Electromagnetic-coupling-module-attached article

Patent metadata

Field	Value
Publication number	US-10601254-B2
Application number	US-201816179014-A
Country	US
Kind code	B2
Filing date	Nov 2, 2018
Priority date	Apr 26, 2006
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

First claim

What is claimed is:

1. An electromagnetic-coupling-module-attached article comprising:
an article;
an electromagnetic-coupling module including a radio IC chip and a feeder circuit board attached to the article; wherein
the electromagnetic-coupling module includes a resonant circuit having a predetermined resonant frequency;
the article includes a radiation element that performs at least one of the functions of: radiating a transmission signal supplied from the electromagnetic-coupling module via electromagnetic coupling, and supplying a received reception signal to the electromagnetic-coupling module via electromagnetic coupling;
the feeder circuit board includes a first electrode that opposes the radiation element and a second electrode that opposes the first electrode;
the second electrode is opposed to the radiation element with the first electrode in between the second electrode and the radiation element; and
a frequency of the transmission signal radiated from the radiation element is substantially equal to the predetermined resonant frequency of the resonant circuit.

2. The electromagnetic-coupling-module-attached article according to claim 1 , wherein the resonant circuit is a lumped-constant resonant circuit defined by a capacitor pattern and an inductor pattern.

3. The electromagnetic-coupling-module-attached article according to claim 2 , wherein the lumped-constant resonant circuit includes at least one of an LC series resonant circuit and an LC parallel resonant circuit.

4. The electromagnetic-coupling-module-attached article according to claim 2 , wherein the lumped-constant resonant circuit includes at least one of a plurality of LC series resonant circuits and a plurality of LC parallel resonant circuits.

5. The electromagnetic-coupling-module-attached article according to claim 2 , wherein the capacitor pattern is arranged downstream of the radio IC chip and between the radio IC chip and the inductor pattern.

6. The electromagnetic-coupling-module-attached article according to claim 2 , wherein the feeder circuit board is a multi-layer board including a plurality of at least one of dielectric layers and magnetic layers laminated together, and the capacitor pattern and the inductor pattern are disposed on a surface of or inside the multi-layer board.

7. The electromagnetic-coupling-module-attached article according to claim 1 , wherein the feeder circuit board is a rigid board made of one of resin and ceramic.

8. The electromagnetic-coupling-module-attached article according to claim 1 , wherein an electrical length of the radiation element is an integral multiple of a half wavelength of the resonant frequency.

9. The electromagnetic-coupling-module-attached article according to claim 1 , wherein a chip-side electrode pattern is provided at the radio IC chip and a first board-side electrode pattern is provided at the feeder circuit board, and the radio IC chip and the feeder circuit board are coupled by a DC connection between the chip-side electrode pattern and the first board-side electrode pattern.

10. The electromagnetic-coupling-module-attached article according to claim 1 , wherein a chip-side electrode pattern is provided at the radio IC chip and a first board-side electrode pattern is provided at the feeder circuit board, the radio IC chip and the feeder circuit board are coupled by capacitive coupling between the chip-side electrode pattern and the first board-side electrode pattern.

11. The electromagnetic-coupling-module-attached article according to claim 10 , wherein the chip-side electrode pattern and the first board-side electrode pattern are planar electrode patterns arranged substantially parallel to each other, and the radio IC chip and the feeder circuit board are connected through a dielectric adhesion layer.

12. The electromagnetic-coupling-module-attached article according to claim 1 , wherein a chip-side electrode pattern is provided at the radio IC chip and a first board-side electrode pattern is provided at the feeder circuit board, the radio IC chip and the feeder circuit board is coupled by magnetic coupling between the chip-side electrode pattern and the first board-side electrode pattern.

13. The electromagnetic-coupling-module-attached article according to claim 12 , wherein each of the chip-side electrode pattern and the first board-side electrode pattern is a coil-shaped electrode pattern, and the radio IC chip and the feeder circuit board are connected through an insulating or magnetic adhesion layer.

14. The electromagnetic-coupling-module-attached article according to claim 1 , wherein the radiation element and the resonant circuit are disposed on different substrates from one another.

15. The electromagnetic-coupling-module-attached article according to claim 1 , wherein the feeder circuit board is smaller than the radiation element.

16. The electromagnetic-coupling-module-attached article according to claim 2 , wherein the inductor pattern is disposed at an opposite side of the first electrode with respect to the radiation element.

17. An electromagnetic-coupling-module-attached article comprising:
an article;
an electromagnetic-coupling module including a radio IC chip and a feeder circuit board attached to the article; wherein
the electromagnetic-coupling module includes a resonant circuit having a predetermined resonant frequency;
the article includes a radiation element that performs at least one of the functions of: radiating a transmission signal supplied from the electromagnetic-coupling module via electromagnetic coupling, and supplying a received reception signal to the electromagnetic-coupling module via electromagnetic coupling;
the feeder circuit board includes a first electrode that opposes the radiation element and a second electrode that opposes the first electrode;
a frequency of the transmission signal radiated from the radiation element is substantially equal to the predetermined resonant frequency of the resonant circuit;
the resonant circuit is a lumped-constant resonant circuit defined by a capacitor pattern and an inductor pattern; and
the inductor pattern is disposed at an opposite side of the first electrode with respect to the radiation element.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru
• Kimura Ikuhei
• Iwasaki Kimikazu
• Ishino Satoshi

Classifications

• G06K19/07771

  the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• H02J50/12 Primary

  of the resonant type · CPC title

• G06K19/07773

  Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

• H01L2224/16227

  Electricity · mapped topic