Die with aligning mechanism, and manufacturing device and method for enameled wire

US10603832B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10603832-B2
Application numberUS-201815892559-A
CountryUS
Kind codeB2
Filing dateFeb 9, 2018
Priority dateMay 30, 2017
Publication dateMar 31, 2020
Grant dateMar 31, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.

First claim

Opening claim text (preview).

What is claimed is: 1. An enameled wire manufacturing method, comprising: applying a coating material around a traveling wire; and adjusting a thickness of the coating material applied around the traveling wire by using a die with alignment mechanism that comprises a die comprising a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction, wherein the movable member comprises a main body and a movable portion, the main body comprising a recessed portion for fitting the bearing member and a hole portion provided on a bottom surface of the recessed portion to allow a portion of the die to penetrate through, and the movable portion being arranged on a forward side of the main body in the travel direction to move the main body in a direction orthogonal to the travel direction of the traveling wire, wherein the die has one end face and another end face opposite thereto and comprises a flange portion including the one end face and a stem portion including the other end face and extending from the flange portion, and the though-hole is provided from the one end face to the other end face, and wherein the die with alignment mechanism further comprises a guide member that is arranged to be in contact with the movable member and comprises a guide surface for guiding the movable member. 2. The enameled wire manufacturing method according to claim 1 , wherein the bearing member comprises a bearing portion for rotationally moving the die in the circumferential direction of the traveling wire and has an annular outer shape. 3. The enameled wire manufacturing method according to claim 1 , wherein the die with alignment mechanism comprises a receiving member that is arranged between the movable member and the die and comprises a raised portion protruding in the travel direction of the traveling wire and abutting against the bearing member. 4. The enameled wire manufacturing method according to claim 1 , wherein the movable portion of the movable member comprises rollers. 5. The enameled wire manufacturing method according to claim 1 , wherein the movable portion of the movable member comprises ball rollers.

Assignees

Inventors

Classifications

  • Coating solid articles, i.e. non-hollow articles · CPC title

  • Wire and cord miscellaneous · CPC title

  • Distributing applied liquids or other fluent materials by members moving relatively to surface · CPC title

  • Cross-head annular extrusion nozzles, i.e. for simultaneously receiving moulding material and the preform to be coated · CPC title

  • by passing through or dipping in a liquid bath; by spraying · CPC title

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What does patent US10603832B2 cover?
A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement …
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01B13/065. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).