Multi-layer substrate with integrated resonator

Patent metadata

Field	Value
Publication number	US-10587029-B2
Application number	US-201816025240-A
Country	US
Kind code	B2
Filing date	Jul 2, 2018
Priority date	Sep 7, 2017
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

The present disclosure relates to a substrate that includes a substrate body and a resonator integrated within the substrate body. The resonator includes a resonator body, a top resonator plate, and a bottom resonator plate. The resonator body extends through the substrate body from a top surface to a bottom surface of the substrate body, and is formed of at least one of a dielectric material and a magnetic material. The top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body. The top resonator plate and the bottom resonator plate are electrically conductive.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate body having a top surface and a bottom surface opposite the top surface of the substrate body; and
a resonator integrated in the substrate body; wherein:
the resonator comprises a resonator body, a top resonator plate, and a bottom resonator plate;
the resonator body extends through the substrate body from the top surface of the substrate body to the bottom surface of the substrate body;
the resonator body is formed of at least one magnetic material with a relative permeability greater than 1;
the top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body; and
the top resonator plate and the bottom resonator plate are electrically conductive.

2. The apparatus of claim 1 wherein the resonator further comprises a plurality of resonator via structures, wherein each of the plurality of resonator via structures is electrically connected to the top resonator plate and is not electrically connected to the bottom resonator plate.

3. The apparatus of claim 1 wherein the resonator further comprises an input terminal and an output terminal, which are coupled to the top resonator plate and reside over the top surface of the substrate body.

4. The apparatus of claim 1 further comprising at least one substrate via structure extending through the substrate body from the top surface of the substrate body to the bottom surface of the substrate body, wherein the at least one substrate via structure is electrically connected to the resonator.

5. The apparatus of claim 4 further comprising a heat spreader extending through the substrate body from the top surface of the substrate body to the bottom surface of the substrate body, wherein the heat spreader is electrically isolated from the at least one substrate via structure.

6. The apparatus of claim 5 wherein the heat spreader is formed of copper or Aluminum Nitride.

7. The apparatus of claim 1 wherein the substrate body comprises a plurality of dielectric layers.

8. The apparatus of claim 7 wherein each of the plurality of dielectric layers is formed from organic materials or ceramic materials.

9. The apparatus of claim 1 wherein the resonator further comprises a plurality of resonator via structures, wherein each of the plurality of resonator via structures is electrically connected to the top resonator plate and the bottom resonator plate.

10. The apparatus of claim 1 wherein the resonator body is a cuboid.

11. The apparatus of claim 1 wherein the resonator body is a cylinder.

12. An apparatus comprising:
a substrate body having a top surface and a bottom surface opposite the top surface of the substrate body; and
a resonator integrated in the substrate body, wherein:
the resonator comprises a resonator body, a top resonator plate, and a bottom resonator plate;
the resonator body comprises a plurality of resonator layers and extends through the substrate body from the top surface of the substrate body to the bottom surface of the substrate body, wherein each of the plurality of resonator layers is configured to provide a different resonant frequency;
the resonator body is formed of at least one of a dielectric material and a magnetic material;
the top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body; and
the top resonator plate and the bottom resonator plate are electrically conductive.

13. The apparatus of claim 12 wherein each of the plurality of resonator layers is formed of a different magnetic material.

14. The apparatus of claim 12 wherein each of the plurality of resonator layers is a cuboid.

15. The apparatus of claim 12 wherein each of the plurality of resonator layers is a cylinder.

16. The apparatus of claim 12 wherein each of the plurality of resonator layers has a different size.

17. The apparatus of claim 16 wherein each of the plurality of resonator layers has a same height and a different plane size.

18. The apparatus of claim 16 wherein each of the plurality of resonator layers has a same plane size and a different height.

19. The apparatus of claim 16 wherein the plurality of resonator layers is formed of a same dielectric or magnetic material.

20. The apparatus of claim 12 wherein the resonator body has a trapezoidal configuration in a vertical direction.

21. The apparatus of claim 12 wherein the resonator body has a double-trapezoidal configuration in a vertical direction.

22. The apparatus of claim 12 wherein each of the plurality of resonator layers is formed of a different dielectric material.

Assignees

• Qorvo Us Inc

Inventors

• Dekosky Jeffrey
• Nair Deepukumar M
• Knapp Scott M
• Railkar Tarak A
• Carastro Lawrence A
• Kraus Timothy G

Classifications

• H03H2001/0057

  comprising magnetic material · CPC title

• H01P1/20309

  with dielectric resonator · CPC title

• H01P7/105 Primary

  Multimode resonators · CPC title

• H03H1/00

  Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title