Wiring board, and manufacturing method

Patent metadata

Field	Value
Publication number	US-10593606-B2
Application number	US-201615574230-A
Country	US
Kind code	B2
Filing date	May 11, 2016
Priority date	May 25, 2015
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

The present disclosure relates to a wiring board and a manufacturing method that simultaneously solve problems of stress and heat release A wiring board as one aspect of the present disclosure includes a glass substrate as a core member, and a plurality of through holes arranged in a cyclic manner in the glass substrate. The through holes are filled with different kinds of filling materials. A wiring board manufacturing method as one aspect of the present disclosure includes: a through hole formation step of forming through holes arranged in a cyclic manner in a glass substrate serving as a core member; and a filling step of forming a protecting sheet on the glass substrate, and filling through holes with a filling material through openings formed in the protecting sheet. The present disclosure can be applied to a wiring board that has a through-electrode-equipped glass substrate as the core member.

First claim

What is claimed is:

1. A wiring board comprising:
a glass substrate as a core member;
a plurality of through holes arranged in a cyclic manner in the glass substrate, wherein the through holes are filled with different kinds of filling materials, and wherein through hole groups each formed with the plurality of through holes filled with different kinds of filling materials are arranged in a cyclic manner in the glass substrate;
a plurality of normal through electrodes formed with through holes not included in the plurality of holes that are filled with a first conductive material; and
a plurality of low-expansion through electrodes formed with through holes included in the plurality of through holes that are filled with a second conductive material, the second conductive material having a linear expansion coefficient closer to a linear expansion coefficient of glass than to a linear expansion coefficient of the first conductive material, wherein the normal through electrodes and the low-expansion through electrodes are arranged in a cyclic and symmetric manner, and wherein the normal through electrodes and the low-expansion through electrodes are alternately arranged at corners of squares arranged in horizontal and vertical directions.

2. The wiring board according to claim 1 , further comprising a dummy through electrode formed with the through hole not filled with a conductive material.

3. The wiring board according to claim 1 , wherein
the first conductive material is Cu, and
the second conductive material is W.

4. The wiring board according to claim 1 , further comprising a heat-release through electrode formed with a through hole filled with one of a carbon-based material and a metal material, the one of the carbon-based material and the metal material having a higher thermal conductivity than a thermal conductivity of glass.

5. The wiring board according to claim 4 , wherein the carbon-based material is carbon nanotube.

6. The wiring board according to claim 1 , further comprising
a magnetic through electrode formed with the through hole filled with a magnetic material.

7. The wiring board according to claim 6 , wherein the magnetic material is one of an iron oxide, a chromium oxide, cobalt, and a ferrite.

8. A wiring board comprising:
a glass substrate as a core member;
a plurality of through holes arranged in a cyclic manner in the glass substrate, wherein the through holes are filled with different kinds of filling materials, and wherein through hole groups each formed with the plurality of through holes filled with different kinds of filling materials are arranged in a cyclic manner in the glass substrate;
a plurality of normal through electrodes formed with through holes included in the plurality of through holes that are filled with a first conductive material; and
a plurality of low-expansion through electrodes formed with through holes included in the plurality of through holes that are filled with a second conductive material, the second conductive material having a linear expansion coefficient closer to a linear expansion coefficient of glass than to a linear expansion coefficient of the first conductive material, wherein the normal through electrodes and the low-expansion through electrodes are arranged in a cyclic and symmetric manner, and wherein the normal through electrodes and the low-expansion through electrodes are alternately arranged at corners and centers of regular hexagons arranged without space.

9. The wiring board according to claim 8 , further comprising a heat-release through electrode formed with a through hole filled with one of a carbon-based material and a metal material, the one of the carbon-based material and the metal material having a higher thermal conductivity than a thermal conductivity of glass.

10. The wiring board according to claim 9 , wherein the carbon-based material is carbon nanotube.

11. The wiring board according to claim 8 , further comprising
a magnetic through electrode formed with a through hole filled with a magnetic material.

12. The wiring board according to claim 11 , wherein the magnetic material is one of an iron oxide, a chromium oxide, cobalt, and a ferrite.

13. The wiring board according to claim 8 , further comprising a dummy through electrode formed with a through hole not filled with filling conductivity.

14. The wiring board according to claim 8 , wherein
the first conductive material is Cu, and
the second conductive material is W.

Assignees

• Sony Corp

Inventors

• Seki Kousuke
• Kato Yusaku
• Mitarai Shun
• Rokuhara Shinji

Classifications

• H05K2201/0323

  Carbon · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• H05K3/445

  having insulated holes or insulated via connections through the metal core · CPC title

• H05K2201/026

  Nanotubes or nanowires · CPC title