Board edge connector

Patent metadata

Field	Value
Publication number	US-10575413-B2
Application number	US-201816119054-A
Country	US
Kind code	B2
Filing date	Aug 31, 2018
Priority date	Dec 14, 2016
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.

First claim

What is claimed is:

1. An apparatus, comprising:
a tie bar on an inner layer of a printed circuit board (PCB); and
a contact on the outer layer, wherein the contact is gold-plated and the tie bar is electrically disconnected from the contact by an opening between the inner layer and the outer layer.

2. The apparatus of claim 1 , wherein the apparatus is configured to be used on an integral board edge connector.

3. The apparatus of claim 1 , wherein the contact is a serial advanced technology attachment (SATA) contact.

4. The apparatus of claim 1 , wherein the contact electrically couples a solid state drive (SSD) to a computing system.

5. The apparatus of claim 1 , wherein the contact is electroplated.

6. The apparatus of claim 1 , wherein the contact is a particular distance from an edge of the PCB.

7. The apparatus of claim 6 , wherein signal integrity associated with the contact is approximated equal to signal integrity associated with a solder down connector contact.

8. An apparatus, comprising:
a tie bar;
a trace; and
a contact, wherein the contact is coupled to the trace, the contact is gold-plated, and the tie bar is electrically disconnected from the contact by an opening between an inner layer and an outer layer of a printed circuit board (PCB).

9. The apparatus of claim 8 , wherein the contact is a particular distance from an edge of the apparatus as defined by SATA input/output (I/O) standard.

10. The apparatus of claim 8 , wherein the contact is shorter than other contacts on the PCB.

11. The apparatus of claim 8 , wherein the contacts are electroplated.

12. The apparatus of claim 8 , wherein the contact is on the outer layer of the PCB.

13. The apparatus of claim 8 , wherein the tie bar is on the inner layer of the PCB.

14. An apparatus, comprising:
a tie bar on an inner layer of a printed circuit board (PCB), wherein a first end of the tie bar is adjacent to an opening in the PCB that extends between the inner layer and an outer layer of the PCB;
a trace on the outer layer of the PCB; and
a contact on the outer layer, wherein the contact is coupled to the trace, the contact is gold-plated, and the tie bar is electrically disconnected from the contact by an opening between the inner layer and the outer layer.

15. The apparatus of claim 14 , wherein the opening is formed by drilling.

16. The apparatus of claim 14 , wherein the contact is a particular distance from an edge of the PCB.

17. The apparatus of claim 14 , wherein a second end of the tie bar is closer than the contact to an edge of the PCB.

Assignees

• Micron Technology Inc

Inventors

• Smith Kurt B

Classifications

• H01R12/721 Primary

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H05K3/423 Primary

  characterised by electroplating method · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K1/114

  Pad being close to via, but not surrounding the via · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title