Electronic component

Patent metadata

Field	Value
Publication number	US-10586647-B2
Application number	US-201715708231-A
Country	US
Kind code	B2
Filing date	Sep 19, 2017
Priority date	Sep 26, 2016
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

An electronic component includes an element assembly that includes a magnetic layer and a non-magnetic layer and a coil that is provided within the element assembly and that is wound in a spiral form. The coil includes a plurality of laminated layers of coil wires. The non-magnetic layer includes an inter-wire non-magnetic layer located between at least one pair of the coil wires that are adjacent in a lamination direction and a radial direction non-magnetic layer located on at least one of an outer side portion and an inner side portion in a radial direction of the coil. The radial direction non-magnetic layer is spaced apart from the inter-wire non-magnetic layer.

First claim

What is claimed is:

1. An electronic component, comprising:
an element assembly that includes a magnetic layer and a non-magnetic layer; and
a coil that is provided within the element assembly and that is wound in a spiral form,
wherein the coil includes a plurality of laminated layers of coil wires,
wherein the non-magnetic layer includes an inter-wire non-magnetic layer located between at least one pair of the coil wires that are adjacent in a lamination direction, and a radial direction non-magnetic layer located on at least one of an outer side portion and an inner side portion in a radial direction of the coil,
wherein the radial direction non-magnetic layer is spaced apart from the inter-wire non-magnetic layer,
wherein the coil wire is constituted by three or more laminated layers of coil conductor layers, and
wherein the radial direction non-magnetic layer is disposed in a plane in which, among the three or more coil conductor layers, a coil conductor layer located between coil conductor layers on both sides in a lamination direction is disposed.

2. The electronic component according to claim 1 , wherein a thickness of the inter-wire non-magnetic layer is less than a thickness of the radial direction non-magnetic layer.

3. The electronic component according to claim 1 , wherein the inter-wire non-magnetic layer is disposed between every pair of the coil wires that are adjacent in the lamination direction.

4. The electronic component according to claim 1 , wherein a side surface of the coil wire includes a concavity and a convexity, and the concavity and the convexity are formed in at least one of the magnetic layer and the radial direction non-magnetic layer.

5. The electronic component according to claim 1 , wherein the thickness of the coil wire is greater than the thickness of the radial direction non-magnetic layer.

6. The electronic component according to claim 5 , wherein the radial direction non-magnetic layer is located in the middle in the thickness direction of the coil wire.

7. The electronic component according to claim 1 , wherein the radial direction non-magnetic layer includes a plurality of layers.

8. The electronic component according to claim 7 , wherein the radial direction non-magnetic layers that are adjacent in the lamination direction are in contact with each other.

9. The electronic component according to claim 1 , wherein the inter-wire non-magnetic layer includes a plurality of layers.

10. The electronic component according to claim 9 , wherein a side surface of the plurality of inter-wire non-magnetic layers includes a concavity and a convexity, and the concavity and the convexity are formed in the magnetic layer.

Assignees

• Murata Manufacturing Co

Inventors

• Takeda Yasushi

Classifications

• H01F2017/008

  Electric or magnetic shielding of printed inductances · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F27/323

  Insulation between winding turns, between winding layers · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F27/2847

  Sheets; Strips (H01F27/2866 takes precedence) · CPC title