Light module

Patent metadata

Field	Value
Publication number	US-10598367-B2
Application number	US-201715448174-A
Country	US
Kind code	B2
Filing date	Mar 2, 2017
Priority date	Mar 2, 2016
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A light module serves for inserting into a housing of a semiconductor lamp and comprises: a driver ( 2 ), a cooling element, a light generator, abutting the cooling element, with at least one semiconductor light source, which is electrically connected with the driver, and an optical refraction element covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator onto the cooling element. A semiconductor lamp comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing. The invention is also applicable to replacement or retrofit lamps, in particular with a pin base, particularly a bipin base, e.g. to retrofit lamps for replacing halogen lamps, for example of the type MR16.

First claim

The invention claimed is:

1. A light module configured for insertion into a housing of a semiconductor lamp, the light module comprising:
a driver;
a cooling element;
a light generator abutting the cooling element, the light generator comprising at least one semiconductor light source populated on a circuit board and electrically connected with the driver; and
an optical refraction element covering the at least one semiconductor light source, wherein the optical refraction element includes:
a first structure extending through a bottom wall of the cooling element and engaging the cooling element so that the optical refraction element is fastened on the cooling element; and
a second structure that presses the light generator onto the cooling element.

2. The light module according to claim 1 , wherein the optical refraction element is fastened on the cooling element and is supported on the light generator.

3. The light module according to claim 1 , wherein:
the first structure comprises at least one lock hook protruding at a rear of the optical refraction element, which is locked with the cooling element; and
the second structure comprises at least one foot protruding at the rear of the optical refraction element, which is supported on the light generator.

4. The light module according to claim 1 , wherein the circuit board of the light generator directly abuts the cooling element.

5. The light module according to claim 1 , wherein the driver is connected with the light generator through solder pins.

6. The light module according to claim 1 , wherein the driver is pressed into the cooling element and soldered to the light generator.

7. The light module according to claim 1 , wherein the cooling element has an inclined sidewall configured to be placed against the housing, a front edge of which is rounded outwards.

8. A semiconductor lamp comprising:
the light module according to claim 1 ; and
a housing open at a front side thereof, into which the light module is inserted at the front side and at which the light module is fastened.

9. The light module according to claim 1 , wherein the cooling element is cup-shaped, the bottom wall of which is flat, and wherein the light generator abuts the flat bottom wall.

10. The light module according to claim 1 , wherein the cooling element and the optical refraction element interface to enclose the light generator in a space defined by such enclosure.

11. The light module according to claim 1 , wherein the cooling element is shorter in height than a length of the first structure.

12. The light module according to claim 1 , wherein the second structure terminates within an interior space of the cooling element.

13. The light module according to claim 1 , wherein in extending through the bottom wall of the cooling element and engaging the cooling element, the first structure passes through a first through-hole defined in the circuit board and a second through-hole defined in the cooling element.

14. The light module according to claim 1 , wherein the first structure extends through the circuit board.

15. The light module according to claim 1 , wherein:
a thermal interface material layer is sandwiched between the circuit board and the cooling element; and
the first structure extends through the thermal interface material layer.

16. The light module according to claim 1 , wherein the optical refraction element including the first structure and the second structure is formed as a single-piece body.

17. The light module according to claim 3 , wherein the at least one lock hook has an inclined contact surface configured to engage with the bottom wall of the cooling element.

18. The semiconductor lamp according to claim 8 , wherein the cooling element has an inclined sidewall configured to be placed against the housing, a front edge of which is rounded outwards, wherein the light module is glued to the housing via an adhesive present between the cooling element of the light module and the housing.

19. The semiconductor lamp according claim 8 , wherein the semiconductor lamp is a MR16 or PAR16 retrofit lamp.

20. A method for producing a semiconductor lamp, the method comprising:
providing a light module configured for insertion into a housing of the semiconductor lamp, the light module comprising:
a driver;
a cooling element;
a light generator, abutting the cooling element, with at least one semiconductor light source electrically connected with the driver; and
an optical refraction element covering the at least one semiconductor light source, wherein the optical refraction element is fastened on the cooling element and presses the light generator onto the cooling element;
wherein the cooling element has an inclined sidewall configured to be placed against the housing, a front edge of which is rounded outwards; and

inserting the light module into a housing of the semiconductor lamp, wherein the housing is open at a front side thereof, into which housing the light module is inserted at the front side and at which the light module is fastened, wherein the light module is glued to the housing via an adhesive present between the cooling element of the light module and the housing, wherein the adhesive is applied to an inner side of the housing and then the light module is inserted into the housing such that the cooling element of the light module with the front edge which is rounded outwards at least partially takes along the adhesive during its movement;
wherein at least the driver, the cooling element, the light generator, and the optical refraction element are assembled to provide the light module and then the light module is inserted into the housing.

Assignees

• Osram Gmbh
• Ledvance Gmbh

Inventors

• Klafta Thomas
• Holland Johann
• Loew Martin
• Vuc Marcel
• Medl Josef

Classifications

• F21K9/233

  specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps · CPC title

• F21V17/164

  the parts being subjected to bending, e.g. snap joints · CPC title

• F21K9/20

  Light sources comprising attachment means · CPC title

• F21V17/101

  permanently, e.g. welding, gluing or riveting · CPC title

• F21V23/005

  the substrate is supporting also the light source · CPC title