Processing of thin film organic ferroelectric materials using pulsed electromagnetic radiation
US-2017114241-A1 · Apr 27, 2017 · US
US10593857B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10593857-B2 |
| Application number | US-201415033892-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 27, 2014 |
| Priority date | Nov 15, 2013 |
| Publication date | Mar 17, 2020 |
| Grant date | Mar 17, 2020 |
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A process for manufacturing a piezoelectric and/or pyroelectric device comprising a polyvinylidene fluoride film, the process comprising a step of forming at least one portion of a layer of a solution comprising a solvent and a compound comprising polyvinylidene fluoride and a step of irradiating the portion with pulses of at least one ultraviolet radiation. The irradiating step enables the formation of at least two β crystalline phases having different orientations.
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The invention claimed is: 1. A method of manufacturing a piezoelectric and/or pyroelectric device comprising a film comprising poly-vinylidene fluoride and/or at least one copolymer of poly-vinylidene fluoride, the method comprising the steps of: forming at least one portion of a layer of a solution comprising a solvent and a compound comprising poly-vinylidene fluoride and/or at least the copolymer of poly-vinylidene fluoride; and irradiating at least the portion with pulses of at least one ultraviolet radiation to provide the film having piezoelectric and/or pyroelectric properties. 2. The method of claim 1 , wherein the compound comprises poly-vinylidene fluoride, poly(vinylidene fluoride-trifluoro ethylene), poly(vinylidene fluoride-tetrafluoroethylene) or a mixture of at least two of these polymers. 3. The method of claim 1 , wherein the compound further comprises ceramic particles. 4. The method of claim 1 , wherein a duration of each pulse is in the range from 500 μs to 2 ms. 5. The method of claim 1 , wherein a fluence of the ultraviolet radiation is in the range from 10 J/cm 2 to 25 J/cm 2 . 6. The method of claim 1 , wherein the solvent has a boiling temperature in the range from 110° C. to 140° C. 7. The method of claim 1 , wherein the solution comprises from 80% to 95% wt. of the solvent and from 5% to 20% wt. of the compound. 8. The method of claim 1 , further comprising the steps of: providing a substrate; depositing on the substrate a coating reflecting the ultraviolet radiation; and forming the film at least partially on the coating. 9. The method claim 1 , wherein the solvent is capable of at least partially absorbing the ultraviolet radiation.
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