Production method for R-T-B sintered magnet

US10593472B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10593472-B2
Application numberUS-201515509529-A
CountryUS
Kind codeB2
Filing dateSep 8, 2015
Priority dateSep 11, 2014
Publication dateMar 17, 2020
Grant dateMar 17, 2020

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Abstract

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A step of, while a powder of an RLM alloy (where RL is Nd and/or Pr; M is one or more elements selected from among Cu, Fe, Ga, Co, Ni and Al) which is produced through atomization and a powder of an RH compound (where RH is Dy and/or Tb) are present on the surface of a sintered R-T-B based magnet, performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower is included. The RLM alloy contains RL in an amount of 65 at % or more, and the melting point of the RLM alloy is equal to or less than the temperature of the heat treatment. The heat treatment is performed while the RLM alloy powder and the RH compound powder are present on the surface of the sintered R-T-B based magnet at a mass ratio of RLM alloy:RH compound=9.6:0.4 to 5:5.

First claim

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The invention claimed is: 1. A method for producing a sintered R-T-B based magnet, comprising: a step of providing a sintered R-T-B based magnet, where R is one or more rare-earth elements, T is one or more transition metal elements, and B is boron or is boron and carbon; and a step of performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower, while a powder of an Nd—Cu alloy consisting of Nd and Cu which is produced through atomization and a powder of an RH compound (where RH is Dy and/or Tb; and the RH compound is one or more selected from among an RH oxide, an RH fluoride, and an RH oxyfluoride) are present on a surface of the sintered R-T-B based magnet, wherein, the Nd—Cu alloy contains Nd in an amount of 50 at % or more, and a melting point of the Nd—Cu alloy is equal to or less than a temperature of the heat treatment; a particle size of the RH compound powder is smaller than a particle size of the Nd—Cu alloy powder; and the heat treatment is performed while the Nd—Cu alloy powder and the RH compound powder are present on the surface of the sintered R-T-B based magnet at a mass ratio of Nd—Cu alloy: RH compound=9.6:0.4 to 5:5 so that the RH compound powder is reduced by the Nd—Cu alloy powder to diffuse an RH element that is contained in the RH compound powder into the sintered R-T-B based magnet. 2. The method for producing a sintered R-T-B based magnet of claim 1 , wherein, on the surface of the sintered R-T-B based magnet, the RH element that is contained in the RH compound powder has a mass of 0.03 to 0.35 mg per 1 mm 2 of the surface. 3. The method for producing a sintered R-T-B based magnet of claim 1 , comprising a step of applying onto the surface of the sintered R-T-B based magnet a slurry containing a powder mixture of an Nd—Cu alloy powder and an RH compound powder and a binder and/or a solvent. 4. The method for producing a sintered R-T-B based magnet of claim 1 , wherein a slurry containing a powder mixture of an Nd—Cu alloy powder and an RH compound powder and a binder and/or a solvent are applied on a surface of an upper face of the sintered R-T-B based magnet, and a layer of Nd—Cu alloy powder particles, which layer is one particle thick or greater, is formed on the surface of the sintered R-T-B based magnet. 5. The method for producing a sintered R-T-B based magnet of claim 1 , wherein the RH compound is an RH fluoride and/or an RH oxyfluoride.

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What does patent US10593472B2 cover?
A step of, while a powder of an RLM alloy (where RL is Nd and/or Pr; M is one or more elements selected from among Cu, Fe, Ga, Co, Ni and Al) which is produced through atomization and a powder of an RH compound (where RH is Dy and/or Tb) are present on the surface of a sintered R-T-B based magnet, performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower…
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01F41/0266. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 17 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).