser is bonded to the submount by bonding third and fourth electrical contacts of the laser to the first and second electrical contacts, respectively. The third and fourth electrical contacts of the laser are arranged on opposite side of a laser active stripe, which is arranged over the trench of the submount.

First claim

We claim:

1. A laser light source, the laser light source comprising:
a submount comprising:
a substrate that includes:
a first side comprising:
a first surface located in a first plane;
a first raised surface located in a second plane parallel to the first plane; and
a second raised surface, located in the second plane and separated from the first raised surface by a trench;

a second side opposing the first side;

a first electrical contact, arranged on the first raised surface and protruding above the first raised surface to a third plane parallel to the second plane; and
a second electrical contact arranged on the second raised surface protruding above the second raised surface to the third plane; and

a semiconductor laser comprising:
a first doped side;
a second doped side, oppositely doped from the first doped side;
a third electrical contact directly connected to the first doped side and bonded to the first electrical contact;
a fourth electrical contact directly connected to the second doped side and bonded to the second electrical contact;
a laser active stripe arranged between the third electrical contact and fourth electrical contact, wherein the laser active stripe is arranged directly over the trench and not over the fourth electrical contact.

2. The laser light source of claim 1 , wherein a voltage difference between the first electrical contact and the second electrical contact is configured to be one of a constant voltage or a pulsed voltage.

3. The laser light source of claim 1 , wherein the fourth electrical contact is connected to the first doped side, wherein the semiconductor laser further comprises a fifth electrical contact connected to the second doped side of the semiconductor laser, wherein the submount further comprises a sixth electrical contact, wherein the sixth electrical contact is electrically connected to the fifth electrical contact, and wherein the semiconductor laser is configured to generate a laser beam in a p-n junction based on a voltage difference between the first and second electrical contacts and the sixth electrical contact.

4. The laser light source of claim 3 , wherein the voltage difference between the first and second electrical contacts and the fifth electrical contact is configured to be one of a constant voltage or a pulsed voltage.

5. The laser light source of claim 1 , wherein the first electrical contact and the second electrical contact protrude above a surface of the first side of the substrate, and wherein the trench is defined by sidewalls of the first and second electrical contacts and a surface of the substrate there-between.

6. The laser light source of claim 1 , wherein the trench is an etched feature in a surface on the first side of the substrate between the first electrical contact and the second electrical contact.

7. The laser light source of claim 6 , wherein the trench defines a rectangle-shaped cross-sectional profile.

8. The laser light source of claim 6 , wherein the trench defines a triangle-shaped cross-sectional profile.

9. The laser light source of claim 1 , further comprising a cavity on the first side of the substrate configured to receive an optical component that modifies laser light from the laser active stripe of the semiconductor laser.

10. The laser light source of claim 9 , further comprising a lens arranged in the cavity on the first side of the substrate.

11. The laser light source of claim 1 , wherein the substrate includes a first power contact and a second power contact arranged on the second side, wherein the submount includes a first through electrical via from the first side to the second side and electrically connecting the first electrical contact and the first power contact, and wherein the submount includes a second through electrical via from the first side to the second side and electrically connecting the second electrical contact and the second power contact.

12. A method, comprising:
providing a submount, the submount comprising:
a substrate that includes a first side and an opposing second side; and
a first electrical contact and a second electrical contact arranged on the first side, wherein the first electrical contact and the second electrical contact are separated by a trench;

providing a semiconductor laser, wherein the semiconductor laser comprises:
a third electrical contact that is directly connected to a first doped side of the semiconductor laser;
a fourth electrical contact that is directly connected to a second doped side of the semiconductor laser, oppositely doped from the first doped side; and
a laser active stripe arranged between the third electrical contact and the fourth electrical contact, and not over the fourth electrical contact;

arranging the semiconductor laser over the first side of the substrate of the submount such that the first electrical contact is aligned with the third electrical contact, the second electrical contact is aligned with the fourth electrical contact, and the laser active stripe is arranged directly above the trench;
bonding the third electrical contact to the first electrical contact; and
bonding the fourth electrical contact to the second electrical contact with one of solder or conductive epoxy pre-deposited on the second electrical contact.

13. The method of claim 12 , wherein bonding the third electrical contact to the first electrical contact and the fourth electrical contact to the second electrical contact comprises bonding with one of solder or conductive epoxy arranged on the first electrical contact and the second electrical contact before the semiconductor laser is arranged over the first side of the substrate of the submount.

Assignees

• Cisco Tech Inc

Inventors

• Nadeau Mary
• Neiman Jarrett S
• Pannala Mittu

Classifications

• H01S5/22 Primary

  having a ridge or stripe structure · CPC title

• H01S5/0425

  Electrodes, e.g. characterised by the structure · CPC title

• H01S5/02236 Primary

  Electricity · mapped topic

• H01S5/02252

  Electricity · mapped topic

• H01S5/02248

  Electricity · mapped topic