Method of manufacturing wire with terminal and crimping terminal

Patent metadata

Field	Value
Publication number	US-10601207-B2
Application number	US-201715782639-A
Country	US
Kind code	B2
Filing date	Oct 12, 2017
Priority date	Oct 13, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A method of manufacturing a wire with a terminal includes a crimping process of crimping a crimping terminal on a wire by a terminal crimping apparatus that includes a first mold including a supporting surface supporting the crimping terminal, and a second mold disposed to face the supporting surface and including a recessed wall surface. The recessed wall surface includes a first wall surface and a second wall surface, and a third wall surface curved toward an opposite side of the supporting surface. The first wall surface and the second wall surface include inclined portions and parallel portions. The inclined portions are inclined with respect to the stroke direction so that an interval in the width direction becomes narrower toward the third wall surface. The parallel portions are parallel to the stroke direction. In the crimping process, the side wall surfaces of the first mold face the inclined portions in a state in which the first mold and the second mold come closest to each other in the stroke direction.

First claim

What is claimed is:

1. A method of manufacturing a wire with a terminal comprising:
a crimping process of crimping a crimping terminal on a wire by a terminal crimping apparatus that includes;
a first mold including a supporting surface that supports the crimping terminal including a wire connection portion having a bottom wall portion and a pair of side wall portions that faces each other in a width direction of the bottom wall portion and protrudes from both ends in the width direction of the bottom wall portion;
a second mold disposed to face the supporting surface, and including a recessed wall surface opened toward the supporting surface, on a surface facing the supporting surface; and
a driving device configured to reciprocate the second mold in a stroke direction being a direction in which the supporting surface and the second mold face each other, wherein
the recessed wall surface includes a first wall surface and a second wall surface that are configured to face side wall surfaces of the first mold, and are facing each other in the width direction, and a third wall surface connecting the first wall surface and the second wall surface, and curved toward an opposite side to the supporting surface, the first wall surface, the second wall surface, and the third wall surface defining a recessed space in the second mold,
the first wall surface and the second wall surface include inclined portions and parallel portions,
the inclined portions are positioned at end portions of the third wall surface side on the first wall surface and the second wall surface, and inclined with respect to the stroke direction so that an interval in the width direction becomes narrower as going to the third wall surface,
the parallel portions extend from the inclined portions toward an opposite side to the third wall surface side, and are parallel to the stroke direction,
in the crimping process, the driving device moves the second mold in the stroke direction such that the first mold extends into the recessed space in the second mold and the side wall surfaces of the first mold are located between the parallel portion of the first wall surface and the parallel portion of the second wall surface, and
in the crimping process, the side wall surfaces of the first mold face the inclined portions such that boundaries between the inclined portions and the third wall surface are positioned on the upper side than upper ends of the side wall surfaces of the first mold and boundaries between the inclined portions and the parallel portions are positioned on a lower side than the upper ends of the side wall surfaces of the first mold in a state in which the first mold and the second mold come closest to each other in the stroke direction.

2. The method according to claim 1 , wherein
the terminal crimping apparatus further comprises:
a wire holding mechanism configured to move toward the first mold together with the second mold while holding a crimping target wire, and
in the crimping process, the parallel portions face the side wall surfaces of the first mold side at a time point at which a core wire of the wire is accommodated into an inner space portion of the pair of side wall portions.

3. The method according to claim 1 , wherein
the terminal crimping apparatus further comprises:
a wire holding mechanism configured to move toward the first mold together with the second mold while holding a crimping target wire, and
in the crimping process, the parallel portions face the side wall surfaces of the first mold side at a time point at which the wire comes into contact with the bottom wall portion.

Assignees

• Yazaki Corp

Inventors

• Takayanagi Masayoshi
• Ito Naoki
• Kurashige Keiichiroh
• Ikebe Koichi

Classifications

• H01R4/188

  having an uneven wire-receiving surface to improve the contact · CPC title

• H01R43/052

  with wire-feeding mechanism · CPC title

• H01R4/185

  combined with a U-shaped insulation-receiving portion · CPC title

• H01R4/184

  comprising a U-shaped wire-receiving portion · CPC title

• H02G1/145 Primary

  Moulds · CPC title