Glass-ceramic-ferrite composition and electronic component

Patent metadata

Field	Value
Publication number	US-10600549-B2
Application number	US-201715583625-A
Country	US
Kind code	B2
Filing date	May 1, 2017
Priority date	May 26, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A glass-ceramic-ferrite composition containing a glass, a ferrite, and a ceramic filler, in which the glass contains, by weight, about 0.5% to about 5.0% R2O (R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al2O3, about 10.0% to about 25.0% B2O3, and about 70.0% to 85.0% SiO2 with respect to the total weight of the glass, the percentage by weight of the ferrite is about 10% to 80% with respect to the total weight of the composition, the ceramic filler contains at least forsterite selected from forsterite and quartz, the percentage by weight of the forsterite is about 1% to about 10% with respect to the total weight of the composition, and the percentage by weight of the quartz is about 40% or less with respect to the total weight of the composition.

First claim

What is claimed is:

1. A glass-ceramic-ferrite composition, comprising:
a glass;
a ferrite; and
a ceramic filler, wherein
the glass contains, by weight, about 0.5% or more and about 5.0% or less R 2 O (where R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al 2 O 3 , about 10.0% or more and about 25.0% or less B 2 O 3 , and about 70.0% or more and about 85.0% or less SiO 2 with respect to a total weight of the glass,
a percentage by weight of the ferrite is about 10% or more and about 80% or less with respect to a total weight of the glass-ceramic-ferrite composition,
the ceramic filler contains at least forsterite selected from forsterite and quartz,
a percentage by weight of the forsterite is about 1% or more and about 10% or less with respect to the total weight of the glass-ceramic-ferrite composition,
a percentage by weight of the quartz is about 40% or less with respect to the total weight of the glass-ceramic-ferrite composition, and
a percentage of a total weight of the ferrite and the ceramic filler is about 85% or less with respect to the total weight of the glass-ceramic-ferrite composition.

2. The glass-ceramic-ferrite composition according to claim 1 , wherein the percentage by weight of the ferrite is about 40% or less with respect to the total weight of the glass-ceramic-ferrite composition.

3. The glass-ceramic-ferrite composition according to claim 1 , wherein the percentage of the total weight of the ferrite and the quartz is about 40% or more with respect to the total weight of the glass-ceramic-ferrite composition.

4. An electronic component, comprising:
a body containing the glass-ceramic-ferrite composition according to claim 1 ; and
an inner conductor provided in the body.

5. The electronic component according to claim 4 , wherein the inner conductor contains Ag.

6. The glass-ceramic-ferrite composition according to claim 1 , wherein
the ceramic filler contains both forsterite and quartz.

7. A glass-ceramic-ferrite composition, comprising:
a glass;
a ferrite; and
a ceramic filler, wherein
the glass is a borosilicate glass containing R (where R represents at least one selected from the group consisting of Li, Na, and K) and Al, and the glass contains, by weight, about 0.5% or more and about 5.0% or less R in the form of R 2 O, about 2.6% or less Al, about 3.1% or more and about 7.8% or less B, and about 32.7% or more and about 39.7% or less Si with respect to a total weight of the glass,
a percentage by weight of the ferrite is about 10% or more and about 80% or less with respect to a total weight of the glass-ceramic-ferrite composition,
the ceramic filler contains at least forsterite selected from forsterite and quartz,
a percentage by weight of the forsterite is about 1% or more and about 10% or less with respect to the total weight of the glass-ceramic-ferrite composition,
a percentage by weight of the quartz is about 40% or less with respect to the total weight of the glass-ceramic-ferrite composition, and
a percentage of a total weight of the ferrite and the ceramic filler is about 85% or less with respect to the total weight of the glass-ceramic-ferrite composition.

8. The glass-ceramic-ferrite composition according to claim 7 , wherein the percentage by weight of the ferrite is about 40% or less with respect to the total weight of the glass-ceramic-ferrite composition.

9. The glass-ceramic-ferrite composition according to claim 7 , wherein the percentage of the total weight of the ferrite and the quartz is about 40% or more with respect to the total weight of the glass-ceramic-ferrite composition.

10. An electronic component, comprising:
a body containing the glass-ceramic-ferrite composition according to claim 7 ; and
an inner conductor provided in the body.

11. The electronic component according to claim 10 , wherein the inner conductor contains Ag.

12. A method for producing a glass-ceramic-ferrite composition, comprising:
providing a mixture containing a glass, a ferrite, and a ceramic filler; and
firing the mixture to form a glass-ceramic-ferrite composition, wherein
the glass contains, by weight, about 0.5% or more and about 5.0% or less R 2 O (where R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al 2 O 3 , about 10.0% or more and about 25.0% or less B 2 O 3 , and about 70.0% or more and about 85.0% or less SiO 2 with respect to a total weight of the glass,
a percentage by weight of the ferrite is about 10% or more and about 80% or less with respect to a weight of the mixture,
the ceramic filler contains at least forsterite selected from forsterite and quartz,
a percentage by weight of the forsterite is about 1% or more and about 10% or less with respect to the weight of the mixture,
a percentage by weight of the quartz is about 40% or less with respect to the weight of the mixture, and
a percentage of a total weight of the ferrite and the ceramic filler is about 85% or less with respect to the weight of the mixture.

13. A method for producing an electronic component that includes a body containing a glass-ceramic-ferrite composition and an internal conductor provided in the body, the method comprising:
providing a mixture containing a glass, a ferrite, and a ceramic filler;
forming the mixture into sheets;
applying a conductive paste onto the sheets to form a conductive pattern;
stacking the sheets including the conductive pattern to form a multilayer body; and
firing the multilayer body to form an electronic component that includes a body containing a glass-ceramic-ferrite composition and an inner conductor provided in the body, wherein
the glass contains, by weight, about 0.5% or more and about 5.0% or less R 2 O (where R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al 2 O 3 , about 10.0% or more and about 25.0% or less B 2 O 3 , and about 70.0% or more and about 85.0% or less SiO 2 with respect to a total weight of the glass,
a percentage by weight of the ferrite is about 10% or more and about 80% or less with respect to a weight of the mixture,
the ceramic filler contains at least forsterite selected from forsterite and quartz,
a percentage by weight of the forsterite is about 1% or more and about 10% or less with respect to the weight of the mixture,
a percentage by weight of the quartz is about 40% or less with respect to the weight of the mixture, and
a percentage of a total weight of the forsterite and the ceramic filler is about 85% or less with respect to the weight of the mixture.

14. The method according to claim 13 , wherein the conductive paste contains Ag.

Assignees

• Murata Manufacturing Co

Inventors

• Soda Yoshito

Classifications

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• C04B2235/3445

  Magnesium silicates, e.g. forsterite · CPC title

• C03C3/091 Primary

  containing aluminium · CPC title

• C04B35/14 Primary

  based on silica · CPC title

• H01F3/08

  made from powder (powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06) · CPC title