Elastic wave device

Patent metadata

Field	Value
Publication number	US-10601389-B2
Application number	US-201715586315-A
Country	US
Kind code	B2
Filing date	May 4, 2017
Priority date	Dec 4, 2014
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.

First claim

What is claimed is:

1. An elastic wave device comprising:
a piezoelectric substrate including first and second opposing main surfaces;
an IDT electrode provided on the first main surface of the piezoelectric substrate; and
a heat dissipating film provided on the second main surface of the piezoelectric substrate and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces; wherein
at least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to an outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film; and
the heat dissipating film overlaps with the IDT electrode provided on the first main surface when seen from above from a side of the second main surface of the piezoelectric substrate.

2. The elastic wave device according to claim 1 , wherein an outer circumferential edge of the main surface of the pair of main surfaces of the heat dissipating film at a side farther from the second main surface of the piezoelectric substrate is located in the inner side portion relative to the outer circumference of the second main surface.

3. The elastic wave device according to claim 1 , wherein an outer circumference of the heat dissipating film is located in the inner side portion relative to the outer circumference of the second main surface when seen from above from the second main surface side.

4. The elastic wave device according to claim 1 , wherein the second main surface of the piezoelectric substrate includes a back grinded portion.

5. The elastic wave device according to claim 1 , wherein the heat dissipating film is tapered such that an area of the heat dissipating film is decreased with increasing distance from the second main surface of the piezoelectric substrate.

6. The elastic wave device according to claim 1 , wherein the heat dissipating film is a dielectric film including no metal film.

7. The elastic wave device according to claim 1 , further including:
a support member provided on the first main surface of the piezoelectric substrate so as to surround the IDT electrode and made of resin; and
a lid member provided on the support member so as to seal a cavity surrounding the IDT electrode and made of resin.

8. The elastic wave device according to claim 1 , further comprising:
an external terminal located on the first main surface of the piezoelectric substrate;
the heat dissipating film overlaps with the external terminal when seen from above from a side of the second main surface of the piezoelectric substrate.

9. The elastic wave device according to claim 1 , further comprising a protection film that covers at least a portion of the heat dissipating film.

10. The elastic wave device according to claim 1 , further including a close contact layer provided between the heat dissipating film and the second main surface of the piezoelectric substrate.

Assignees

• Murata Manufacturing Co

Inventors

• Sekiya Daisuke
• Kikuchi Taku
• Tanaka Hiroshi

Classifications

• H03H3/10 Primary

  for obtaining desired frequency or temperature coefficient · CPC title

• H03H9/25

  Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} · CPC title

• H03H9/64

  using surface acoustic waves · CPC title

• H03H9/145

  for networks using surface acoustic waves · CPC title

• H03H9/059

  consisting of mounting pads or bumps · CPC title