Pin die thermoforming apparatus

Patent metadata

Field	Value
Publication number	US-10603835-B2
Application number	US-201715427251-A
Country	US
Kind code	B2
Filing date	Feb 8, 2017
Priority date	Feb 8, 2017
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A thermoforming apparatus is described herein. The apparatus may include a pressure mechanism, a thermal device, a plurality of individually actuatable pins, and/or a pin actuation mechanism. The pressure mechanism may create a force against a die surface. The thermal device may change a thermal state of a material forced by the pressure mechanism against the die surface. The plurality of individually actuatable pins may form the die surface. The pin actuation mechanism may be connected to the plurality of actuatable pins and/or may actuate the pins. This apparatus improves on prior solutions in many ways. For example, embodiments of the thermoforming apparatus may require significantly less time between different molds than previous thermoforming machines and 3D printers.

First claim

We claim:

1. A thermoforming apparatus, comprising:
a pressure mechanism that creates a force against a die surface;
a thermal device that changes a thermal state of a material forced by the pressure mechanism against the die surface;
a plurality of individually actuatable pins forming the die surface; and
a pin actuation mechanism connected to the plurality of actuatable pins,
the pin actuation mechanism comprising a fluid-filled manifold having branches corresponding to the plurality of pins, a piston disposed within the manifold and mechanical valves corresponding to each pin, each branch, or both, wherein each valve comprises a tube, a magnet, and a coil, the magnet rotatably disposed within the tube, and the coil wrapped around the tube and aligned with the magnet such that a first current passing through the coil in a first direction rotates the magnet and closes the valve, and a second current passing through the coil in a second direction rotates the magnet and opens the valve.

2. The apparatus of claim 1 , each pin having a curved head.

3. The apparatus of claim 1 , each pin having a spring-loaded head.

4. The apparatus of claim 1 , each pin having a head and a shank, the head having a larger diameter than the shank.

5. The apparatus of claim 1 , wherein the plurality of pins comprises a pin number density, the pin number density corresponding to one or more of a surface tension or a viscosity of the material in the thermal state such that a surface of the material facing away from the pins remains smooth as the material is shaped on the pins.

6. The apparatus of claim 1 , each pin comprising a hollow shank and a thermal expansion fluid disposed within the hollow shank.

7. The apparatus of claim 1 , wherein the pressure mechanism comprises a vacuum, and further comprising a plate disposed between the vacuum and the die surface, the plate having pin apertures and vacuum apertures, wherein the pins pass through the pin apertures, and wherein the vacuum is fluidically coupled to the vacuum apertures such that, as the vacuum pulls air through the vacuum apertures, the material is forced against the pins.

8. The apparatus of claim 1 , further comprising a robotic arm having a cutting mechanism that shapes the material.

9. The apparatus of claim 1 , wherein each of the plurality of pins comprises an articulating head.

10. The apparatus of claim 1 , wherein each of the plurality of pins comprises a spherically articulating head.

Assignees

• Hall David R
• Hall Stephen R
• Johnson Christopher
• Simpson Jason
• Knight Jedediah
• Hall Labs Llc

Inventors

• Hall David R
• Hall Stephen R
• Johnson Christopher
• Simpson Jason
• Knight Jedediah

Classifications

• B29C51/18 Primary

  Thermoforming apparatus · CPC title

• B29C51/36 Primary

  specially adapted for vacuum forming {, Manufacture thereof} · CPC title

• B29C2791/006

  Using vacuum · CPC title

• B29C51/10

  Forming by pressure difference, e.g. vacuum · CPC title

• B29C33/302

  Assembling a large number of mould elements to constitute one cavity · CPC title