Resin composite

US10576709B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10576709-B2
Application numberUS-201515500735-A
CountryUS
Kind codeB2
Filing dateSep 30, 2015
Priority dateSep 30, 2014
Publication dateMar 3, 2020
Grant dateMar 3, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The resin composite of the present invention has a polyamide-based resin expanded sheet, and a fiber-reinforced resin layer integrally laminated on a surface of the polyamide-based resin expanded sheet.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin composite comprising: a polyamide-based resin expanded sheet; and a fiber-reinforced resin layer laminated on a surface of said polyamide-based resin expanded sheet, wherein: said fiber-reinforced resin layer and said polyamide-based resin expanded sheet are integrated with each other, said polyamide-based resin expanded sheet is an extrusion-expanded sheet having an average cell diameter of 10 μm or more and 1,000 μm or less, a tensile elongation at break of 80% or more and 150% or less, and a contact angle of 30° or more and 90° or less, said polyamide-based resin expanded sheet comprises a crosslinking agent in an amount of 0.05% by mass or more and 10% by mass or less, and a crystallization degree of the polyamide-based resin contained in the polyamide-based resin expanded sheet is 10% or more. 2. The resin composite according to claim 1 , wherein said polyamide-based resin expanded sheet has a thickness of 0.1 mm or more and 5 mm or less. 3. The resin composite according to claim 1 , wherein said polyamide-based resin expanded sheet has an apparent density of 0.1 g/cm 3 or more and 1.1 g/cm 3 or less. 4. The resin composite according to claim 1 , wherein a content of a reinforcing fiber in said fiber-reinforcing resin layer is 30% by mass or more and 80% by mass or less. 5. The resin composite according to claim 1 , which has an apparent density of 0.3 g/cm 3 or more and 1.5 g/cm 3 or less.

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Frequently asked questions

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What does patent US10576709B2 cover?
The resin composite of the present invention has a polyamide-based resin expanded sheet, and a fiber-reinforced resin layer integrally laminated on a surface of the polyamide-based resin expanded sheet.
Who is the assignee on this patent?
Sekisui Plastics
What technology area does this patent fall under?
Primary CPC classification B32B37/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).