Adhesive resin layer and adhesive resin film

Patent metadata

Field	Value
Publication number	US-10604683-B2
Application number	US-201615548307-A
Country	US
Kind code	B2
Filing date	Feb 29, 2016
Priority date	May 18, 2015
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

The present invention provides an adhesive resin layer and an adhesive resin film which can prevent generation of air bubbles even when adhered to a substrate having a high level difference, and in which even after thermal endurance and after wet thermal endurance, of a laminate obtained by laminating a substrate, an adhesive resin layer, and a substrate in an order, air bubbles are not generated, durability is good, and transparency can be maintained. More specifically, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein the adhesive resin composition contains an acrylic-based polymer, urethane acrylate, and a thermopolymerization initiator, and may optionally contain an acrylic-based monomer, and an adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.

First claim

What is claimed is:

1. A monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein
said adhesive resin composition consisting essentially of (A) an acrylic-based polymer which is crosslinked with a curing agent, (B) urethane acrylate oligomer, (C) a thermopolymerization initiator, and (D) a monomer of (meth)acrylate having a hydroxyl group, wherein
said adhesive resin composition contains 2 to 40 parts by weight of said (B) urethane acrylate oligomer, and 0.001 to 0.04 parts by weight of said (C) thermopolymerization initiator, based on 100 parts by weight of said (A) acrylic-based polymer, and
said adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes, wherein
said adhesive resin layer is thermally cured after adhering the adhesive layer to a substrate having a level difference so that air bubbles are not generated between the adhesive resin layer and the level difference.

2. The adhesive resin layer according to claim 1 , wherein said thermopolymerization initiator is a peroxide.

3. The adhesive resin layer according to claim 2 , wherein a temperature at which said peroxide has a half-life of 1 minute is 100° C. or higher.

4. The adhesive resin layer according to claim 1 , wherein said curing agent comprises at least one kind of an isocyanate-based compound or an epoxy-based compound.

5. An adhesive resin film comprising the adhesive resin layer according to claim 1 laminated between two separators.

Assignees

• Fujimori Kogyo Co Ltd

Inventors

• Fujita Shiro
• Suzuki Atsushi
• Niimi Hiroto

Classifications

• C09J2475/00

  Presence of polyurethane · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J175/14

  Polyurethanes having carbon-to-carbon unsaturated bonds · CPC title

• C09J7/30 Primary

  characterised by the adhesive composition · CPC title