Method of transfer printing and articles manufactured therefrom

US10580679B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10580679-B2
Application numberUS-201615762262-A
CountryUS
Kind codeB2
Filing dateSep 22, 2016
Priority dateSep 22, 2015
Publication dateMar 3, 2020
Grant dateMar 3, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is a method comprising disposing on a first substrate a two-dimensional exfoliatable material; patterning an exfoliatable material using a photoresist in a manner such that a portion of the photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; disposing a polymer layer on the two-dimensional exfoliatable material to form a printing block; contacting a substrate with the printing block; and removing the polymer layer and the photoresist from the printing block to leave behind the patterned exfoliatable material on the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: patterning a two-dimensional exfoliatable material using a first photoresist in a manner such that a portion of the first photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; patterning the two-dimensional exfoliatable material using a second photoresist in a manner such that a portion of the second photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; disposing a polymer layer on the two-dimensional exfoliatable material to form a printing block; contacting a substrate with the printing block; and removing the polymer layer, the first photoresist and the second photoresist from the printing block to leave behind the patterned exfoliatable material on the substrate. 2. The method of claim 1 , where the two-dimensional exfoliatable material comprises graphene, graphite, molybdenum disulfide, graphite intercalation compounds, clays, black phosphorus, or a combination thereof. 3. The method of claim 1 , where the first photoresist is a polymer that is a thermoplastic polymer or is a crosslinked polymer. 4. The method of claim 3 , where the crosslinked polymer is obtained by crosslinking an acrylate or a silane. 5. The method of claim 3 , where the thermoplastic polymer is a polymethylmethacrylate. 6. The method of claim 1 , where the patterning of the exfoliatable material using a photoresist is accomplished via e-beam lithography and reactive ion etching. 7. The method of claim 1 , where the polymer layer comprises a polyvinylalcohol. 8. The method of claim 1 , where the disposing of the polymer layer on the exfoliatable material to form a printing block is accomplished via spin casting. 9. The method of claim 1 , where the exfoliatable material has a cross-sectional area measured parallel to a substrate of up to 10 6 square micrometers and a thicknesses of at least 5 nanometers. 10. The method of claim 1 , wherein the removing of the polymer layer, the first photoresist and the second photoresist from the printing block are accomplished via dissolution and/or degradation. 11. An article comprising: a patterned exfoliatable material; wherein the patterned two-dimensional exfoliatable material is obtained by a method comprising: patterning a two-dimensional exfoliatable material using a first photoresist in a manner such that a portion of the photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; patterning the two-dimensional exfoliatable material using a second photoresist in a manner such that a portion of the second photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; disposing a polymer layer on the two-dimensional exfoliatable material to form a printing block; contacting a substrate with the printing block; and removing the polymer layer, the first photoresist and the second photoresist from the printing block to leave behind the patterned exfoliatable material on the substrate.

Assignees

Inventors

Classifications

  • Selective deposition, e.g. printing or microcontact printing · CPC title

  • pixel · CPC title

  • Lamination or delamination methods or apparatus for photolitographic photosensitive material · CPC title

  • Treatment after imagewise removal, e.g. baking · CPC title

  • of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title

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Frequently asked questions

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What does patent US10580679B2 cover?
Disclosed herein is a method comprising disposing on a first substrate a two-dimensional exfoliatable material; patterning an exfoliatable material using a photoresist in a manner such that a portion of the photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; disposing a polymer layer on the two-dimensional exfoliatable material to form a printing …
Who is the assignee on this patent?
Univ Massachusetts
What technology area does this patent fall under?
Primary CPC classification B81C1/00373. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).