Method for machining a workpiece

US10604987B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10604987-B2
Application numberUS-201615553621-A
CountryUS
Kind codeB2
Filing dateMar 15, 2016
Priority dateMar 17, 2015
Publication dateMar 31, 2020
Grant dateMar 31, 2020

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a method for machining a workpiece, in particular for a profiled leaf element of a window leaf frame, wherein the workpiece is initially machined using a first machining device in order to create a machined first surface to which an adhesive tape is to be applied, and the workpiece is further machined once the adhesive tape has been applied.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for machining a workpiece for a profiled leaf element of a window leaf frame, the method comprising: in a first step, machining the workpiece using a first machining device to produce a machined first surface and a machined second surface, in a second step, applying an adhesive to the first surface, in a third step, machining the workpiece further using a second machining device after applying the adhesive, wherein the second surface is adjacent to the first surface, wherein the second surface is arranged such that it corresponds substantially to a shadow area of the adhesive applied to the first surface, wherein the shadow area of the adhesive is an area on the second surface which would be obscured by the adhesive when viewing the second surface from an orthogonal vantage point. 2. The method as claimed in claim 1 , wherein the first step is carried out in such a way that the first surface is machined to a final dimension as a result. 3. The method as claimed in claim 2 , wherein the first step is carried out in such a way that the second surface is machined to a final dimension as a result. 4. The method as claimed in claim 1 , wherein the third step includes machining of at least individual remaining surfaces of the workpiece to final dimension. 5. The method as claimed in claim 4 , wherein the third step is carried out in one machining operation or multiple machining operations. 6. The method as claimed in claim 1 , wherein the first step is carried out on a planing machine or a milling machine. 7. The method as claimed in claim 1 , wherein the third step is carried out on a profiling machine or on a machining center. 8. The method as claimed in claim 1 , wherein, between the first and second steps, the method further comprises cleaning the first surface of the workpiece is pre-treated or cleaned using a cleaning device. 9. The method as claimed in claim 1 , wherein the second step is carried out automatically by a laminating device or an application device. 10. The method as claimed in claim 9 , wherein the first machining device and the laminating device or application device are coupled or connected to one another, in order to combine the production of the first surface and the application of the adhesive to the first surface with one another. 11. The method as claimed in claim 9 , wherein the laminating device or application device and the second machining device are coupled or connected to one another, in order to combine the application of the adhesive to the first surface and the further machining with one another. 12. The method as claimed in claim 1 , wherein the adhesive has or is an adhesive tape. 13. The method as claimed in claim 1 , wherein the adhesive has or is an adhesive compound which is a pasty or fluid adhesive compound. 14. The method as claimed in claim 1 , wherein the workpiece is at least partly miter-sawn or miter-milled to permit the workpiece to be mitered to a second workpiece.

Assignees

Inventors

Classifications

  • B27M3/00Primary

    Manufacture or reconditioning of specific semi-finished or finished articles (features of copying devices B23Q; manufacture of plywood or veneer, shaping plywood or veneer into articles B27D; of central layers for plywood B27D1/06; nailing or stapling machines in general B27F7/00; of elements for cooperage or wheel making B27H {; presses therefor B27D3/00}) · CPC title

  • Machines designed for producing special profiles or shaped work, e.g. by rotary cutters; Equipment therefor (turning B27C7/00; features of copying devices B23Q35/00; slotting, mortising, making tongues or grooves B27F) · CPC title

  • by means of putty, cement, or adhesives only (E06B3/64 {E06B3/5427} take precedence) · CPC title

  • E06B3/10Primary

    of wood · CPC title

  • of plastics · CPC title

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Frequently asked questions

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What does patent US10604987B2 cover?
The invention relates to a method for machining a workpiece, in particular for a profiled leaf element of a window leaf frame, wherein the workpiece is initially machined using a first machining device in order to create a machined first surface to which an adhesive tape is to be applied, and the workpiece is further machined once the adhesive tape has been applied.
Who is the assignee on this patent?
Homag Gmbh
What technology area does this patent fall under?
Primary CPC classification B27M3/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 31 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).