Method of producing molded article having conductive circuit and preform having conductive circuit

Patent metadata

Field	Value
Publication number	US-10596743-B2
Application number	US-201615540031-A
Country	US
Kind code	B2
Filing date	Jun 30, 2016
Priority date	Sep 28, 2015
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

[Problem] To provide: a method of producing molded article having conductive circuit, whereby a molded article having a conductive circuit following a three-dimensional curved surface can be easily obtained even using blow molding; and a preform having a conductive circuit, used to obtain said molded article having a conductive circuit. [Solution] This method of producing a molded article having a conductive circuit is configured such that: an ink having stretchability is used and a conductive circuit layer is formed upon a preform; and the preform is blow-molded and a molded article having a conductive circuit is obtained. This preform having a conductive circuit is for obtaining a molded article having a conductive circuit, by using blow molding, and is configured so as to have a conductive circuit layer Ruined upon the preform by using a stretchable ink.

First claim

What is claimed is:

1. A method of producing a molded article having a conductive circuit comprising:
a process of forming the conductive circuit layer on a preform using an ink having stretchability;
blow molding the preform to obtain the molded article having the conductive circuit; and
a process of installing an electronic component on the preform or on the molded article having a conductive circuit to be electrically connected to the conductive circuit layer.

2. The method of producing a molded article having a conductive circuit according to claim 1 , wherein the process of forming the conductive circuit layer on the preform includes:
a process of forming a transfer layer including the conductive circuit layer formed on a substrate sheet using the ink to obtain a transfer sheet; and
a process of disposing the transfer sheet on the preform, applying heat and pressure to the transfer sheet in order to transfer the transfer layer to the preform, and removing the substrate sheet.

3. The method of producing a molded article having a conductive circuit according to claim 2 , further comprising:
a process of forming a pattern layer between the substrate sheet and the conductive circuit layer.

4. The method of producing a molded article having a conductive circuit according to claim 3 , further comprising:
a process of forming a protective layer between the substrate sheet and the pattern layer.

5. The method of producing a molded article having a conductive circuit according to claim 1 , wherein the process of forming the conductive circuit layer on the preform includes:
a process of printing the conductive circuit layer onto the preform using the ink.

6. The method of producing a molded article having a conductive circuit according to claim 5 , further comprising:
a process of forming a pattern layer on the conductive circuit layer.

7. The method of producing a molded article having a conductive circuit according to claim 6 , further comprising:
a process of forming a protective layer on the pattern layer.

8. The method of producing a molded article having a conductive circuit according to claim 1 , wherein the conductive circuit layer is formed in a part in which an extension rate of the preform is 40% or less.

9. The method of producing a molded article having a conductive circuit according to claim 1 , wherein the ink contains any one of silver, PEDOT, carbon black, and a carbon nanotube.

Assignees

• Nissha Printing

Inventors

• Taniguchi Chuzo
• Nishikawa Tetsu
• Nakamura Akihisa
• Nakagawa Hideyuki
• Miyashita Shuhei

Classifications

• B29L2031/7158

  Bottles · CPC title

• B29K2995/0005

  Conductive · CPC title

• B29C2049/026

  Operations & Transport · mapped topic

• B29C49/02 Primary

  Combined blow-moulding and manufacture of the preform or the parison · CPC title

• B29C49/22

  using multilayered preforms or parisons · CPC title