Heat dissipation material

Patent metadata

Field	Value
Publication number	US-10590322-B2
Application number	US-201615579509-A
Country	US
Kind code	B2
Filing date	May 25, 2016
Priority date	Jun 30, 2015
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

First claim

The invention claimed is:

1. A heat dissipation material comprising a mesogen/silicon compound (co)polymer composition containing 100 to 1,500 parts by mass of a thermally conductive filler with respect to 100 parts by mass of a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000 to 500,000, represented by the following general formula (1):

wherein
Ar represents a mesogen group selected from structures represented by the following formulas:

a represents a positive number of 0.5 to 1, and b represents a number of 0 to 0.5, with the proviso that a and b each represent a ratio of each number of repeating units to the sum of the total repeating units in a molecule, and a+b=1, R 1 s each independently represent a C 1-8 monovalent hydrocarbon group free of aliphatic unsaturated bond, and R 2 s each independently represent a hydrogen atom, —Si(CH 3 ) 3 , —Si(CH 3 ) 2 (OH), —Si(CH 3 )2(CH═CH 2 ), or —Si(CH 3 ) 2 (CH 2 —CH═CH 2 ).

2. The heat dissipation material according to claim 1 , wherein the mesogen/silicon compound (co)polymer composition has fluidity, in a temperature range of the melting point to the melting point +50° C. of the mesogen/silicon compound (co)polymer represented by the general formula (1).

3. The heat dissipation material according to claim 1 or 2 , wherein the mesogen/silicon compound (co)polymer composition has thermal conductivity of 1 W/m·K or more.

4. A heat dissipation material comprising a mesogen/silicon compound (co)polymer composition containing 100 to 1,500 parts by mass of a thermally conductive filler with respect to 100 parts by mass of a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000 to 500,000, said mesogen/silicon compound (co)polymer being represented by the following general formula (1):

wherein
each R 1 independently represents methyl or a C 2-8 monovalent hydrocarbon group free of aliphatic unsaturated bond,
each R 2 independently represents a hydrogen atom, —Si(CH 3 ) 3 , —Si(CH 3 ) 2 (OH), —Si(CH 3 ) 2 (CH═CH 2 ), or —Si(CH 3 ) 2 (CH 2 —CH═CH 2 ),
Ar represents a mesogen group of structure represented by the following formula:

a represents a positive number of 0.5 to 1, and
b represents a number of 0 to 0.5,
with the proviso that each of a and b represents a ratio of each number of repeating units to the sum of the total repeating units in a molecule, and a+b=1.

Assignees

• Shinetsu Chemical Co

Inventors

• Uta Akira
• Ikeno Masayuki
• Matsumoto Nobuaki
• Masuda Kohei
• Sakamoto Takafumi

Classifications

• C08K3/00

  Use of inorganic substances as compounding ingredients · CPC title

• C08L83/14

  in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C08L83/10 takes precedence) · CPC title

• C08K3/22

  of metals · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title