Injection molding method and injection molding device for transparent resin molded article

Patent metadata

Field	Value
Publication number	US-10589448-B2
Application number	US-201414392280-A
Country	US
Kind code	B2
Filing date	Aug 20, 2014
Priority date	Sep 30, 2013
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

The present invention effects a reduction in production cost and increases yield of a transparent resin molded article and prevents the generation of defects such as bubbles, weld lines, and sink marks. This injection molding device ( 2 A) for a transparent resin molded article is equipped with: a die ( 3 ) for injection molding the transparent resin molded article; and a gate ( 5 ) that is provided to the peripheral edge of the die ( 3 ) and that is the inlet through which a resin material (R) is injected into the die ( 3 ). The thickness dimensions (Ta) of the die ( 3 ) are in the range of 15-25 mm, and the ratio of the diameter dimensions (D) of the gate ( 5 ) to the thickness dimensions (Ta) of the die ( 3 ) is set in the range of 1:6 to 1:3.

First claim

The invention claimed is:

1. An injection molding device for a transparent resin molded article, the injection molding device comprising:
a die having a concave shape for injection-molding the transparent resin molded article;
a resin material pool which is provided in parallel at a peripheral edge portion of the die, resin materials flowing and joining each other in an interior of the resin material pool;
a plurality of gates which are provided at a plurality of locations along a longitudinal direction of the resin material pool and inject the resin materials into the resin material pool; and
a connection passage in which the interior of the resin material pool and a lower edge portion of the die are made to continuously communicate with each other along a longitudinal direction,
wherein:
a thickness dimension of the die is in a range of 15 mm to 25 mm, and the ratio between a passage width of the connection passage and the thickness dimension of the die is set in a range of 1:6 to 1:3,
an angle of an open face of the die having the concave shape is maintained such that the plurality of gates are located at a lower portion of the die,
the resin materials injected from the plurality of gates join each other in the interior of the resin material pool, and
the resin materials joining in the interior of the resin material pool are simultaneously injected upward from a lower portion of the inside of the die along the peripheral edge portion of the die through the connection passage.

2. The injection molding device according to claim 1 , wherein the resin material pool has an inside width which is greater than the thickness dimension of the die.

3. The injection molding device according to claim 2 , wherein the passage width of the connection passage becomes larger as an arch length of a concave shape cross section of the die becomes longer.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Bessho Masahiro
• Ishikawa Naomoto
• Tanemura Tsunetoshi

Classifications

• B29K2069/00

  Use of PC, i.e. polycarbonates {or derivatives thereof}, as moulding material · CPC title

• B29C2045/0027

  Gate or gate mark locations · CPC title

• B29C45/0046

  Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity · CPC title

• B29C45/14811 Primary

  Multilayered articles (B29C45/14827 takes precedence) · CPC title

• B29K2995/0026

  Transparent · CPC title