Endovascular device configured for sequenced shape memory deployment in a body vessel

Patent metadata

Field	Value
Publication number	US-10596016-B2
Application number	US-201715699442-A
Country	US
Kind code	B2
Filing date	Sep 8, 2017
Priority date	Sep 8, 2017
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

A method of sequenced deployment of an endovascular device comprises delivering, into a body vessel, a Nitinol structural element comprising n deployable regions each having a local austenite finish temperature above body temperature. The local austenite finish temperature of at least one of the n deployable regions is different from the local austenite finish temperature of another of the n deployable regions. During and/or after delivery, the Nitinol structural element is heated above body temperature, and each of the n deployable regions is deployed when the local austenite finish temperature thereof is reached. Thus, a deployed configuration of an endovascular device is achieved in a sequenced deployment process.

First claim

The invention claimed is:

1. An endovascular device configured for sequenced deployment in a body vessel, the endovascular device comprising:
a monolithic Nitinol structural element having n deployable regions, where n is an integer greater than 1, each of the n deployable regions comprising a local austenite finish temperature above body temperature,
wherein the local austenite finish temperature of at least one of the n deployable regions is different from the local austenite finish temperature of another of the n deployable regions, the endovascular device thereby being configured for sequenced deployment within a body vessel.

2. The endovascular device of claim 1 , wherein the monolithic Nitinol structural element comprises a fully deployed configuration after being heated to a temperature at or above a highest of the local austenite finish temperatures.

3. The endovascular device of claim 1 , wherein the local austenite finish temperature of an i th deployable region is represented by A fi , where 1≤i≤n and n is a positive integer, and
wherein all of the n deployable regions have different local austenite finish temperatures, A f1 ≠A f2 ≠ . . . ≠A fn .

4. The endovascular device of claim 1 , wherein each of the n deployable regions further comprises a local austenite start temperature above body temperature, and
wherein the local austenite start temperature of at least one of the n deployable regions is different from the local austenite start temperature of another of the deployable regions.

5. The endovascular device of claim 4 , wherein the local austenite start temperature of an i th deployable region is represented by A si , where 1≤i≤n and n is a positive integer, and
wherein all of the n deployable regions have different local austenite start temperatures, A s1 ≠A s2 ≠ . . . ≠A sn .

6. The endovascular device of claim 1 , wherein the monolithic Nitinol structural element comprises from about 50 at. % to about 52 at. % nickel.

7. The endovascular device of claim 1 comprising a stent, filter, cage, fastener, ratchet or anchor.

8. A method of sequenced deployment of an endovascular device, the method comprising:
delivering an endovascular device comprising a monolithic Nitinol structural element into a body vessel, the Nitinol structural element comprising n deployable regions each having a local austenite finish temperature above body temperature, the local austenite finish temperature of at least one of the n deployable regions being different from the local austenite finish temperature of another of the n deployable regions; and
heating the Nitinol structural element above body temperature,
wherein each of the n deployable regions is deployed when the local austenite finish temperature thereof is reached, thereby achieving a deployed configuration of the endovascular device in a sequenced deployment process.

9. The method of claim 8 , wherein the local austenite finish temperature of an i th deployable region is represented by A fi , where 1≤i≤n and n is a positive integer, the i th deployable region being deployed when the temperature reaches A fi , and
wherein all of the n deployable regions have different local austenite finish temperatures, A f1 ≠A f2 ≠ . . . ≠A fn .

10. The method of claim 8 , wherein the heating is carried out uniformly along a length of the monolithic Nitinol structural element, the temperature of the Nitinol structural element being uniform to within ±1° C.

11. The method of claim 8 , wherein the heating is carried out by a heat source selected from the group consisting of: induction heater and resistive heater.

12. The method of claim 8 , wherein the n th deployable region deploys to a fixed configuration where the n th deployable region is attached to another portion of the Nitinol structural element.

13. The method of claim 8 , wherein a martensite start temperature of the Nitinol structural element is below body temperature, the deployed configuration remaining stable upon cooling after completion of the heating.

14. The method of claim 8 , wherein the Nitinol structural element comprises a wire, rod, tube, or strip, and
wherein the endovascular device comprises a stent, filter, cage, fastener, ratchet or anchor.

15. An endovascular device configured for sequenced deployment in a body vessel, the endovascular device comprising:
a Nitinol structural element having n deployable regions, where n is an integer greater than 2, each of the n deployable regions comprising a local austenite finish temperature above body temperature,
wherein the local austenite finish temperature of at least one of the n deployable regions is different from the local austenite finish temperature of another of the n deployable regions, the endovascular device thereby being configured for sequenced deployment within a body vessel.

Assignees

• Cook Medical Technologies Llc

Inventors

• Kim Woong

Classifications

• A61F2240/001

  Designing or manufacturing processes · CPC title

• A61F2210/0023

  operated at different temperatures whilst inside or touching the human body, heated or cooled by external energy source or cold supply · CPC title

• A61F2210/0071

  thermoplastic · CPC title

• A61L31/14

  Materials characterised by their function or physical properties {, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials} · CPC title

• A61F2/88 Primary

  the wire-like elements formed as helical or spiral coils · CPC title