Silicone pressure-sensitive adhesive composition

Patent metadata

Field	Value
Publication number	US-10604688-B2
Application number	US-201616061842-A
Country	US
Kind code	B2
Filing date	Dec 12, 2016
Priority date	Dec 15, 2015
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.

First claim

The invention claimed is:

1. A silicone pressure-sensitive adhesive composition comprising:
(A) a diorganopolysiloxane having at least two alkenyl groups with 2 to 12 carbon atoms in a molecule, in an amount of from 30 to 95 parts by mass;
(B) an organopolysiloxane comprising R 1 3 SiO 1/2 and SiO 4/2 units, wherein R 1 s independently represent monovalent hydrocarbon groups with 1 to 12 carbon atoms, and having a molar ratio of (R 1 3 SiO 1/2 )/(SiO 4/2 ) units of 0.6 to 1.7, in an amount of from 5 to 70 parts by mass;
(C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in such an amount that a molar ratio of the silicon-bonded hydrogen atoms in component (C) per the alkenyl groups in components (A) and (B) is 0.1 to 20;
(D) a hydrosilylation catalyst for the addition reaction of the alkenyl groups with the silicon- bonded hydrogen atoms, in an amount to enhance a hydrosilylation of the composition; and
(E) an azeotropic solvent;
wherein the total amount of components (A) and (B) is 100 parts by mass; and
wherein the azeotropic solvent (E) is present in a sufficient amount to apply the composition to a substrate.

2. The silicone pressure-sensitive adhesive composition of claim 1 , wherein the azeotropic solvent comprises an aromatic solvent, and an aliphatic alcohol with at least three carbon atoms or an aliphatic ester.

3. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof.

4. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aliphatic alcohol is present and is isopropyl alcohol.

5. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aliphatic ester is present and is methyl acetate, ethyl acetate, or a mixture thereof.

6. The silicone pressure-sensitive adhesive composition of claim 1 , further comprising (F) an inhibitor.

7. The silicone pressure-sensitive adhesive composition of claim 6 , wherein component (F) is present in an amount of from 0.001 to 50 parts by mass per 100 parts by mass of components (A) and (B).

8. The silicone pressure-sensitive adhesive composition of claim 1 , wherein component (E) comprises an aromatic solvent and an aliphatic alcohol with at least three carbon atoms.

9. The silicone pressure-sensitive adhesive composition of claim 8 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof, and the aliphatic alcohol is isopropyl alcohol.

10. The silicone pressure-sensitive adhesive composition of claim 1 , wherein component (E) comprises an aromatic solvent and an aliphatic ester.

11. The silicone pressure-sensitive adhesive composition of claim 10 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof, and the aliphatic ester is methyl acetate, ethyl acetate, or a mixture thereof.

12. A silicone pressure-sensitive adhesive formed from the silicone pressure-sensitive adhesive composition according to claim 1 .

13. A composite article comprising a silicone pressure-sensitive adhesive layer disposed on a substrate, wherein the silicone pressure-sensitive adhesive layer is formed from the silicone pressure-sensitive adhesive composition according to claim 1 .

14. A method of forming the composite article according to claim 13 , the method comprising:
applying the silicone pressure-sensitive adhesive composition to the substrate; and
curing the silicone pressure-sensitive adhesive composition to form the silicone pressure-sensitive adhesive layer on the substrate.

Assignees

• Dow Silicones Corp

Inventors

• Jang Wonbum
• Jo Gunn
• Kim Bokyung

Classifications

• C08K13/00

  Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential · CPC title

• C08G77/04

  Polysiloxanes · CPC title

• C08J3/095

  Oxygen containing compounds · CPC title

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title