Resin-molded component

US10583597B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10583597-B2
Application numberUS-201816115856-A
CountryUS
Kind codeB2
Filing dateAug 29, 2018
Priority dateDec 2, 2015
Publication dateMar 10, 2020
Grant dateMar 10, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of the laminated portion is located at least on opposite sides across the exposed portion. A one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and the other-side surface thereof is configured as a portion of the inner surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin-molded component which is molded by filling a second molten resin in a state where a first molten resin is filled in a cavity of a mold and then cooled, the resin-molded component comprising: a first molding part molded by solidifying the first molten resin; and a second molding part molded by solidifying the second molten resin, wherein a portion of the first molding part and a portion of the second molding part are laminated in a direction connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion, an exposed portion is provided at a sharp corner having an acute angle of the second molding part or in a vicinity of the sharp corner of the second molding part, the area of a one-side surface of the exposed portion is smaller than the area of a one-side surface of the first molding part configured as a portion of the outer surface, portions of the laminated portion are located only on opposite sides across the exposed portion, and the one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and an other-side surface thereof is configured as a portion of the inner surface. 2. The resin-molded component according to claim 1 , wherein the exposed portion faces toward a portion of the second molding part that is separate from the laminated portion. 3. The resin-molded component according to claim 1 , wherein the first molding part is transparent, and the second molding part is colored black. 4. The resin-molded component according to claim 1 , further comprising: a cover part comprising a front surface and a peripheral side surface; and a flange extending from a bottom edge of the peripheral side surface, wherein the front surface is formed by the first molding part molded by solidifying the first molten resin, wherein the flange is formed by the second molding part molded by solidifying the second molten resin, wherein the portion of the first molding part and the portion of the second molding part that are laminated in the direction connecting the outer surface and the inner surface of the resin-molded component to provide the laminated portion also form the peripheral side surface, wherein the exposed portion of the second molding part is disposed on the peripheral side surface, and the one-side surface of exposed portion faces towards the flange. 5. A resin-molded component comprising: a cover part comprising a front surface and a peripheral side surface; and a flange extending from a bottom edge of the peripheral side surface, wherein the front surface is formed by a first resin, the flange is formed by a second resin, the second resin being a different material than the first resin, the peripheral side surface is formed by a laminate of the first resin disposed on top of the second resin, a portion of the second resin forming a part of the peripheral side surface protrudes with respect to the first resin and is exposed to form an exposed portion, the exposed portion is located at a sharp corner of the second resin having an acute angle or in a vicinity of the sharp corner, an area of the exposed portion is smaller than an area of the first resin forming an outer surface of the resin-molded component, portions of the laminate are located on opposite sides across the exposed portion, the exposed portion of the second resin forms a portion of the outer surface of the resin-molded component, and an opposite side of the exposed portion forms a portion of an inner surface of the resin-molded component, and the exposed portion faces towards the flange.

Assignees

Inventors

Classifications

  • with an insert · CPC title

  • Coloured · CPC title

  • Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity · CPC title

  • Opaque · CPC title

  • Use of polyesters {or derivatives thereof}, as moulding material · CPC title

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Frequently asked questions

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What does patent US10583597B2 cover?
A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of th…
Who is the assignee on this patent?
Koito Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/1671. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).