Chromium-free thermal spray composition, method, and apparatus

Patent metadata

Field	Value
Publication number	US-10577685-B2
Application number	US-201815892451-A
Country	US
Kind code	B2
Filing date	Feb 9, 2018
Priority date	Aug 28, 2013
Publication date	Mar 3, 2020
Grant date	Mar 3, 2020

Abstract

A composition, method for depositing the composition on a downhole component, and a downhole tool. The composition includes about 0.25 wt % to about 1.25 wt % of carbon, about 1.0 wt % to about 3.5 wt % of manganese, about 0.1 wt % to about 1.4 wt % of silicon, about 1.0 wt % to about 3.0 wt % of nickel, about 0.0 to about 2.0 wt % of molybdenum, about 0.7 wt % to about 2.5 wt % of aluminum, about 1.0 wt % to about 2.7 wt % of vanadium, about 1.5 wt % to about 3.0 wt % of titanium, about 0.0 wt % to about 6.0 wt % of niobium, about 3.5 wt % to about 5.5 wt % of boron, about 0.0 wt % to about 10.0 wt % tungsten, and a balance of iron.

First claim

What is claimed is:

1. A composition for applying to a substrate, the composition comprising:
about 0.25 wt % to about 1.25 wt % of carbon;
about 1.0 wt % to about 3.5 wt % of manganese;
about 0.1 wt % to about 1.4 wt % of silicon;
about 1.0 wt % to about 3.0 wt % of nickel;
0.0 to about 2.0 wt % of molybdenum;
about 0.7 wt % to about 2.5 wt % of aluminum;
about 1.0 wt % to about 2.7 wt % of vanadium;
about 1.5 wt % to about 3.0 wt % of titanium;
0.0 wt % to about 6.0 wt % of niobium;
about 3.5 wt % to about 5.5 wt % of boron;
0.0 wt % to about 10.0 wt % tungsten; and
a balance of iron.

2. The composition of claim 1 , wherein the composition is chromium-free.

3. The composition of claim 1 , wherein the composition comprises:
about 0.5 wt % to about 1.0 wt % of carbon;
about 1.5 wt % to about 2.5 wt % of manganese;
about 0.3 wt % to about 1.0 wt % of silicon;
about 1.5 wt % to about 2.5 wt % of nickel;
0.0 wt % to about 0.5 wt % of molybdenum;
about 1.5 wt % to about 2.0 wt % of aluminum;
about 1.5 wt % to about 2.1 wt % of vanadium;
about 1.8 wt % to about 2.8 wt % of titanium;
0.0 wt % to about 4.0 wt % of niobium;
about 4.0 wt % to about 5.0 wt % of boron;
about 0.0 wt % to about 3.0 wt % of tungsten; and
the balance being iron.

4. The composition of claim 1 , wherein the balance comprises trace amounts of sulfur and phosphorous.

5. The composition of claim 1 , wherein the composition has a Rockwell Hardness C of between about 50 and about 65.

6. The composition of claim 1 , wherein the composition has a wear rate of between about 0.20 grams per 6,000 rotations and between about 0.40 grams per 6,000 rotations in a Dry Sand Rubber Wheel Test.

7. A method for applying a composition to a substrate provided by a downhole component, comprising:
feeding one or more wires into a sprayer, wherein the one or more wires provide the composition;
melting a portion of the one or more wires by applying an electrical current to the one or more wires, to melt the material in the portion;
feeding a gas to the sprayer, such that the composition is projected through a nozzle of the sprayer; and
depositing the composition onto the downhole component, such that the composition solidifies and forms into a layer of material,
wherein the composition, at least prior to melting, comprises:
about 0.25 wt % to about 1.25 wt % of carbon;
about 1.0 wt % to about 3.5 wt % of manganese;
about 0.1 wt % to about 1.4 wt % of silicon;
about 1.0 wt % to about 3.0 wt % of nickel;
0.0 to about 2.0 wt % of molybdenum;
about 0.7 wt % to about 2.5 wt % of aluminum;
about 1.0 wt % to about 2.7 wt % of vanadium;
about 1.5 wt % to about 3.0 wt % of titanium;
0.0 wt % to about 6.0 wt % of niobium;
about 3.5 wt % to about 5.5 wt % of boron;
0.0 wt % to about 10.0 wt % tungsten; and
a balance of iron.

8. The method of claim 7 , wherein depositing the composition on the downhole component comprises raising a temperature of the downhole component to less than a tempering temperature of the downhole component.

9. The method of claim 7 , wherein the downhole component comprises a tubular.

10. The method of claim 9 , wherein the layer of material defines a ramp shape and is disposed proximal to an end of the tubular.

11. The method of claim 9 , wherein the layer of the material forms a protrusion extending outwards from the tubular.

12. The method of claim 11 , wherein the protrusion extends between about 0.10 inches and about 3.0 inches outward from the tubular.

13. The method of claim 11 , wherein the protrusion comprises at least a portion of a stop collar configured to engage a downhole tool.

14. The method of claim 11 , wherein the protrusion comprises at least a portion of a downhole tool.

15. The method of claim 14 , wherein the downhole tool comprises a centralizer, and wherein the at least a portion of the downhole tool comprises a blade of the centralizer.

16. The method of claim 7 , wherein the downhole component comprises a downhole tool, wherein the layer of the material comprises a wear-resistant coating on at least a portion of the downhole tool.

17. The method of claim 7 , wherein the one or more wires comprise a first wire and a second wire, and wherein melting the one or more wires comprises applying a voltage difference between the first wire and the second wire, such that the electrical current arcs therebetween.

18. The method of claim 7 , wherein the material comprises:
about 0.5 wt % to about 1.0 wt % of carbon;
about 1.5 wt % to about 2.5 wt % of manganese;
about 0.3 wt % to about 1.0 wt % of silicon;
about 1.5 wt % to about 2.5 wt % of nickel;
0.0 wt % to about 0.5 wt % of molybdenum;
about 1.5 wt % to about 2.0 wt % of aluminum;
about 1.5 wt % to about 2.1 wt % of vanadium;
about 1.8 wt % to about 2.8 wt % of titanium;
0.0 wt % to about 4.0 wt % of niobium;
about 4.0 wt % to about 5.0 wt % of boron;
0.0 wt % to about 3.0 wt % of tungsten; and
the balance being iron.

19. The method of claim 18 , wherein the material is chromium-free.

Assignees

• Innovex Downhole Solutions Inc

Inventors

• Scott Joe Lynn
• Gammage John H

Classifications

• C22C38/44

  with molybdenum or tungsten · CPC title

• C22C38/02

  containing silicon · CPC title

• C23C4/08 Primary

  containing only metal elements (C23C4/073 takes precedence) · CPC title

• C22C38/48

  with niobium or tantalum · CPC title

• C22C38/42

  with copper · CPC title