Cutting machine for resizing raw implants during surgery

US10603175B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10603175-B2
Application numberUS-201515529042-A
CountryUS
Kind codeB2
Filing dateNov 24, 2015
Priority dateNov 24, 2014
Publication dateMar 31, 2020
Grant dateMar 31, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a method for forming an implant with an autonomous manufacturing device. The method includes accessing a first computer-readable reconstruction of a being's anatomy; accessing a second computer-readable reconstruction of an implant; accessing a third computer-readable reconstruction comprising the first computer-readable reconstruction superimposed with the second computer readable reconstruction; generating at least one computer-readable trace from a point cloud; and forming an implant with an autonomous manufacturing device, wherein the autonomous manufacturing device forms the implant into a shape defined by at least one dimension of the computer-readable trace.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming an implant with an autonomous manufacturing device, comprising: accessing a first computer-readable reconstruction of a being's anatomy; forming an implant corresponding to a portion of the being's anatomy, the implant comprising a polymer, a metal, a bioengineered material, or a combination thereof; accessing a second computer-readable reconstruction of the implant; resecting a portion of the being's anatomy creating a boundary defect defining the resected portion of the being's anatomy; generating at least one computer-readable trace from a point cloud of the boundary defect of the being's anatomy with an anatomical feature removed; and removing excess material from a periphery of the implant to form the implant into a shape defined by the computer-readable trace. 2. The method of claim 1 , wherein the step of removing includes causing an implant material-removal tool of an autonomous manufacturing device to remove the excess material from the implant. 3. The method of claim 2 , further comprising generating a projected trace from the computer-readable trace, wherein the projected trace comprises a 2D or 3D projected trace, and projecting the projected trace onto the implant. 4. The method of claim 3 , further including the step of accessing a third computer-readable reconstruction comprising the first computer-readable reconstruction superimposed with the second computer readable reconstruction. 5. The method of claim 1 , wherein the computer-readable trace includes information for generating signals to virtually constrain a human-guided cutting tool using an autonomous manufacturing device. 6. The method of claim 5 , wherein the human-guided cutting tool using the autonomous manufacturing device is configured to provide haptic feedback. 7. The method of claim 1 , wherein the step of removing includes removing portions of the implant that are adjacent to a boundary defined by at least one dimension of the computer-readable trace. 8. The method of claim 1 , further comprising fitting the implant onto the being. 9. The method of claim 1 , wherein the wherein the step of forming is performed by an autonomous manufacturing device. 10. The method of claim 9 , wherein the step of removing is performed by the autonomous manufacturing device. 11. The method of claim 10 , wherein the autonomous manufacturing device comprises an articulating arm and an implant material-removal tool detachably connected to an end of the articulating arm. 12. The method of claim 10 , wherein the autonomous manufacturing device comprises an implant material-removal tool disposed on a nonstationary platform and a holding platform on which implant material is attached, wherein the nonstationary platform is configured to advance or retract the implant material-removal tool toward or away from the holding platform. 13. The method of claim 12 , wherein the implant material-removal tool comprises a cutting surface for cutting the implant material. 14. The method of claim 12 , wherein the implant material-removal tool comprises a laser for ablating the implant material. 15. The method of claim 12 , wherein the holding platform comprises a nonstationary platform. 16. The method of claim 12 , wherein the holding platform comprises a stationary platform. 17. The method of claim 1 , wherein the step of removing is performed by an autonomous manufacturing device comprising an implant material-removal tool. 18. The method of claim 17 , wherein the computer-readable trace includes information for generating signals to virtually constrain a human-guided cutting tool using the autonomous manufacturing device with the use of at least one of motor encoders, a position trackable element and/or an electromagnetic trackable element. 19. The method of claim 18 , wherein the human-guided cutting tool comprises a haptic device, wherein the haptic device receives signals generated in response to the signals generated by the at least one of motor encoders, a position trackable element and/or an electromagnetic trackable element in order to generate a haptic response provided by the human-guided cutting tool. 20. The method of claim 1 , the computer-readable trace comprises a virtual or visual representation of a geometry corresponding to a final shape of a resized implant. 21. The method of claim 1 , wherein the implant is formed with a curvature specific to that of the being's anatomy. 22. The method of claim 1 , wherein the step of removing is performed by an autonomous manufacturing device comprising a multi-axis laser cutter machine.

Assignees

Inventors

Classifications

  • Plastics other than composite materials · CPC title

  • Electromagnetic tracking systems · CPC title

  • Skull or cranium (A61F2/2803 takes precedence; joints for temporo-mandibular [TM] joints [TMJ] A61F2/3099) · CPC title

  • Optical tracking systems · CPC title

  • including a freely orientable platform, e.g. so called 'Stewart platforms' · CPC title

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What does patent US10603175B2 cover?
Provided is a method for forming an implant with an autonomous manufacturing device. The method includes accessing a first computer-readable reconstruction of a being's anatomy; accessing a second computer-readable reconstruction of an implant; accessing a third computer-readable reconstruction comprising the first computer-readable reconstruction superimposed with the second computer readable …
Who is the assignee on this patent?
Univ Johns Hopkins
What technology area does this patent fall under?
Primary CPC classification A61F2/30942. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 31 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).