Photosensitive resin printing plate precursor and method of manufacturing printing plate

Patent metadata

Field	Value
Publication number	US-10583679-B2
Application number	US-201615755937-A
Country	US
Kind code	B2
Filing date	Sep 2, 2016
Priority date	Sep 3, 2015
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

A photosensitive resin printing plate precursor includes at least a substrate and a photosensitive resin layer, the photosensitive resin layer containing: (A) a partially saponified polyvinyl acetate, (B) a polyamide having basic nitrogen, (C) a compound having an ethylenic double bond, and (D) a photopolymerization initiator; the photosensitive resin layer including at least an underlayer and a printing surface layer; the substrate, the underlayer, and the printing surface layer being included in this order; and the photosensitive resin layer containing, as the partially saponified polyvinyl acetate (A), those (A1) having an average polymerization degree of 1,200 to 2,600 in the printing surface layer and those (A2) having an average polymerization degree of 400 to 800 in the underlayer.

First claim

The invention claimed is:

1. A photosensitive resin printing plate precursor comprising at least a substrate and a photosensitive resin layer, the photosensitive resin layer containing:
(A) a partially saponified polyvinyl acetate,
(B) a polyamide having basic nitrogen,
(C) a compound having an ethylenic double bond, and
(D) a photopolymerization initiator;
the photosensitive resin layer including at least an underlayer and a printing surface layer;
the substrate, the underlayer, and the printing surface layer being included in this order; and
the photosensitive resin layer containing, as the partially saponified polyvinyl acetate (A), a compound (A1) having an average polymerization degree of 1,200 to 2,600 and a polymer (A1-1) having an average polymerization degree of 400 to 1,000 in the printing surface layer, and a compound (A2) having an average polymerization degree of 400 to 800 in the underlayer.

2. The photosensitive resin printing plate precursor according to claim 1 , wherein the compound (C) having an ethylenic double bond has a 5- to 7-membered ring, and the 5- to 7-membered ring is a heterocyclic ring.

3. The photosensitive resin printing plate precursor according to claim 1 , wherein the compound (C) having an ethylenic double bond has a 5- to 7-membered ring and has a number average molecular weight of 300 or less, and also has one or more functional groups selected from a hydroxyl group, a carboxyl group, and an amino group.

4. A method of manufacturing a printing plate from the photosensitive resin printing plate precursor according to claim 1 , the method comprising cross-linking the photosensitive resin printing plate precursor to obtain a cross-linked printing plate precursor; and applying patterned laser radiation to the cross-linked plate precursor to engrave a resin layer to thus obtain a relief.

5. The method according to claim 4 , further comprising rinsing the relief with water or a liquid containing water.

6. A method of manufacturing a printing plate from the photosensitive resin printing plate precursor according to claim 2 , the method comprising cross-linking the photosensitive resin printing plate precursor to obtain a cross-linked printing plate precursor; and applying patterned laser radiation to the cross-linked plate precursor to engrave a resin layer to thus obtain a relief.

7. A method of manufacturing a printing plate from the photosensitive resin printing plate precursor according to claim 3 , the method comprising cross-linking the photosensitive resin printing plate precursor to obtain a cross-linked printing plate precursor; and applying patterned laser radiation to the cross-linked plate precursor to engrave a resin layer to thus obtain a relief.

8. The method according to claim 6 , further comprising rinsing the relief with water or a liquid containing water.

9. The method according to claim 7 , further comprising rinsing the relief with water or a liquid containing water.

Assignees

• Toray Industries

Inventors

• Kawahara Hiroyuki
• Tachi Norihito
• Nagano Kei

Classifications

• G03F7/037

  the binders being polyamides or polyimides · CPC title

• G03F7/095

  having more than one photosensitive layer (G03F7/075 takes precedence) · CPC title

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• G03F7/00

  Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

• G03F7/0955

  one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds · CPC title