Low back-reflection taper coupler

Patent metadata

Field	Value
Publication number	US-10591671-B2
Application number	US-201816235833-A
Country	US
Kind code	B2
Filing date	Dec 28, 2018
Priority date	Dec 28, 2018
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

Some embodiments of the present disclosure describe an apparatus for III/V-Si taper coupling, including a III/V-Si taper coupler with one end to receive a laser beam where the one end has at least one surface at a non-perpendicular angle with respect to a direction of the laser beam, and where the at least one surface forms one or more tips at the one end of the III/V-Si taper coupler. The one end is positioned so that the one or more tips are outside the laser beam to reduce reflection of laser beam away from the one end of the III/V-Si taper coupler.

First claim

What is claimed is:

1. An apparatus, comprising:
a taper coupler having a mesa with a tapered end to receive a laser beam, wherein the tapered end of the taper coupler includes a surface at a non-perpendicular angle with respect to a direction of the laser beam, and a tip that extends from the surface at a perpendicular angle with respect to the direction of the laser beam; and
a waveguide coupled with the tapered end of the taper coupler at the non-perpendicular angled surface and shifted away from the tapered coupler tip, to guide the laser beam to the taper coupler, wherein the taper coupler is to receive the laser beam from the waveguide at the non-perpendicular angled surface and outside of the taper tip, such that the taper tip is absent from an optical path of the laser beam, to reduce reflection of the laser beam at the taper coupler.

2. The apparatus of claim 1 , wherein the apparatus comprises an integrated circuit.

3. The apparatus of claim 2 , wherein the waveguide includes a silicon (Si) rib, wherein the taper coupler is disposed in a shifted position relative to the Si rib.

4. The apparatus of claim 1 , wherein the taper coupler includes III-V material.

5. The apparatus of claim 1 , wherein the taper coupler is a semiconductor optical amplifier (SOA).

6. The apparatus of claim 1 , wherein the taper coupler includes indium phosphide (InP).

7. The apparatus of claim 1 , wherein the taper coupler includes a multi quantum well (MQW).

8. A method for laser coupling, comprising:
forming a taper coupler having a mesa with a tapered end with at least one surface on the tapered end provided at a non-perpendicular angle with respect to a direction of a laser beam to be received by the taper coupler, and a tip that extends from the surface at a perpendicular angle with respect to the direction of the laser beam; and
coupling the taper coupler with a waveguide to conduct a laser beam, which includes attaching the waveguide at the non-perpendicular angled surface, including shifting the waveguide away from the tapered coupler tip,
wherein the taper coupler is to receive the laser beam from the waveguide at the non-perpendicular angled surface and outside of the taper tip, such that the taper tip is absent from an optical path of the laser beam, to reduce reflection of laser beam at the taper coupler.

9. The method of claim 8 , wherein the waveguide includes a silicon (Si) rib.

10. The method of claim 8 , wherein the taper coupler includes III-V material.

11. The method of claim 8 , wherein the taper coupler is a semiconductor optical amplifier (SOA).

12. The method of claim 8 , wherein the taper coupler includes indium phosphide (InP).

13. The method of claim 8 , wherein the taper coupler includes a multiple quantum well (MQW).

14. The method of claim 8 , wherein a width of the taper coupler is about 6 μm.

15. An integrated circuit comprising:
a taper coupler having a mesa with a tapered end to receive a laser beam, wherein the tapered end of the taper coupler includes a first tapered portion with a first tip that is formed at an end of the first tapered portion, and a second tapered portion with a second tip that is formed at an end of the second tapered portion, wherein the first tapered portion is coupled with the second tapered portion via a surface disposed between the first and second tapered portions, wherein the surface is to receive the laser beam; and
a waveguide coupled with the tapered end of the taper coupler at the surface between the first and second tapered portions of the taper coupler, wherein the taper coupler is to receive the laser beam from the waveguide at the surface and outside of the first and second taper tips, such that the first and second taper tips are absent from an optical path of the laser beam, to reduce reflection of the laser beam at the taper coupler.

16. The integrated circuit of claim 15 , wherein the integrated circuit is a part of a computing device.

17. The integrated circuit of claim 16 , wherein the waveguide includes a silicon rib.

18. The integrated circuit of claim 16 , wherein the taper coupler includes III-V material.

19. The integrated circuit of claim 16 , wherein the taper coupler is a semiconductor optical amplifier (SOA).

20. The integrated circuit of claim 16 , wherein the taper coupler includes indium phosphide (InP).

Assignees

• Intel Corp

Inventors

• Lin Wenhua
• Nguyen Kimchau N

Classifications

• G02B2006/12121

  Laser · CPC title

• G02B6/1228 Primary

  Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305) · CPC title

• G02B2006/12147

  Coupler · CPC title

• G02B2006/1213

  comprising photonic band-gap structures or photonic lattices · CPC title

• G02B2006/12061

  Silicon · CPC title