Fuse element and fuse device

Patent metadata

Field	Value
Publication number	US-10600602-B2
Application number	US-201414770312-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Mar 28, 2013
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A fuse element capable of surface-mounting and capable of increased ratings while maintaining high-speed blowout property; and a fuse device using the same. A fuse element blown by self-generated heat caused when a rate-exceeding current flows therethrough constitutes a current path of a fuse device and has a low melting point metal layer and a high melting point metal layer laminated onto the low melting point metal layer; when the current flows therethrough, the low melting point metal layer erodes the high melting point metal layer and blowout occurs.

First claim

The invention claimed is:

1. A fuse element constituting a current path of a fuse device in which self-generated heat caused by a rate-exceeding current flowing therethrough causes blowout of the fuse element comprising:
a low melting point metal layer; and
a high melting point metal layer laminated onto the low melting point metal layer, the high melting point metal layer having a melting point higher than a melting point of the low melting point metal layer;
wherein the fuse element is connected between two electrodes on an insulating substrate and connected onto the electrodes by a solder at a reflow temperature of the solder,
wherein the fuse element has a laminated structure in which the low melting point metal layer is an inner layer and the high melting point metal layer is an outer layer laminated on an upper surface and on a lower surface of the low melting point metal layer, and
wherein the melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C., and
wherein the low melting point metal layer and the solder are melted at the reflow temperature of the solder.

2. The fuse element according to claim 1 ,
wherein the low melting point metal layer is a solder; and
wherein the high melting point metal layer is Ag, Cu, or an alloy having Ag or Cu as a primary constituent.

3. The fuse element according to claim 1 ,
wherein a volume of the low melting point metal layer is greater than a volume of the high melting point metal layer.

4. The fuse element according to claim 1 ,
wherein a film thickness ratio of the low melting point metal layer to the high melting point metal layer is between 2:1 and 100:1.

5. The fuse element according to claim 1 ,
wherein the low melting point metal layer has a film thickness of 30 μm or more, and
wherein the high melting point metal layer has a film thickness of 3 μm or more.

6. The fuse element according to claim 1 ,
wherein the high melting point metal layer is formed by plating on a surface of the low melting point metal layer.

7. The fuse element according to claim 1 ,
wherein the high melting point metal layer is formed by applying a metallic foil to a surface of the low melting point metal layer.

8. The fuse element according to claim 1 ,
wherein the high melting point metal layer is formed onto a surface of the low melting point by a thin film deposition process.

9. The fuse element according to claim 1 ,
wherein the high melting point metal layer has an antioxidation film formed on a surface thereof.

10. The fuse element according to claim 1 ,
wherein the low melting point metal layer and the high melting point metal layer are laminated in a plurality of alternating layers.

11. The fuse element according to claim 1 ,
wherein the low melting point metal layer is coated by the high melting point metal layer excluding two opposing end surfaces.

12. The fuse element according to claim 1 ,
wherein the fuse element is protected by a protective member on at least a portion of the exterior thereof.

13. The fuse element according to claim 1 ,
wherein the fuse element comprises a plurality of element components arranged in parallel; and
wherein the plurality of element components blow due to self-generated heat caused by a rate-exceeding current flowing therethrough.

14. The fuse element according to claim 13 ,
wherein the plurality of element components blow in a sequence.

15. The fuse element according to claim 14 ,
wherein all or part of cross-sectional area of one element component is smaller than cross-sectional area of other element components.

16. The fuse element according to claim 13 ,
wherein the plurality of element components comprise three element components arranged in parallel; and
wherein a central element component of the plurality of element components blows last.

17. The fuse element according to claim 16 ,
wherein all or part of cross-sectional area of the central element component is smaller than cross-sectional area of the element components which are located on both sides of the central element component.

18. The fuse element according to claim 1 , further comprising:
a terminal portion which is used as an external-connection terminal of the fuse device.

19. The fuse element according to claim 3 ,
wherein the high melting point metal layer has a film thickness of 0.5 μm or more.

20. The fuse element according to claim 1 ,
wherein the fuse element utilizes an action in which the low melting point metal layer erodes the high melting point metal layer and blowout occurs when a rate-exceeding current flows through the fuse element.

21. The fuse element according to claim 5 ,
wherein the high melting point metal layer is Ag or an alloy having Ag as a primary constituent.

22. A fuse device comprising:
an insulating substrate; and
a fuse element which is blown by self-generated heat when a rating-exceeding current flows therethrough mounted above the insulating substrate;
wherein the fuse element comprises a low melting point metal layer and a high melting point metal layer laminated onto the low melting point metal layer, the high melting point metal layer having a melting point higher than a melting point of the low melting point metal layer,
wherein the fuse element is connected between two electrodes on an insulating substrate and connected onto the electrodes by a solder at a reflow temperature of the solder,
wherein the fuse element has a laminated structure in which the low melting point metal layer is an inner layer and the high melting point metal layer is an outer layer laminated on an upper surface and on a lower surface of the low melting point metal layer, and
wherein the melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C., and
wherein the low melting point metal layer and the solder are melted at the reflow temperature of the solder.

23. The fuse device according to claim 22 ,
wherein the fuse element is mounted such that an interval exists between the fuse element and the insulating substrate.

24. The fuse device according to claim 22 ,
wherein the fuse element has a flux coated to a surface thereof.

25. The fuse device according to claim 22 ,
wherein vicinities above the insulating substrate are enclosed by a covering member.

26. The fuse device according to claim 22 ,
wherein the fuse element comprises a plurality of the fuse elements arranged in parallel or a plurality of the element components arranged in parallel; and
wherein the fuse element is blown by self-generated heat caused by a rate-exceeding current flowing therethrough.

27. The fuse device according to claim 26 ,
wherein the plurality of the fuse elements or the plurality of element components blow in a sequence.

28. The fuse device according to claim 27 ,
wherein all or part of cross-sectional area of one of the plurality of the fuse elements or one of the plurality of element components is smaller than cross-sectional area of other members among the plurality of the fuse elements or the plurality of element components.

29. The fuse device according to claim 26 ,
wherein the plurality of the fuse elements or the plurality of element components comprise three fuse elements or three element

Assignees

• Dexerials Corp

Inventors

• Yoneda Yoshihiro
• Komori Chisato
• Furuta Kazutaka
• Utsunomiya Yasushi

Classifications

• H01H2207/02

  Solder · CPC title

• H01H85/06 Primary

  characterised by the fusible material (H01H85/11 takes precedence) · CPC title

• H01H85/50

  the fuse having contacts at opposite ends for co-operation with the base · CPC title

• H01H85/48

  Protective devices wherein the fuse is carried or held directly by the base · CPC title

• H01H85/11 Primary

  with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices · CPC title