Thermal management system for downhole tools

Patent metadata

Field	Value
Publication number	US-10605052-B2
Application number	US-201515768860-A
Country	US
Kind code	B2
Filing date	Nov 19, 2015
Priority date	Nov 19, 2015
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A downhole tool system includes a tool housing, a chassis located within the tool housing, and an electronics assembly positioned on the chassis within the tool housing. The electronics assembly includes a heat sink comprising an inner surface and an outer surface. The outer surface includes a tapered portion and in is contact with the tool housing. The electronics assembly further includes one or more electronic components mounted onto the heat sink, in which at least a portion of the electronic components is in contact with the inner surface of the heat sink.

First claim

What is claimed is:

1. A downhole tool system, comprising:
a tool housing;
a chassis located within the tool housing; and
an electronics assembly positioned on the chassis within the tool housing, the electronics assembly comprising:
a heat sink comprising an inner surface and an outer surface, the outer surface having a tapered portion and in contact with the tool housing, wherein the heat sink further comprises a plurality of slots that each extending along a portion of the length of the heat sink;
one or more electronic components mounted onto the heat sink, wherein at least a portion of the one or more electronic components is in contact with the inner surface of the heat sink;

a plurality of fasteners, each fastener extending through a respective slot of the plurality of slots to couple the heat sink to the chassis and allow the heat sink and the one or more electrical components to slide laterally with respect to the chassis; and
a spring member configured to bias the heat sink against the tool housing.

2. The system of claim 1 , wherein fastener comprises a peg or screw.

3. The system of claim 1 , wherein the heat sink comprises a thermally conductive material, and wherein the inner surface of the heat sink is configured to be thermally communicative with the outer surface of the heat sink.

4. The system of claim 1 , wherein the tool housing comprises an inner tapered portion having a shape complementary to the tapered portion of the heat sink.

5. The system of claim 1 , wherein the at least a portion of the electronic components are coupled to a circuit board, the portion of electronic components comprising heat emitting surfaces, and wherein the heat emitting surfaces are in contact with the inner surface of the heat sink.

6. An electronics assembly for mounting on a chassis in downhole tools, the electronics assembly comprising:
a heat sink comprising an inner surface and an outer surface;
a circuit assembly mounted onto the heat sink, wherein at least a portion of the circuit assembly is in contact with the inner surface of the heat sink; and
wherein the heat sink further comprises a plurality of slots that each extending along a portion of the length of the heat sink, each of the plurality of slots configured to receive a fastener to couple the heat sink to the chassis and allow the heat sink and the circuit assembly to slide laterally with respect to the chassis.

7. The electronics assembly of claim 6 , wherein the fastener comprises a peg or screw.

8. The electronics assembly of claim 6 , wherein an outer surface of the heat sink comprises a tapered portion.

9. The electronics assembly of claim 6 , wherein the circuit assembly comprises an electronic component coupled to a circuit board, the electronic component comprising a heat emitting surface, and wherein the heat emitting surface is in contact with the inner surface of the heat sink.

10. The electronics assembly of claim 1 , wherein the heat sink comprises a thermally conductive material, and wherein the inner surface of the heat sink is thermally communicative with the outer surface of the heat sink.

Assignees

• Halliburton Energy Services Inc

Inventors

• Zhang Lizheng
• Chinwanawich Tanest
• Herrera Adan

Classifications

• E21B36/001 Primary

  Cooling arrangements · CPC title

• E21B47/011

  Fixed Constructions · mapped topic

• E21B47/0175

  Cooling arrangements · CPC title