Method for producing conductive film, conductive film, and touch panel

Patent metadata

Field	Value
Publication number	US-10604671-B2
Application number	US-201815888486-A
Country	US
Kind code	B2
Filing date	Feb 5, 2018
Priority date	Aug 24, 2015
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.

First claim

What is claimed is:

1. A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate, the method comprising:
a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from the water-insoluble polymer X and the water-insoluble polymer Y;
a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and
a third step of forming the conductive layer by removing the water-soluble polymer Z.

2. The method for producing a conductive film according to claim 1 , wherein the first step has forming the precursor layer by applying to the substrate a lower-coating-forming composition including at least one of the water-insoluble polymer X or the water-insoluble polymer Y and an upper-coating-forming composition at least including the other one of the water-insoluble polymer X or the water-insoluble polymer Y, the water-soluble polymer Z, and the metal component or its precursor.

3. The method for producing a conductive film according to claim 2 , wherein one of the cross-linking group and the reactive group is an oxazoline group.

4. The method for producing a conductive film according to claim 1 , wherein one of the cross-linking group and the reactive group is an oxazoline group.

5. The method for producing a conductive film according to claim 1 , wherein the water-soluble polymer Z includes gelatin.

6. The method for producing a conductive film according to claim 1 , wherein the metal component or its precursor is a silver halide,
the method further comprising, before the third step, subjecting the silver halide to an exposure treatment and then performing a development treatment to form metal silver.

7. The method for producing a conductive film according to claim 1 , the method further comprising, after the third step, performing a heat treatment on the conductive layer.

8. A conductive film comprising a substrate and a conductive layer that is disposed on the substrate and includes a metal component,
wherein the conductive layer includes a polymer W formed as a result of a reaction between a water-insoluble polymer X having a cross-linking group and a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group,
in the conductive layer, an average area fraction of the metal component is 85% or more in a metal-containing region, and
in a vertical section of the conductive layer, the metal-containing region is a region extending from a middle position between an upper end position and a lower end position toward the substrate side by 50 nm and toward a surface X side by 50 nm; when a contour along a profile of the surface X of the conductive layer is moved from the surface X being a surface on a side opposite to the substrate side toward the substrate side, a position where the contour reaches the metal component included in the conductive layer is the upper end position; and when the contour is moved from the upper end position toward the substrate side, a position where the metal component ceases to exist in the conductive layer is the lower end position.

9. The conductive film according to claim 8 , wherein one of the cross-linking group and the reactive group is an oxazoline group.

10. A touch panel comprising the conductive film according to claim 8 .

Assignees

• Fujifilm Corp

Inventors

• Katagiri Kensuke
• TAJIRI Shin

Classifications

• C08J7/042

  with two or more layers, where at least one layer of a composition contains a polymer binder · CPC title

• G03F7/06

  Silver salts (G03F7/075 takes precedence) · CPC title

• C08J2367/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

• H01B13/0036

  Details · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title