Wiring board, electric motor, electric apparatus, and air conditioner

US10601285B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10601285-B2
Application numberUS-201415507301-A
CountryUS
Kind codeB2
Filing dateOct 23, 2014
Priority dateOct 23, 2014
Publication dateMar 24, 2020
Grant dateMar 24, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plurality of footprints connected to the wires and having entire surfaces exposed in openings of the resist. The pins are soldered to the footprints by reflow. In the openings of the resist, directions in which the pins are led out are parallel to directions in which the wires are led out.

First claim

Opening claim text (preview).

The invention claimed is: 1. A wiring board on which an electronic component to detect a magnetic-pole rotational position of a rotor is mounted, the electronic component including a pin with a pad, the wiring board comprising: a base substrate having an origin on an axis of rotation of the rotor; a wire provided on the base substrate; a resist covering the wire, the resist including a footprint opening; and a footprint connected to the wire and exposed by the footprint opening of the resist, the pad of the pin being soldered to the footprint, wherein a direction in which the wire at a connection between the footprint and the wire is led out is parallel to a direction in which the pin is led out, and the direction in which the pin is led out is a direction inclined at 45 degrees or less relative to a straight line interconnecting the origin and the electronic component on the base substrate. 2. The wiring board according to claim 1 , wherein the direction in which the wire is led out is identical with the direction in which the pin is led out. 3. The wiring board according to claim 1 , wherein the wire is led out to both sides of the footprint. 4. The wiring board according to claim 1 , wherein the direction in which the pin is led out is parallel to a radial direction from the origin of the wiring board to the electronic component. 5. An electric motor comprising the wiring board according to claim 1 , wherein the wiring board has an origin on an axis of rotation. 6. The electric motor according to claim 5 , wherein a stator and the wiring board are formed integrally with resin. 7. An electric apparatus comprising the electric motor according to claim 5 . 8. An air conditioner being the electric apparatus according to claim 7 . 9. A wiring board on which an electronic component to detect a magnetic-pole rotational position of a rotor is mounted, the electronic component including a pin with a pad, the wiring board comprising: a base substrate having an origin on an axis of rotation of the rotor; a wire provided on the base substrate; a resist covering the wire, the resist including a footprint opening; and a footprint connected to the wire and exposed by the footprint opening of the resist, the pad of the pin being soldered to the footprint, wherein a direction in which the wire at a connection between the footprint and the wire is led out is parallel to a direction in which the pin is led out, the pin has a bent portion bent in a thickness direction of the electronic component, and a distance from an end portion of the resist defining the footprint opening to a base point of the bent portion of the pin is larger than a height from a surface of the footprint to a base point from which the pin is led out from the electronic component. 10. The wiring board according to claim 9 , wherein a fillet resulting from the soldering is formed on the wire exposed in the footprint opening of the resist. 11. The wiring board according to claim 9 , wherein the direction in which the wire is led out is identical with the direction in which the pin is led out. 12. The wiring board according to claim 9 , wherein the wire is led out to both sides of the footprint. 13. The wiring board according to claim 9 , wherein the direction in which the pin is led out is parallel to a radial direction from the origin of the wiring board to the electronic component. 14. An electric motor comprising the wiring board according to claim 9 , wherein the wiring board has an origin on an axis of rotation. 15. The electric motor according to claim 14 , wherein a stator and the wiring board are formed integrally with resin. 16. An electric apparatus comprising the electric motor according to claim 14 . 17. An air conditioner being the electric apparatus according to claim 16 .

Assignees

Inventors

Classifications

  • Sensor · CPC title

  • Structural association with other electrical or electronic devices · CPC title

  • Insulating casings · CPC title

  • characterised by the leads · CPC title

  • structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10601285B2 cover?
An object of the present invention is to obtain a wiring board that achieves both of high mounting position accuracy and high solder strength in a circumferential direction. On the wiring board, an electronic component including a plurality of pins is mounted. The wiring board includes a base substrate, a plurality of wires provided on the base substrate, a resist covering the wires, and a plur…
Who is the assignee on this patent?
Mitsubishi Electric Corp
What technology area does this patent fall under?
Primary CPC classification H02K11/0094. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).