Imaging device

Patent metadata

Field	Value
Publication number	US-10591822-B2
Application number	US-201816046973-A
Country	US
Kind code	B2
Filing date	Jul 26, 2018
Priority date	May 27, 2015
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

An imaging device for projecting individually controllable laser beams onto an imaging surface movable in an X-direction. The device includes a plurality of semiconductor chips each comprising a plurality of laser beam emitting elements arranged in a main array of M·N. The chips are mounted such that each pair of adjacent chips in the Y-direction are offset from one another in the X-direction and, if activated continuously, the emitted laser beams of the two chips of said pair trace on the imaging surface a set of parallel lines that are substantially uniformly spaced in the Y-direction. In addition to the M·N elements of the main array, each chip comprises at least one additional column on one or each side, each additional column containing at least one selectively operable element capable of compensating for any misalignment in the Y-direction in the relative positioning of the adjacent chips on the support.

First claim

The invention claimed is:

1. A method of projecting individually controllable laser beams onto an imaging surface that is movable relative to an imaging device, the method comprising:
providing an imaging device for projecting individually controllable laser beams onto an imaging surface, the imaging device and imaging surface being movable relative to each other in a reference X-direction, the imaging device comprising:
a plurality of semiconductor chips each of which comprises a plurality of individually controllable laser beam emitting elements arranged in a two dimensional main array of M rows and N columns, the emitting elements in each row having a uniform spacing A r and the emitting elements in each column having a uniform spacing a c ;
the chips are mounted on a support such that the main arrays of each pair of chips that are adjacent one another in a reference Y-direction, transverse to the X-direction, are offset from one another in the X-direction;
wherein were all the emitting elements to be activated continuously and were the chips and the imaging surface to be relatively moved in the X-direction, the emitted laser beams of the two chips of the pair would trace on the imaging surface 2·M·N parallel lines that extend in the X-direction and are uniformly spaced from one another in the Y-direction, by a nominal distance A r /M, whereby the laser beams of each chip trace a set of M·N lines without overlapping the set of lines of the other chip;
each chip further comprises at least one additional column in addition to the N columns of elements of the main array, the additional column being disposed on one side of the main array along the Y-direction, and containing at least one selectively operable laser emitting element capable of tracing at least one additional line that lies between the respective sets of M·N lines of each chip and that is spaced from two adjacent lines, each from a respective one of the sets, by a distance smaller than the uniform element spacing in each row A r ; and,
individually projecting the laser beams onto the imaging surface.

2. A method as claimed in claim 1 , further comprising the step of controllably projecting a laser beam emanating from the at least one emitting element of the at least one additional column of a first of two adjacent chips, the laser beam impinging on the imaging surface between laser beams impinging on the imaging surface from at least two laser beams emanating from emitting elements at the edge of the respective main arrays of the first and a second of two adjacent chips.

3. A method as claimed in claim 2 , wherein the additional column of the first chip of the pair of chips and the additional column of the second chip are disposed between the respective main arrays of the first and second chip, the method further comprising the step of controllably projecting a first laser beam emanating from one emitting element of the additional column of the first chip and a second laser beam emanating from the additional column of the second chip, such that the first and second laser beams impinge on the imaging surface at sufficient proximity to cause the energy of the respective laser beams to act additively thereupon.

4. A method as claimed in claim 3 , further comprising the step of controlling the energy of each of the first and second laser beams such that each of the beams act on the imaging surface at an energy level below a predetermined threshold, and the additively combined energy level of the two beams surpasses the predetermined threshold, the additively combined energy level impinges on the imaging surface at a location between the respective first and second beam centers.

5. A method as claimed in claim 1 , further comprising the step of controllably projecting a first and second laser beams emanating respectively from two emitting elements adjacent in the Y direction, at controlled intensity such that the first and second laser beams impinge on the imaging surface at sufficient proximity and intensity to cause the energy of the respective beams to act additively thereupon.

6. A method as claimed in claim 5 , further comprising the step of controlling the energy of first and second laser beams such that each of the beams act on the imaging surface at an energy level below a predetermined threshold, and the additively combined energy level of the first and second laser beams surpasses the predetermined threshold, the additively combined energy level impinges on the imaging surface at a location between the respective first and second beam centers.

7. A method as claimed in claim 1 , wherein the at least one additional column comprises a plurality of emitting elements.

8. A method as claimed in claim 1 , wherein the imaging device further comprises a plurality of lens systems, each serving to focus the laser beams of all the emitting elements of a respective chip onto the imaging surface.

9. A method as claimed in claim 8 , wherein at least one of the plurality of lens systems comprises at least one gradient index (GRIN) rod.

10. A method as claimed in claim 9 , wherein the at least one GRIN rod is of circular cross-section having a diameter equal to 2·N·A r .

11. A method as claimed in claim 1 , wherein each chip comprises at least a second additional column, such that at least one additional column is disposed on each side of the respective main array, the second additional column comprising at least one individually controllable laser beam emitting element.

12. A method as claimed in claim 1 , wherein each chip has an equal number of rows and columns of emitting elements in the main array.

13. A method as claimed in claim 1 , wherein the surface of the support is formed of, or coated with, an electrical insulator, and further comprising a plurality of thin film conductors formed on the electrically insulating surface for supplying electrical signals and power to the chips.

14. A method as claimed in claim 1 , wherein the support is liquid cooled.

15. A method as claimed in claim 1 , wherein the emitting elements of at least one chip are of vertical cavity surface emitting lasers (VCSEL) type.

Assignees

• Landa Labs 2012 Ltd

Inventors

• Rubin Ben Haim Nir
• Nagler Michael
• Landa Benzion
• Kashti Tamar
• Aknin Ofer
• Yogev Ronen
• Tzur Itai

Classifications

• G03G15/04072 Primary

  by laser · CPC title

• B41J2/447 Primary

  using arrays of radiation sources (B41J2/475 takes precedence) · CPC title

• G03G15/043

  with means for controlling illumination or exposure (G03G15/041 takes precedence) · CPC title

• G03G15/342

  by forming a uniform powder layer and then removing the non-image areas · CPC title

• B41J2/45

  using light-emitting diode {[LED] or laser} arrays · CPC title