Photosensitive resin composition

Patent metadata

Field	Value
Publication number	US-10584205-B2
Application number	US-201615557623-A
Country	US
Kind code	B2
Filing date	Mar 18, 2016
Priority date	Mar 24, 2015
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.

First claim

The invention claimed is:

1. A photosensitive resin composition comprising an alkali-soluble resin having an organic group derived from an aliphatic diamine,
wherein the alkali-soluble resin having the organic group derived from the aliphatic diamine is (A) an alkali-soluble polyamide represented by the general formula (1):

wherein, in the general formula (1):
X 1 and X 2 each represents a bi- to deca-valent organic group;
Y 1 represents a bi- to tetravalent organic group;
Y 2 has a structural unit represented by the general formula (2):
* R 3 —O a R 4 —O b R 5 —O c —R 6 —*  (2)

wherein, in the general formula (2), R 3 to R 6 each independently represents a C 2 -C 10 alkylene group;
a, b, and c each are integers satisfying 0≤a≤20, 0≤b≤20, and 0≤c≤20;
the repeating units are arranged in blocks or randomly; and
“*” in the general formula (2) represents a chemical bond;

R 1 and R 2 each represents a hydrogen or a C 1 -C 20 organic group;
p, q, r, s, and t are integers satisfying 0≤p≤4, 0≤q≤4, 0≤r≤2, 0≤s≤4, and 0≤t≤4;
when p, q, r, s, or t is 0, each group represents a hydrogen atom; and
n 1 and n 2 are integers satisfying 1≤n 1 ≤500, 1≤n 2 ≤500, and 0.05≤n 1 /(n 1 +n 2 )<1; and
wherein Y 2 in the general formula (1) has a molecular weight of from not less than 900 to not more than 2,000.

2. The photosensitive resin composition according to claim 1 , comprising (A) the alkali-soluble polyamide represented by the general formula (1), (B) a compound that generates an acid by light, and (C) a thermal crosslinking agent.

3. The photosensitive resin composition according to claim 1 , further comprising (D) a compound represented by the general formula (3):

wherein, in the general formula (3), R 7 to R 9 represent an O atom, a S atom, or a N atom;
at least one of R 7 to R 9 represents a S atom;
l is 0 or 1;
m and n represents an integer of 0 to 2; and
R 10 to R 12 each independently represent a hydrogen atom or a C 1 -C 20 organic group.

4. A photosensitive sheet formed of the photosensitive resin composition according to claim 1 .

5. A method for producing a photosensitive sheet, comprising the step of coating a base material with the photosensitive resin composition according to claim 1 and drying the composition.

6. A cured film obtained by curing the photosensitive resin composition according to claim 1 .

7. A cured film obtained by curing the photosensitive sheet according to claim 4 .

8. An interlayer dielectric film or a semiconductor protective film comprising the cured film according to claim 6 .

9. A method for producing a cured relief pattern, comprising the steps of:
coating a substrate with the photosensitive resin composition according to claim 1 and drying the composition to form a photosensitive resin film;
exposing the photosensitive resin film to light through a mask;
developing the photosensitive resin film by dissolving or removing the exposed parts using an alkaline solution; and
heating the developed photosensitive resin film.

10. A method for producing a semiconductor electronic component or a semiconductor device, comprising the steps of:
laminating the photosensitive sheet according to claim 4 on a substrate;
then carrying out a UV-irradiation step and a developing step to form a pattern thereon; and
further heating the resultant to form a relief pattern layer of a cured film.

11. A semiconductor electronic component or a semiconductor device comprising the relief pattern layer of the cured film according to claim 6 .

12. The semiconductor electronic component or the semiconductor device according to claim 11 , wherein the cured film is disposed as an interlayer dielectric film between rewiring layers.

13. The semiconductor electronic component or the semiconductor device according to claim 12 , wherein layers each including the rewiring layer and interlayer dielectric film are disposed one on another two- to ten-fold.

14. The semiconductor electronic component or the semiconductor device, wherein the cured film according to claim 6 is disposed as an interlayer dielectric film covering two or more adjacent substrates made of different kinds of materials.

Assignees

• Toray Industries

Inventors

• Shoji Yu
• Masuda Yuki
• Koyama Yutaro
• Okuda Ryoji

Classifications

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• C08K5/38

  Thiocarbonic acids; Derivatives thereof, e.g. xanthates {; i.e. compounds containing -X-C(=X)- groups, X being oxygen or sulfur, at least one X being sulfur} · CPC title

• C08K5/39

  Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• C08G69/26 Primary

  derived from polyamines and polycarboxylic acids · CPC title