Silver-plated product and method for producing same

Patent metadata

Field	Value
Publication number	US-10597791-B2
Application number	US-201415034320-A
Country	US
Kind code	B2
Filing date	Oct 31, 2014
Priority date	Nov 8, 2013
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A silver-plated product, wherein the preferred orientation plane of a surface layer of silver is {111} plane and wherein the ratio of the full-width at half maximum of an X-ray diffraction peak on {111} plane after heating the silver-plated product at 50° C. for 168 hours to the full-width at half maximum of an X-ray diffraction peak on {111} plane before the heating of the silver-plated product is not less than 0.5, is produced by forming the surface layer on a base material by electroplating at a liquid temperature of 12 to 24° C. and a current density of 3 to 8 A/dm 2 in a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium, so as to cause the product of the concentration of potassium cyanide and the current density to be 840 g·A/L·dm 2 or less.

First claim

The invention claimed is:

1. A silver-plated product comprising:
a base material; and
a surface layer of silver having a purity of 99.9% or more, the surface layer being formed on the base material,
wherein the surface layer has a preferred orientation plane which is {111} plane, and a ratio of the full-width at half maximum of an X-ray diffraction peak on {111} plane after heating the silver-plated product at 50° C. for 168 hours to the full-width at half maximum of an X-ray diffraction peak on {111} plane before the heating of the silver-plated product is not less than 0.5.

2. The silver-plated product as set forth in claim 1 , which has a reflection density of not less than 1.0.

3. The silver-plated product as set forth in claim 1 , which has a Vickers hardness Hv of not less than 100.

4. The silver-plated product as set forth in claim 1 , which has a Vickers hardness Hv of not less than 100 after heating the silver-plated product at 50° C. for 168 hours.

5. The silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy.

6. The silver-plated product as set forth in claim 1 , wherein an underlying layer of nickel is formed between said base material and said surface layer.

7. The silver-plated product as set forth in claim 1 , wherein the silver-plated product is an electrical contact.

8. The silver-plated product as set forth in claim 1 , wherein the silver-plated product is an electrical terminal part.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Sadamori Shunki
• Miyazawa Hiroshi
• Ogata Masafumi
• Shinohara Keisuke

Classifications

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25F1/00

  Electrolytic cleaning, degreasing, pickling or descaling · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• H01H1/02

  characterised by the material thereof {(containing gas-evolving material H01H33/765)} · CPC title