Semiconductor module having a grooved clip frame

Patent metadata

Field	Value
Publication number	US-10600725-B2
Application number	US-201816093037-A
Country	US
Kind code	B2
Filing date	May 29, 2018
Priority date	May 29, 2018
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin.

First claim

The invention claimed is:

1. A semiconductor module comprising:
a die pad frame;
a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed;
a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame;
a first clip frame disposed on the upper surface of the semiconductor chip;
a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and
a sealing resin for sealing the semiconductor chip, the die pad frame, the first clip frame, the first clip conductive connection member, and the conductive connection member for die pad,
wherein a clip locking part is disposed at an end portion of an upper surface of the first clip frame, the clip locking part being partially above the upper surface of the first clip frame so as to be away from the upper surface of the semiconductor chip, and
wherein a groove is formed on a lower surface of the clip locking part.

2. The semiconductor module according to claim 1 , wherein a cross section of the groove perpendicularly taken relative to a length direction of the groove, along which the groove extends on the lower surface of the clip locking part, has a V shape.

3. The semiconductor module according to claim 2 , wherein the groove on the lower surface of the clip locking part is formed by laser irradiation or pressing.

4. The semiconductor module according to claim 2 , wherein the groove on the lower surface of the clip locking part is disposed around a perimeter of the end portion of the upper surface of the first clip frame.

5. The semiconductor module according to claim 4 , wherein the clip locking part is continuously disposed around the perimeter of the end portion of the upper surface of the first clip frame.

6. The semiconductor module according to claim 5 , wherein two or more grooves are formed on the lower surface of the clip locking part around the perimeter of the end portion of the upper surface of the first clip frame.

7. The semiconductor module according to claim 1 , wherein the clip locking part has a protruding part that protrudes from the end portion of the upper surface of the first clip frame.

8. The semiconductor module according to claim 7 , wherein the clip locking part has two or more protruding part that protrude from the end portion of the upper surface of the first clip frame in a stepwise manner.

9. The semiconductor module according to claim 2 , wherein an end of the clip locking part has a rectangular shape or a curved shape.

10. The semiconductor module according to claim 8 , wherein the clip locking part is formed by pressing the end portion of the upper surface of the first clip frame upward.

11. The semiconductor module according to claim 1 , wherein the sealing resin has a linear expansion coefficient that is smaller than the linear expansion coefficient of the die pad frame and the first clip frame, and greater than the linear expansion coefficient of the semiconductor chip.

12. The semiconductor module according to claim 1 ,
wherein a third electrode that has a smaller upper surface area than the first electrode is disposed on the upper surface of the semiconductor chip, and
wherein the semiconductor module further comprises:
a second clip frame that is disposed on the upper surface of the semiconductor chip to be adjacent to the first clip frame, the second clip frame having a smaller upper surface area than the first clip frame; and
a second clip conductive connection member electrically connecting the third electrode of the semiconductor chip and a lower surface of the second clip frame.

13. The semiconductor module according to claim 12 ,
wherein the semiconductor chip is an MOS transistor,
wherein the first electrode is a source electrode of the MOS transistor,
wherein the second electrode is a drain electrode of the MOS transistor, and
wherein the third electrode is a gate electrode of the MOS transistor.

14. The semiconductor module according to claim 13 , wherein the first clip conductive connection member, the second clip conductive connection member, and the conductive connection member for die pad are soldering material members.

15. The semiconductor module according to claim 1 ,
wherein the die pad frame has a protrusion disposed on an upper side of an end portion of a main body of the die pad frame and protruding from an upper surface of the main body of the die pad frame in a direction parallel to a direction in which the upper surface of the main body of the die pad frame extends, the protrusion improving adhesion with the sealing resin, and
wherein a locking portion is disposed on a tip portion of the protrusion, the locking portion being partially above an upper surface of the protrusion.

Assignees

• Shindengen Electric Mfg
• Katoh Electric Co Ltd

Inventors

• Urushihata Hiroyoshi
• Shigeno Takashi
• Ito Eiki
• Kimura Wataru
• Endo Hirotaka
• Koike Toshio
• Kouno Toshiki

Classifications

• H01L23/49562

  Electricity · mapped topic

• H01L23/3114

  Electricity · mapped topic

• H01L23/49503 Primary

  Electricity · mapped topic

• H01L23/3142

  Electricity · mapped topic

• H10W90/811

  Multiple chips on leadframes · CPC title